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位置：首页 > IC中文资料第1023页 > C2012

C2012价格

参考价格：￥0.3498

型号：C2012C0G1E103J060AA 品牌：TDK 备注：这里有C2012多少钱，2024年最近7天走势，今日出价，今日竞价，C2012批发/采购报价，C2012行情走势销售排行榜，C2012报价。
型号 功能描述 生产厂家&企业 LOGO 操作
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MultilayerCeramicChipCapacitorsGeneraluse

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORSCommercialgrade,general(Upto75V)

■SERIESOVERVIEW GeneraltypeCseriesisasurface-mountedcomponent,whichmultilayerdielectricsandinnerelectrodesarestackedalternately.Themonolithic structureensuressuperiormechanicalstrengthandhighreliability.Also,outstandingfrequencycharacteristicssuchaslowESRandlo

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

HEYCo-molded™LiquidTightBreak-ThruPlugs

文件：100.58 Kbytes Page：1 Pages

Heyco

Heyco

Heyco
C2012

包装：盒 描述：LTBP 625-063 BLACK 电缆，电线 - 管理 衬套，索环

Heyco Products Corporation

Heyco Products Corporation

Heyco Products Corporation
C2012

FeetsofStrength

文件：116.51 Kbytes Page：1 Pages

Heyco

Heyco

Heyco
C2012

MULTILAYERCERAMICCHIPCAPACITORS

文件：2.57112 Mbytes Page：55 Pages

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

文件：2.57364 Mbytes Page：55 Pages

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

HEYCo-moldedLiquidTightBreak-ThruPlugs

文件：357.4 Kbytes Page：1 Pages

etc2List of Unclassifed Manufacturers

etc2未分类制造商

etc2
C2012

MultilayerCeramicChipCapacitors

文件：173.01 Kbytes Page：31 Pages

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

MULTILAYERCERAMICCHIPCAPACITORS

文件：2.57186 Mbytes Page：55 Pages

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012

CAPACITORS

文件：448.8 Kbytes Page：7 Pages

etc2List of Unclassifed Manufacturers

etc2未分类制造商

etc2
C2012C0G1A010B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1A0R5B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1A100B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1E103J060AA

MultilayerCeramicChipCapacitors

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1E153J085AA

MultilayerCeramicChipCapacitors

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1E223J125AA

MultilayerCeramicChipCapacitors

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1E333J125AA

MultilayerCeramicChipCapacitors

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H010B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H0R5B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H100B050A

MultilayerCeramicChipCapacitors

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H101K

ADS78/8505EVMUsersGuide

Features ·Full-FeaturedEvaluationBoardfortheADS7804,ADS7805orADS8505,parallelAnalogtoDigital Converters ·IndustryStandard±10VAnalogInputRange ·Builtinreference ·ParallelInterfacewith3-stateoutputdrivers ·Compatiblewiththe5-6KInterfaceBoardforusewithava

TITexas Instruments

德州仪器美国德州仪器公司

TI
C2012C0G1H102J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H102K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H103J

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H103J060AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H103K060AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H122J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H122K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H152J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H152K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H153J085AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H153K085AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H182J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H182K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H222J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H222J085AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H222K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H223J125AA

TDKintroducesanewglobalcatalogpartnumberforitsMultilayerCeramicCapacitorproducts

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H223J125AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H223K125AA

MULTILAYERCERAMICCHIPCAPACITORS

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H272J

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H272J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H272K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H332J

CeramicCapacitorsForGeneralUseSMD

Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H332J060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H332J125AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK
C2012C0G1H332K060AA

MULTILAYERCERAMICCHIPCAPACITORS

CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency

TDKTDK Corporation

东电化（中国）投资有限公司

TDK

C2012产品属性

  • 类型

    描述

  • 型号

    C2012

  • 功能描述

    电缆固定件和配件 LTBP 625-063 1.03 X .32

  • RoHS

    否

  • 制造商

    Heyco

  • 类型

    Cable Grips, Liquid Tight

  • 材料

    Nylon

  • 颜色

    Black

  • 安装方法

    Cable

  • 最大光束直径

    11.4 mm

C2012供应商更多...

更新时间：2024-4-25 13:10:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
深圳市向鸿伟业电子有限公司
C2012X7R1H333KT
TDK
SMD0805
3
4485
原装现货!低价支持实单!贵了给接受价格!
询价
深圳市天成基业科技有限公司
C2012Y5V1A106ZT
TDK
21+
SMD
836
原装现货
询价
深圳市嘉合泰电子有限公司
C2012Z5U1H684MT000N
NEW2022+
SMD
8650000
一级代理 正品保证 渠道价优一站式配套
询价
柒号芯城电子商务(深圳)有限公司
C2012X7R224KET
WALSIN
2023+
SMD
700000
柒号芯城跟原厂的距离只有0.07公分
询价
深圳兆威电子有限公司
C2012Y5V1E225MT
TDK/东电化
23+
SMD
90000
一定原装深圳现货
询价
深圳市慧业盛科技有限公司
C2012C0G1H103JT0Y0N
TDK
22+
N/A
190299
全新原装
询价
深圳市安富世纪电子有限公司
C2012Y5V1E105ZT000A
TDK
21+
0603
50000
全新原装正品现货,支持订货
询价
深圳市诺美思科技有限公司
C2012X7R1E105KT000NIC
TDK/东电化
22+/23+
SMD
9800
原装进口公司现货假一赔百
询价
深圳市赛特兴科技有限公司
C2012X7R1V475KT000E
TDK/东电化
19+
0805
14000
正规渠道,只有原装!
询价
深圳市凌旭科技有限公司
C2012X5R226MCP
DARFON
2016+
SMD
3000
只做原装,假一罚十,公司可开17%增值税发票!
询价

C2012芯片相关品牌

  • ABRACON
  • AD
  • HAMMOND
  • ICST
  • MOLEX7
  • Motorola
  • NIC
  • Sipex
  • STMICROELECTRONICS
  • SUNMATE
  • Temic
  • TRACOPOWER

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