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C2012价格

参考价格：￥0.3498

型号：C2012C0G1E103J060AA 品牌：TDK 备注：这里有C2012多少钱，2025年最近7天走势，今日出价，今日竞价，C2012批发/采购报价，C2012行情走势销售排行榜，C2012报价。

型号	功能描述	生产厂家企业	LOGO
C2012	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012	Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012	Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012	Multilayer Ceramic Chip Capacitors General use Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS Commercial grade, general (Up to 75V) ■SERIES OVERVIEW General type C series is a surface-mounted component, which multilayer dielectrics and inner electrodes are stacked alternately. The monolithic structure ensures superior mechanical strength and high reliability. Also, outstanding frequency characteristics such as low ESR and lo	TDK 东电化	TDK
C2012	HEYCo-molded™ Liquid Tight Break-Thru Plugs 文件：100.58 Kbytes Page：1 Pages	Heyco	Heyco
C2012	Feets of Strength 文件：116.51 Kbytes Page：1 Pages	Heyco	Heyco
C2012	HEYCo-molded™ Liquid Tight Break-Thru Plugs 文件：99.58 Kbytes Page：1 Pages	Heyco	Heyco
C2012	包装：盒描述：LTBP 625-063 BLACK 电缆，电线 - 管理衬套，索环	ETC 知名厂家	ETC
C2012	MULTILAYER CERAMIC CHIP CAPACITORS 文件：2.57112 Mbytes Page：55 Pages	TDK 东电化	TDK
C2012	HEYCo-molded Liquid Tight Break-Thru Plugs 文件：357.4 Kbytes Page：1 Pages	etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商	etc2
C2012	Multilayer Ceramic Chip Capacitors 文件：173.01 Kbytes Page：31 Pages	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS 文件：2.57364 Mbytes Page：55 Pages	TDK 东电化	TDK
C2012	MULTILAYER CERAMIC CHIP CAPACITORS 文件：2.57186 Mbytes Page：55 Pages	TDK 东电化	TDK
C2012	CAPACITORS 文件：448.8 Kbytes Page：7 Pages	etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商	etc2
C2012C0G1A010B050A	Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1A0R5B050A	Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1A100B050A	Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1E103J060AA	Multilayer Ceramic Chip Capacitors C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1E153J085AA	Multilayer Ceramic Chip Capacitors C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1E223J125AA	Multilayer Ceramic Chip Capacitors C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1E333J125AA	Multilayer Ceramic Chip Capacitors C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H010B050A	Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H0R5B050A	Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H100B050A	Multilayer Ceramic Chip Capacitors Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H101K	ADS78/8505EVM Users Guide Features · Full-Featured Evaluation Board for the ADS7804, ADS7805 or ADS8505, parallel Analog to Digital Converters · Industry Standard ±10 V Analog Input Range · Built in reference · Parallel Interface with 3-state output drivers · Compatible with the 5-6K Interface Board for use with a va	TI 德州仪器	TI
C2012C0G1H102J060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H102K060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H103J	Ceramic Capacitors For General Use SMD Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H103J060AA	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H103K060AA	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H122J060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H122K060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H152J060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H152K060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H153J085AA	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H153K085AA	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H182J060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H182K060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H222J060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H222J085AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H222K060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H223J125AA	TDK introduces a new global catalog part number for its Multilayer Ceramic Capacitor products Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency characteristics allow for a circuit de	TDK 东电化	TDK
C2012C0G1H223J125AA	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H223K125AA	MULTILAYER CERAMIC CHIP CAPACITORS Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H272J	Ceramic Capacitors For General Use SMD Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H272J060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H272K060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H332J	Ceramic Capacitors For General Use SMD Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • High-accuracy automatic mounting is facilitated through the maintenanc	TDK 东电化	TDK
C2012C0G1H332J060AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK
C2012C0G1H332J125AA	MULTILAYER CERAMIC CHIP CAPACITORS C Series General (Up to 50V) Features • High capacitance has been achieved through precision technologies that enable the use of multiple thinner ceramic dielectric layers. • A monolithic structure ensures superior mechanical strength and reliability. • Low ESL and excellent frequency	TDK 东电化	TDK

C2012产品属性

类型
描述
型号
C2012
功能描述
电缆固定件和配件 LTBP 625-063 1.03 X .32
RoHS
否
制造商
Heyco
类型
Cable Grips, Liquid Tight
材料
Nylon
颜色
Black
安装方法
Cable
最大光束直径
11.4 mm

C2012供应商更多...

更新时间：2025-10-4 17:35:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市商琪科技有限公司	C2012C0G1E103J060AA	TDK	2025+	SMD	16854648	代理销售TDK原装现货	询价
深圳市得捷芯城科技有限公司	C2012X5R1V226M125AC	TDK(东电化)	24+	0805	7196	原厂可订货,技术支持,直接渠道。可签保供合同	询价
深圳市明嘉莱科技有限公司	C2012X6S1C106KT0J0E	TDK	25+	SMD	518000	明嘉莱只做原装正品现货	询价
深圳市一线半导体有限公司	C2012	A	24+	DIP-6	6		询价
上海金庆电子技术有限公司	C2012201-AL	OKWEnclosures	新		8	全新原装货期两周	询价
深圳市金华微盛电子有限公司	C2012X7R1C105KT	TDK	19+	SMD	18000		询价
深圳市鸿昌盛电子科技有限公司	C2012X5R1E685K125AC		2015+		3	公司现货库存	询价
深圳市华康联电子科技有限公司	C2012CB-82NG	SAGAMI	24+	N/A	10000	只做原装,实单最低价支持	询价
深圳市诺美思科技有限公司	C2012C0G1E150JT000N	TDK		原厂封装	9800	原装进口公司现货假一赔百	询价
深圳市坤融电子科技有限公司	C2012X7R2A104KT0L0U	TDK	24+	SMD	2000	原装原厂代理可免费送样品	询价

C2012芯片相关品牌

C2012规格书下载地址

C2012参数引脚图相关

C2012数据表相关新闻

C315C105K3R5TA
C315C105K3R5TA
2023-10-10
C19D903205P1375
C19D903205P1375 OTHER 20+ 标准封装 C8051F001 SILICONLABS 20+ 标准封装 C8051F023-GQ SILICONLABS 20+ 标准封装 CAT24C04WI CATALYSTSEMICONDUCTOR 20+ 标准封装 CAT24C08WI-GT3 CATALYSTSEMICONDUCTOR 20+ 标准封装 CAT28F010G-12(PROG) OTHER 20+ 标准封装 CMCPCI102BR CALIFORNIAMICRODEVICES 20+ 标准封装 CP
2021-6-5
C2M0040120D 碳化硅功率MOSFET SIC 深圳市正纳电子有限公司
C2M0040120D
2020-12-23
C1CB00002620
C1CB00002620,当天发货0755-82732291全新原装现货或门市自取.
2020-11-11
C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0
2020-4-3
C2012X5R1A225M-60毫安稳压电荷泵电压逆变器
TPS6040x是一个系列器件产生一个不受管制的负输出电压的输入电压范围从1.6 V至5.5 V的设备通常提供了5 V或3.3 V由于preregulated供应铁路宽输入电压范围，两个或三个镍镉，镍氢电池或碱性电池，以及一个锂离子电池动力的。只有三个外部1μF电容需要构建一个完整的电荷泵DC / DC逆变器。组装在5引脚SOT23封装，完整的转换器，可以建在一个50平方毫米的电路板面积。额外的电路板面积元件数量的减少是通过取代肖特基二极管，通常需要启动成积体电路的负荷。TPS6040x能够以一个典型的转换效率，更大的一个最大输出电流60毫安在很宽的输出电流范围内超过90％。 3与20千赫，5
2012-12-28

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C2012价格

C2012产品属性

C2012供应商更多...

C2012芯片相关品牌

C2012规格书下载地址

C2012参数引脚图相关

C2012数据表相关新闻

C315C105K3R5TA

C19D903205P1375

C2M0040120D 碳化硅功率MOSFET SIC 深圳市正纳电子有限公司

C1CB00002620

C17AH，C18003，C18005(104-022-B)，C1806，C1808DKNPOEBN6R0

C2012X5R1A225M-60毫安稳压电荷泵电压逆变器

DdatasheetPDF页码索引