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| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
C1608C0G1E103JT | ContainsallsupportcircuitryneededfortheADS1148/ADS1248 文件：1.83652 Mbytes Page：34 Pages | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) |  |   |
C1608C0G1E103JT | ContainsallsupportcircuitryneededfortheADS1146/ADS1246 文件：2.33022 Mbytes Page：27 Pages | TI1Texas Instruments(TI) 德州仪器德州仪器 (TI) | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 |  | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.031 Mbytes Page：55 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.031 Mbytes Page：1 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：885.17 Kbytes Page：20 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation 东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.74951 Mbytes Page：55 Pages | TDKTDK Corporation 东电化（中国）投资有限公司 | | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK |
23+ |
NA |
100 |
现货!就到京北通宇商城 |
|||
TDK |
2023+ |
SMD |
700000 |
柒号芯城跟原厂的距离只有0.07公分 |
|||
TDK |
N/A |
30 |
优势货源原装正品 |
||||
TDK |
23+ |
0603 |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
|||
TDK |
2023+ |
80000 |
一级代理/分销渠道价格优势 十年芯程一路只做原装正品 |
||||
TDK |
17+ |
SMD |
4000 |
全新原装,支持实单,假一罚十,德创芯微 |
|||
TDK |
23+ |
0603 |
4000 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
TDK |
17+ |
SMD |
4000 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
TDK |
23+ |
SMD |
55000 |
0603 C0G 25V 10NF 5% |
|||
TDK |
21+ |
SMD |
4000 |
原装现货假一赔十 |
C1608C0G1E103JT芯片相关品牌
C1608C0G1E103JT规格书下载地址
C1608C0G1E103JT参数引脚图相关
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C1608C0G1E103JT数据表相关新闻
C14D32P-A3P原装特价现货出售
C14D32P-A3P
2022-7-20C14D16N-C3P原装特价现货出售
C14D16N-C3P
2022-7-20C1608C0G1H332J080AA产品技术参数 资料品牌TDK 批号2019 封装：SMD
C1608C0G1H332J080AA产品技术参数资料品牌TDK
2020-6-13C1608C0G1E682J080AA产品技术参数 原装正品现货
C1608C0G1E682J080AA产品技术参数原装正品现货
2020-6-13C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
2020-4-3C143ZDXV6T1，NSBC143ZPDXV6T1，NSBC144EDXV6T1，NSBC144EPDXV6T1G，NSBC144EPDXV6T5，NSDEMP11XV6T1
C143ZDXV6T1，NSBC143ZPDXV6T1，NSBC144EDXV6T1，NSBC144EPDXV6T1G，NSBC144EPDXV6T5，NSDEMP11XV6T1
2019-12-13
DdatasheetPDF页码索引
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