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C1608C0G1E103J价格
参考价格：￥0.3309
型号：C1608C0G1E103J080AA 品牌：TDK 备注：这里有C1608C0G1E103J多少钱，2025年最近7天走势，今日出价，今日竞价，C1608C0G1E103J批发/采购报价，C1608C0G1E103J行情走势销售排行榜，C1608C0G1E103J报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 |  |   |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | CKCSeriesCommercialGrade4in1Array MultilayerCeramicChipCapacitors ArrayType(4-Element) CKCA43Type FEATURES •Fourcapacitorsarefittedinasinglepackage. •Capableofreducingthenumberofparts,contributingtoreducedmountingareaandcost. •EffectiveforEMCcontrolaroundconnectors,etc.,whenusedasnoiseby | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | CKGSeriesCommercialGradeMEGACAPType MULTILAYERCERAMICCHIPCAPACITORS Commercialgrade,MEGACAPtype SERIESOVERVIEW TDKmultilayerceramicchipcapacitorCKGseriesisaproductwhichmetalframesareconnectedtoterminationsofMLCC,anditisalsocalledMEGACAP.MEGACAPhashighermechanicalendurancebytheflexiblemetal | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | TDKintroducesanewglobalcatalogpartnumberforitsMultilayerCeramicCapacitorproducts Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | CSeriesCommercialGradeHighVoltage(1000Vandover) 文件：1.19794 Mbytes Page：7 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57186 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | CSeriesCommercialGradeGeneral(Upto50V) 文件：1.13758 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS 文件：1.74951 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS 文件：885.17 Kbytes Page：20 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57112 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | PartNumberChangeNotification 文件：110.16 Kbytes Page：8 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | CGJSeriesHighReliabilityGradeGeneral(Upto50V) 文件：1.57282 Mbytes Page：11 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57186 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS 文件：1.74951 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J | MULTILAYERCERAMICCHIPCAPACITORS 文件：1.36314 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •High-accuracyautomaticmountingisfacilitatedthroughthemaintenanc | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Voltageratingof100Vto630Vwithcapacitancerangeupto15μF. •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Lowresidualinductanceassuressuperiorfrequencycharacteristics. •Excellent | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CKGSeriesCommercialGradeMEGACAPType MULTILAYERCERAMICCHIPCAPACITORS Commercialgrade,MEGACAPtype SERIESOVERVIEW TDKmultilayerceramicchipcapacitorCKGseriesisaproductwhichmetalframesareconnectedtoterminationsofMLCC,anditisalsocalledMEGACAP.MEGACAPhashighermechanicalendurancebytheflexiblemetal | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
TDKintroducesanewglobalcatalogpartnumberforitsMultilayerCeramicCapacitorproducts Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS CSeriesGeneral(Upto50V) Features •Highcapacitancehasbeenachievedthroughprecisiontechnologies thatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthand reliability. •LowESLandexcellentfrequency | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CKCSeriesCommercialGrade4in1Array MultilayerCeramicChipCapacitors ArrayType(4-Element) CKCA43Type FEATURES •Fourcapacitorsarefittedinasinglepackage. •Capableofreducingthenumberofparts,contributingtoreducedmountingareaandcost. •EffectiveforEMCcontrolaroundconnectors,etc.,whenusedasnoiseby | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS Features •Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. •Amonolithicstructureensuressuperiormechanicalstrengthandreliability. •LowESLandexcellentfrequencycharacteristicsallowforacircuitde | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CSeriesCommercialGradeHighVoltage(1000Vandover) 文件：1.19794 Mbytes Page：7 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CSeriesCommercialGradeHighVoltage(1000Vandover) 文件：1.19794 Mbytes Page：7 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：CAP CER 10000PF 25V C0G 0603 电容器 陶瓷电容器 | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57186 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
PartNumberChangeNotification 文件：110.16 Kbytes Page：8 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57112 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：2.57186 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：885.17 Kbytes Page：20 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.74951 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CGJSeriesHighReliabilityGradeGeneral(Upto50V) 文件：1.57282 Mbytes Page：11 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.74951 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CSeriesCommercialGradeGeneral(Upto50V) 文件：1.13758 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
封装/外壳：0603（1608 公制） 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：CAP CER 10000PF 25V C0G 0603 电容器 陶瓷电容器 | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.36314 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
CommercialGrade(General(Upto50V)) 文件：131.68 Kbytes Page：1 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MultilayerCeramicChipCapacitors 文件：184.29 Kbytes Page：3 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
ContainsallsupportcircuitryneededfortheADS1148/ADS1248 文件：1.83652 Mbytes Page：34 Pages | TI1Texas Instruments 德州仪器美国德州仪器公司 |  | | |
ContainsallsupportcircuitryneededfortheADS1146/ADS1246 文件：2.33022 Mbytes Page：27 Pages | TI1Texas Instruments 德州仪器美国德州仪器公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：885.17 Kbytes Page：20 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.031 Mbytes Page：1 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | | |
MULTILAYERCERAMICCHIPCAPACITORS 文件：1.031 Mbytes Page：55 Pages | TDKTDK Corporation TDK株式会社东电化（中国）投资有限公司 | | |
C1608C0G1E103J产品属性
- 类型
描述
- 型号
C1608C0G1E103J
- 功能描述
多层陶瓷电容器MLCC - SMD/SMT 0603 0.01uF 25volts C0G 5%
- RoHS
否
- 制造商
American Technical Ceramics(ATC)
- 电容
10 pF
- 容差
1 %
- 电压额定值
250 V
- 温度系数/代码
C0G(NP0) 外壳代码 -
- in
0505 外壳代码 -
- mm
1414
- 工作温度范围
- 55 C to + 125 C
- 产品
Low ESR MLCCs
- 封装
Reel
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TDK |
2023+ |
SMD |
8700 |
原装现货 |
|||
TDK |
2025+ |
SMD |
16854648 |
代理销售TDK原装现货 |
|||
TDK |
21+ |
SMD |
15374 |
原装现货假一赔十 |
|||
TDK/东电化 |
23+ |
0603 |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
TDK |
24+ |
0603 |
4000 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
|||
TDK(东电化) |
24+ |
SMD |
21222 |
TDK原厂直供,全系列可订货。美金交易,大陆交货。 |
|||
TDK |
新 |
3000 |
全新原装 货期两周 |
||||
TDK |
23+ |
SMD |
55000 |
0603 C0G 25V 10NF 5% |
|||
TDK |
24+ |
SMD |
80000 |
只做自己库存,全新原装进口正品假一赔百,可开13%增 |
|||
TDK/东电化 |
2447 |
SMD |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
C1608C0G1E103J芯片相关品牌
C1608C0G1E103J规格书下载地址
C1608C0G1E103J参数引脚图相关
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C1608C0G1E103J数据表相关新闻
C14D32P-A3P原装特价现货出售
C14D32P-A3P
2022-7-20C14D16N-C3P原装特价现货出售
C14D16N-C3P
2022-7-20C1608C0G1H332J080AA产品技术参数 资料品牌TDK 批号2019 封装：SMD
C1608C0G1H332J080AA产品技术参数资料品牌TDK
2020-6-13C1608C0G1E682J080AA产品技术参数 原装正品现货
C1608C0G1E682J080AA产品技术参数原装正品现货
2020-6-13C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
C1608COG1HR68CT000N0603-0.68PPB-FREE，C1608COG221JT000N
2020-4-3C143ZDXV6T1，NSBC143ZPDXV6T1，NSBC144EDXV6T1，NSBC144EPDXV6T1G，NSBC144EPDXV6T5，NSDEMP11XV6T1
C143ZDXV6T1，NSBC143ZPDXV6T1，NSBC144EDXV6T1，NSBC144EPDXV6T1G，NSBC144EPDXV6T5，NSDEMP11XV6T1
2019-12-13
DdatasheetPDF页码索引
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