- 英文简称：BSI
- 英文全称：Brilliance Semiconductor
- 中文简称：连邦科技
- 中文全称：连邦科技股份有限公司
- 所在地区：台湾
- 总部地点：新竹
- 公司官网：http://www.brilliancesemi.com
BSI
BSI
中文资料: 3073条
BSI应用领域
通信设备、卫星导航、电子设备、消费电子等领域
BSI公司简介
连邦科技（Brilliance Semiconductor）创立于1996年，总公司位于台湾的矽谷，即是新竹科学园区；为一无晶圆厂的半导体制造商，供应全球性的低功率低耗电静态随机存取内存(SRAM)。连邦科技所提供的低功率低耗电SRAM在工业界里已被广泛使用，包括行动电话、掌上型计算机PDA、掌上型卫星导航系统GPS、掌上型游戏机、条形码读取机、电子式备援电池等等。因此，在低功率SRAM的产品上，连邦科技已成为全球性的领导厂商
BSI主营产品
低功率低耗电静态随机存取内存(SRAM)
BSI芯片中文资料
- BS616UV4016AIP85
- BS62LV4006SI
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BSI技术资料下载
- BS62LV4006TCP70
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BSI相关品牌
BSI数据手册
- BS62LV1027SCP70
- BS62LV4006STIG70
- BS616UV2019ACP85
- BS616UV4016DI-85
- BS616UV4016EI
- BS62LV1027SI-70
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- BS62LV1603FC
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- BS62LV1603EC-55
- BS62LV1600EC
- BS62LV2009SI-70
- BS62LV2009TCG55
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- BS616LV1012AC-70
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- BS616LV8010FI-70
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- BS62LV1029STIG70
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BSI规格书PDF下载
- BS616LV8019ECP70
- BS616LV2019AI-70
- BS616LV2017DCG70
- BS616LV8018FIP70
- BS616UV2019DC-85
- BS616LV8016FCG70
- BS62LV4007SIP55
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- BS616LV2019TI
- BS62LV4007STCG55
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- BS62LV4007
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- BS62LV2006SCP70
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- BD616LV4017DCG55
- BS616LV4017EC
- BH616UV8010
- BS616LV2016DCP55
- BS616LV1613FI
- BH62UV8000
- BH62UV8000DIG70
- BS62LV1603FI
- BS62LV1603EI
- BS62LV2009SIG70
- BS616LV8017FIP70
- BS616LV8017EC
- BS62LV2009TIP55
- BS62LV2009DI-55
- BS62LV2009SC
- BS62LV2009TIG55
- BS616LV8017FIG70
- BS616LV8017EIP55
- BS616LV8017EC-70
- BS62LV2009DC
- BS62LV1603
- BS616LV1011ECG55
- BS616LV1012
- BS616LV1012EIG55
- BS616LV1012EIP70
- BS616LV1012EIP55
- BS616LV1011EI
- BS616LV1012EIG70
- BS616LV1011EI-70
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- BS62LV4008SIG70
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- BS62LV4008TCP55
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- BS62LV4008SIP55
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- BS62LV4008TCG70
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