- 英文简称：BSI
- 英文全称：Brilliance Semiconductor
- 中文简称：连邦科技
- 中文全称：连邦科技股份有限公司
- 所在地区：台湾
- 总部地点：新竹
- 公司官网：http://www.brilliancesemi.com
BSI
BSI
中文资料: 3073条
BSI应用领域
通信设备、卫星导航、电子设备、消费电子等领域
BSI公司简介
连邦科技（Brilliance Semiconductor）创立于1996年，总公司位于台湾的矽谷，即是新竹科学园区；为一无晶圆厂的半导体制造商，供应全球性的低功率低耗电静态随机存取内存(SRAM)。连邦科技所提供的低功率低耗电SRAM在工业界里已被广泛使用，包括行动电话、掌上型计算机PDA、掌上型卫星导航系统GPS、掌上型游戏机、条形码读取机、电子式备援电池等等。因此，在低功率SRAM的产品上，连邦科技已成为全球性的领导厂商
BSI主营产品
低功率低耗电静态随机存取内存(SRAM)
BSI芯片中文资料
- BS616LV1010FIG70
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BSI技术资料下载
- BS62LV8001ECG70
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BSI相关品牌
BSI数据手册
- BS62LV4006DCP55
- BS616LV2019EIG55
- BS62LV8001FI70
- BS62UV256TCP10
- BS616LV1010TC70
- BS616LV1010FIP55
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- BS616LV8017EIP70
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- BH616UV1611BI70
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- BS62LV4007SI-70
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BSI规格书PDF下载
- BS616LV1010TCG70
- BS616LV1010EIP55
- BS616LV1010AIP55
- BS616LV1010TI70
- BS616LV8017FC55
- BS616LV1010ECG55
- BS62UV256PCG10
- BS62LV1600EIP70
- BS62LV2006HIG55
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- BS62LV1600FIG55
- BS62LV1027PI55
- BS62LV256DI55
- BH616UV1611TIG55
- BH62UV1601
- BS616LV8017ECP70
- BS616LV2019DIP70
- BS62LV2006SIG70
- BS62UV256DIG15
- BS616UV2019TIP85
- BS62LV8001FCP70
- BS616LV1010EI70
- BS616LV1010AC70
- BS616LV2019DCP55
- BS62LV256DIG70
- BS616LV2019TCG55
- BS616LV2019AI55
- BS62LV8001DCP55
- BS616LV2019
- BS62UV256DI10
- BS62LV2006TI55
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- BH616UV1611DI70
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- BS62UV256DCG15
- BS616LV8016FIG70
- BS62LV4006STCP55
- BS616UV4016DIG10
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