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| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
BYWF29-200-E3SLASH45 | Ultrafast Rectifier FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 2 | VISHAYVishay Siliconix 威世威世科技公司 |   | |
BYWF29-200-E3SLASH45 | Ultrafast Rectifier • Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max. 10 | VISHAYVishay Siliconix 威世威世科技公司 | | |
Ultrafast Rectifier FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 2 | VISHAYVishay Siliconix 威世威世科技公司 | | ||
Ultrafast Rectifier • Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max. 10 | VISHAYVishay Siliconix 威世威世科技公司 | | ||
Ultrafast Rectifier FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 2 | VISHAYVishay Siliconix 威世威世科技公司 | | ||
Ultrafast Rectifier • Power pack • Glass passivated pallet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max. 10 | VISHAYVishay Siliconix 威世威世科技公司 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
恩XP |
22+ |
TO-220 |
16328 |
||||
恩XP |
23+ |
TO-220 |
11846 |
一级代理商现货批发,原装正品,假一罚十 |
|||
PH |
24+ |
原厂封装 |
2500 |
原装现货假一罚十 |
|||
恩XP |
2023+ |
TO-220 |
8800 |
正品渠道现货 终端可提供BOM表配单。 |
|||
VIS |
24+ |
4470 |
|||||
MOLEX/莫仕 |
2508+ |
/ |
309575 |
一级代理，原装现货 |
|||
VISHAY/威世 |
2407+ |
30098 |
全新原装!仓库现货,大胆开价! |
||||
Vishay |
24+ |
NA |
3000 |
进口原装正品优势供应 |
|||
恩XP |
0927+ |
TO-220 |
8000 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
VISHAY/威世 |
TO-220 |
22+ |
6000 |
十年配单,只做原装 |
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BYWF29-200-E3SLASH45规格书下载地址
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DdatasheetPDF页码索引
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