• Power pack

• Glass passivated pallet chip junction

• Ultrafast recovery time

• Low switching losses, high efficiency

• Low forward voltage drop

• High forward surge capability

• Meets MSL level 1, per J-STD-020, LF maximum peak of

245 °C (for TO-263AB package)

• Solder dip 275 °C max. 10 s, per JESD 22-B106

(for TO-220AC and ITO-220AC package)

• AEC-Q101 qualified