BYG60价格

参考价格:¥0.3900

型号:BYG60D 品牌:NXP/PHILIPS 备注:这里有BYG60多少钱,2025年最近7天走势,今日出价,今日竞价,BYG60批发/采购报价,BYG60行情走势销售排行榜,BYG60报价。
型号 功能描述 生产厂家 企业 LOGO 操作
BYG60

Fast soft-recovery controlled avalanche rectifiers

DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava

Philips

飞利浦

BYG60

Fast soft-recovery controlled avalanche rectifiers

ETC

知名厂家

Fast soft-recovery controlled avalanche rectifiers

DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava

Philips

飞利浦

Fast soft-recovery controlled avalanche rectifiers

DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava

Philips

飞利浦

Fast soft-recovery controlled avalanche rectifiers

DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava

Philips

飞利浦

Fast soft-recovery controlled avalanche rectifiers

DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava

Philips

飞利浦

Fast soft-recovery controlled avalanche rectifiers

DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava

Philips

飞利浦

BYG60产品属性

  • 类型

    描述

  • 型号

    BYG60

  • 制造商

    PHILIPS

  • 制造商全称

    NXP Semiconductors

  • 功能描述

    Fast soft-recovery controlled avalanche rectifiers

更新时间:2025-11-7 20:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
恩XP
24+
NA/
94850
原装现货,当天可交货,原型号开票
PHI
25+
1808
54648
百分百原装现货 实单必成 欢迎询价
PHI
04+
1A扁形
7500
一级代理,专注军工、汽车、医疗、工业、新能源、电力
PHI
24+
1808
990000
明嘉莱只做原装正品现货
PHI
24+/25+
1500
原装正品现货库存价优
PHI
2450+
DO214/A
6540
只做原装正品现货或订货!终端客户免费申请样品!
PHI
新年份
SOD106
99000
原装正品大量现货,要多可发货,实单带接受价来谈!
SMD
23+
NA
15659
振宏微专业只做正品,假一罚百!
GE
24+
5000
PHI
24+
DO214
65200
一级代理/放心采购

BYG60数据表相关新闻