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BYG60价格
参考价格：￥0.3900
型号：BYG60D 品牌：NXP/PHILIPS 备注：这里有BYG60多少钱，2025年最近7天走势，今日出价，今日竞价，BYG60批发/采购报价，BYG60行情走势销售排行榜，BYG60报价。| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
BYG60 | Fast soft-recovery controlled avalanche rectifiers DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava | Philips 飞利浦 |   | |
Fast soft-recovery controlled avalanche rectifiers DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava | Philips 飞利浦 | | ||
Fast soft-recovery controlled avalanche rectifiers DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava | Philips 飞利浦 | | ||
Fast soft-recovery controlled avalanche rectifiers DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava | Philips 飞利浦 | | ||
Fast soft-recovery controlled avalanche rectifiers DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava | Philips 飞利浦 | | ||
Fast soft-recovery controlled avalanche rectifiers DESCRIPTION DO-214AC surface mountable package with glass passivated chip. The well-defined void-free case is of a transfer-moulded thermo-setting plastic. FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed ava | Philips 飞利浦 | |
BYG60产品属性
- 类型
描述
- 型号
BYG60
- 制造商
PHILIPS
- 制造商全称
NXP Semiconductors
- 功能描述
Fast soft-recovery controlled avalanche rectifiers
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
GE |
24+ |
5000 |
|||||
PHI |
24+ |
DO-214 |
80000 |
只做自己库存 全新原装进口正品假一赔百 可开13%增 |
|||
PHI |
22+ |
SMA |
13500 |
进口原装 |
|||
恩XP |
23+ |
SMA |
12800 |
##公司主营品牌长期供应100%原装现货可含税提供技术 |
|||
PHI |
04+ |
1A扁形 |
7500 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
PHI |
2023+ |
1A扁形 |
8800 |
正品渠道现货 终端可提供BOM表配单。 |
|||
恩XP |
21+ |
SMA |
10450 |
原装现货假一赔十 |
|||
PHI |
2019+PB |
SOD106 |
99000 |
原装正品 可含税交易 |
|||
PHI |
25+ |
1A扁形 |
12588 |
原装正品,自己库存 假一罚十 |
|||
恩XP |
23+ |
SMADO-214AC |
50000 |
全新原装正品现货,支持订货 |
BYG60规格书下载地址
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BYG60数据表相关新闻
DdatasheetPDF页码索引
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