PICMG COM R3.0 Type 6 module, 11th Gen Intel® Xeon/ Core™ BGA Processor

Features • PICMG COM R3.0 Type 6 module with 10nm 11th Generation Intel® Xeon™ W-11865MRE/W-11155MRE (ECC), Core™ i7/i5/i3 BGA Processors • 3 x SODIMM sockets support DDR4 3200 up to 96GB • Gen 12 Intel® UHD Graphics (Xe Architecture), media, and display up to 32EU • Flexible I/O support: 4 x S

PSG90809

Description RJ45 to RJ45 Category 6 patch cable with low profile strain reliefs.

KEYSTONE PTFE Insulated Terminals & Pins

文件：377.89 Kbytes Page：1 Pages

~13째 x 45째 oval beam optimized for CREE MC-E. Variant with beam direction rotated 90째. Assembly with black holder.

文件：6.1631 Mbytes Page：4 Pages