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| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
ESM-TGH-11155MRE | PICMG COM R3.0 Type 6 module, 11th Gen Intel® Xeon/ Core™ BGA Processor Features • PICMG COM R3.0 Type 6 module with 10nm 11th Generation Intel® Xeon™ W-11865MRE/W-11155MRE (ECC), Core™ i7/i5/i3 BGA Processors • 3 x SODIMM sockets support DDR4 3200 up to 96GB • Gen 12 Intel® UHD Graphics (Xe Architecture), media, and display up to 32EU • Flexible I/O support: 4 x S | BCM bcm advanced search |   | |
PSG90809 | ETC 知名厂家 | ETC | | |
KEYSTONE PTFE Insulated Terminals & Pins 文件：377.89 Kbytes Page：1 Pages | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | | ||
~13째 x 45째 oval beam optimized for CREE MC-E. Variant with beam direction rotated 90째. Assembly with black holder. 文件：6.1631 Mbytes Page：4 Pages | LEDIL 莱迪尔 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
ARCOTR0NIC |
23+ |
DIP |
6800 |
专注配单,只做原装进口现货 |
|||
ESMT |
23+ |
BGA54 |
10000 |
原厂授权一级代理,专业海外优势订货,价格优势、品种 |
|||
ARCOTR0NI |
15+ROHS |
DIP-2 |
493900 |
一级质量长期可供应量大价格从优 |
|||
ARCOTR0NIC |
23+ |
DIP |
6800 |
专注配单,只做原装进口现货 |
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DdatasheetPDF页码索引
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