位置：首页 > IC中文资料第5867页 > BCM3250
| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
BCM3250 | ADVANCED 3D SET-TOP BOX DEVELOPMENT PLATFORM 文件：551.14 Kbytes Page：2 Pages | BOARDCOM 博通 |   | |
BCM3250 | QAMLINK ADVANCED SER-TOP BOX SINGLE-CHIP FRONT-END 文件：158.95 Kbytes Page：2 Pages | BOARDCOM 博通 | | |
BCM3250 | QAMLink® Set-Top Box Single-Chip Front End | BOARDCOM 博通 | | |
Customer Specification Construction 1) Component 1 1 X 1 HOOKUP a) Conductor 24 (7/32) AWG Tinned Copper 0.024 b) Insulation 0.010 Wall, Nom. PVC, Semi Rigid 0.044+/- 0.002 (1) Print ALPHA WIRE E163869-* RU AWM STYLE 1061 80C 300V VW-1 24 AWG --- LLXXXX CSA AWM I A/B 80C 300 VOLTS FT1 CE ROHS {0} * = Factory | ALPHAWIRE | | ||
Customer Specification 文件：69.88 Kbytes Page：3 Pages | ALPHAWIRE | | ||
MONOLITHIC DUAL NPN TRANSISTORS 文件：298.96 Kbytes Page：2 Pages | LINEAR | | ||
Square Trimming Potentiometer 文件：41.68 Kbytes Page：1 Pages | Bourns 伯恩斯 | | ||
4700 文件：48.7 Kbytes Page：1 Pages | ETCList of Unclassifed Manufacturers 未分类制造商 | |
BCM3250产品属性
- 类型
描述
- 型号
BCM3250
- 制造商
BOARDCOM
- 制造商全称
Broadcom Corporation.
- 功能描述
ADVANCED 3D SET-TOP BOX DEVELOPMENT PLATFORM
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
BROADCOM |
24+ |
NA/ |
3350 |
原装现货,当天可交货,原型号开票 |
|||
BROADCOM |
2016+ |
BGA |
6000 |
只做原装,假一罚十,公司可开17%增值税发票! |
|||
BROADCOM |
23+ |
BGA |
20000 |
全新原装假一赔十 |
|||
BOARDCOM |
24+ |
BGA |
6000 |
全新原装正品现货 假一赔佰 |
|||
BROADCOM |
25+ |
BGA |
4500 |
全新原装、诚信经营、公司现货销售 |
|||
BROADCOM |
23+ |
BGA |
3500 |
绝对全新原装!现货!特价!请放心订购! |
|||
BROADCOM |
24+ |
BGA |
80 |
||||
BROADCOM |
24+ |
BGA |
200 |
专业分销!只做原装现货价优一手货源 |
|||
BROADCOM |
新 |
50 |
全新原装 货期两周 |
||||
BROADCOM |
24+ |
BGA |
39197 |
郑重承诺只做原装进口现货 |
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BCM3250规格书下载地址
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DdatasheetPDF页码索引
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