NPN General Purpose Amplifier

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NPN, 65V, 0.1A, SOT23

65 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm

65 V, 100 mA PNP general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm

65 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recommended for use in automotive a

65 V, 100 mA PNP general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recommended for use in automotive a

65 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • High voltage (max. 65 V) • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

65 V, 100 mA PNP general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm

65 V, 100 mA NPN general-purpose transistor

Features and benefits • High power dissipation capability • High voltage (max. 65 V) • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recomme

65 V, 100 mA PNP general-purpose transistor

Features and benefits • High power dissipation capability • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to AEC-Q101 and recommended for use in automotive a

45 V, 100 mA NPN general-purpose transistor

45 V, 100 mA NPN general-purpose transistor

封装/外壳：3-XDFN 裸露焊盘 包装：散装 描述：SMALL SIGNAL BIPOLAR IN DFN PACK 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

封装/外壳：3-XDFN 裸露焊盘 包装：散装 描述：SMALL SIGNAL BIPOLAR IN DFN PACK 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

846 Series High Temp Card Edge Connector | Green | 0.125 (3.175mm) Pitch | 0.250 (6.35mm) Row Spacing

Features .125 (3.175mm) Contact Spacing x .250 (6.35mm) Row Spacing Accepts .062 (1.57mm) Nominal Thickness P.C. Board High Profile Insulator Body, .600 (15.24mm) Contact Termination Options include P.C. Tail, Wire Hole, Wire Wrap, 90 and Extender Board Bends Single or Dual Row Configurations

Small Signal Transistor

Features - High current gain. - AEC-Q101 Qualified. - Excellent hFE linearity. - Low noise between 30Hz and 15kHz.

Small Signal Transistor

Features - High current gain. - AEC-Q101 Qualified. - Excellent hFE linearity. - Low noise between 30Hz and 15kHz.

Small Surface Mount Transistor

Features - Low collector capacitance. - Low collector-emitter saturation voltage. - Reduces number of components and board space. - AEC-Q101 Qualified. - No mutual interference between the transistors.

Small Signal Transistor

Features - High current gain. - AEC-Q101 Qualified. - Excellent hFE linearity. - Low noise between 30Hz and 15kHz.