300V NPN TRANSISTOR HIGH VOLTAGE TRANSISTOR IN SOT223

NPN SURFACE MOUNT SMALL SIGNAL TRANSISTOR

Features ● Ideally Suited for Automatic Insertion ● Epitaxial Planar Die Construction ● For Switching, AF Driver and Amplifier Applications ● Complementary PNP Types Available (BC807)

EPITAXAIL PLANAR NPN TRANSISTOR(for General Purpose, Switching)

GENERAL PURPOSE APPLICATION. SWITCHING APPLICATION. FEATURES Complementary to BC807.

NPN Small Signal Transistor 310mW

Features • Halogen free available upon request by adding suffix -HF • Lead Free Finish/RoHS Compliant (P Suffix designates RoHS Compliant. See ordering information) • Epoxy meets UL 94 V-0 flammability rating • Moisure Sensitivity Level 1 • Ideally Suited for Automatic Insertion •

45 V, 500 mA NPN general-purpose transistors

45 V, 500 mA NPN general-purpose transistors

Features and benefits * General-purpose transistor * Two current gain selections * Low package height of 0.37 mm * AEC-Q101 qualified

45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • High-temperature appli

45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • High-temperature appli

45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to

45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to

45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • AEC-Q101 qualified

45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • High-temperature appli

45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • High-temperature appli

45 V, 500 mA NPN general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to

45 V, 500 mA PNP general-purpose transistors

Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.5 mm • Qualified according to

封装/外壳：3-XDFN 裸露焊盘 包装：散装 描述：TRANS NPN 45V 0.5A DFN1010D-3 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

45 V, 500 mA NPN general-purpose transistors

封装/外壳：3-XDFN 裸露焊盘 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：TRANS NPN 45V 0.5A DFN1110D-3 分立半导体产品 晶体管 - 双极性晶体管（BJT）- 单个

45 V, 500 mA NPN general-purpose transistors

General Purpose Transistors

Features - Epoxy meets UL-94 V-0 flammability rating. - Moisture sensitivity Level 1. - AEC-Q101 Qualified

General Purpose Transistors

Features - Epitaxial planar die construction. - AEC-Q101 Qualified. - High collector current. - High current gain. - Low collector-emitter saturation voltage.