650mA, Step Down DC/DC Converter for Portable Applications

General Description The AS1333 is a step-down DC-DC converter designed to power portable applications from a single Li-Ion battery. The device also achieves high-performance in mobile phones and other applications requiring low dropout voltage. Key Features ■ PWM Switching Frequency: 2MHz ■ Si

650mA, Step Down DC/DC Converter for Portable Applications

650mA, Step Down DC/DC Converter for Portable Applications

General Description The AS1333 is a step-down DC-DC converter designed to power portable applications from a single Li-Ion battery. The device also achieves high-performance in mobile phones and other applications requiring low dropout voltage. Key Features ■ PWM Switching Frequency: 2MHz ■ Si

封装/外壳：8-UFBGA，WLCSP 功能：降压 包装：剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC REG BUCK 3.09V 650MA 8WLCSP 集成电路（IC） 稳压器 - DC-DC 开关稳压器

封装/外壳：8-UFBGA，WLCSP 功能：降压 包装：剪切带（CT）Digi-Reel® 得捷定制卷带 描述：IC REG BUCK 3.09V 650MA 8WLCSP 集成电路（IC） DC DC 开关稳压器

Integrated Circuit Module, Hybrid, Audio Power Amp, 40W, 2 Power Supplies Req?셝

Integrated Circuit Module, Hybrid, Audio Power Amp, 40W, 2 Power Supplies Req’d

Memory Micromodules General Information for D1, D2 and C Packaging

DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). ■ Micromodules were developed specifically for embedding in Smartcards and Memory Cards ■ The Micromodule provides: – Support for the chi

6-Contact Memory Card IC 272-bit EEPROM with Advanced Security Mechanisms

DESCRIPTION The members of the ST1331/1333/1353 family are principally designed for use in prepaid Phonecard applications. Each is a 272-bit EEPROM device, with associated security logic and special fuses to control memory access. The memory is arranged as a matrix of 34 x 8 cells, accessed in

Photo Modules for PCM Remote Control Systems

The TSOP13.. – series are miniaturized receivers for infrared remote control systems. PIN diode and preamplifier are assembled on lead frame, the epoxy package is designed as IR filter.

Designed for application where high density insertion of components is required.

文件：245.8 Kbytes Page：9 Pages