PhotoMOS HE 1 Form A High Capacity

FEATURES Greatly increased load current in a compact DIP package Continuous load current: 3.5A (AQV251G) Greatly improved specifications allow you to use this in place of mercury and mechanical relays Low on-resistance (Typ. 35mΩ, AQV251G)

封装/外壳：4-SIP 包装：卷带（TR） 描述：SSR RELAY SPST-NO 1A 0-200V 继电器 固态继电器

封装/外壳：4-SIP 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：SSR RELAY SPST-NO 1A 0-200V 继电器 固态继电器

PhotoMOS HE 1 Form A High Capacity

FEATURES Greatly increased load current in a compact DIP package Continuous load current: 3.5A (AQV251G) Greatly improved specifications allow you to use this in place of mercury and mechanical relays Low on-resistance (Typ. 35mΩ, AQV251G)

POWER PhotoMOS RELAYS (Voltage Sensitive Type)

POWER PhotoMOS RELAYS(Voltage Sensitive Type) FEATURES 1. A voltage sensitive power PhotoMOS relay Conventional power PhotoMOS relays are connected externally to an input limiting resistor in order to obtain the appropriate LED current. Adding an internal constant-current element render

PhotoMOS HE 1 Form A High Capacity

FEATURES Greatly increased load current in a compact DIP package Continuous load current: 3.5A (AQV251G) Greatly improved specifications allow you to use this in place of mercury and mechanical relays Low on-resistance (Typ. 35mΩ, AQV251G)

POWER PhotoMOS RELAYS with Internal Varistor

FEATURES 1. Power PhotoMOS relay with internal varistor An internal varistor on the output side protects the output MOSFET from the reverse voltage from an external voltage surge or inductive load. 2. High capacity PhotoMOS relay Supports control of minute loads to a maximum 3.0 A. Suitabl

107/207, 108/208 In-Line Diaphragm Seals

FEATURES „ 316L Stainless steel top housing (standard) „ Available with diaphragm welded or bonded to top housing or removable threaded capsule diaphragms „ Flow through design reduces the possibility of clogging „ Large 21/2˝ diaphragm compatible with most Ashcroft instrumentation

15.6 Ultra-Slim, All-in-One POS

Features ƒ 15.6 Full HD LCD (LED backlight) with P-CAP touch control ƒ Ultra-thin design with narrow bezel (11 mm/0.43 in) ƒ 11th generation Intel® Celeron®/Core™ i processor ƒ Anodized aluminum rear cover ƒ IP65-rated front panel for water and dust resistance ƒ Low-power, fanless operation

Direct replacement for T1 쩐 Wedge Base F9

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M12-A Male 5 Pin Field Attachable

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Low Cost, Miniature DIP 2W, Very High Isolation DC/DC Converters

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