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| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
AOTA-B201208S | MINI MOLDED POWER INDUCTOR Features • Shielded construction for minimized EMI. • Low DCR (as low as 10mΩ) for better efficiency • High current up to 11A handling capability • Compact size that is suitable for high-density designs • Excellent for high-frequency switching applications due to SRF up to 185MHz. Applicat | ABRACON |   | |
MINI MOLDED POWER INDUCTOR Features • Shielded construction for minimized EMI. • Low DCR (as low as 10mΩ) for better efficiency • High current up to 11A handling capability • Compact size that is suitable for high-density designs • Excellent for high-frequency switching applications due to SRF up to 185MHz. Applicat | ABRACON | | ||
MINI MOLDED POWER INDUCTOR Features • Shielded construction for minimized EMI. • Low DCR (as low as 10mΩ) for better efficiency • High current up to 11A handling capability • Compact size that is suitable for high-density designs • Excellent for high-frequency switching applications due to SRF up to 185MHz. Applicat | ABRACON | | ||
MINI MOLDED POWER INDUCTOR Features • Shielded construction for minimized EMI. • Low DCR (as low as 10mΩ) for better efficiency • High current up to 11A handling capability • Compact size that is suitable for high-density designs • Excellent for high-frequency switching applications due to SRF up to 185MHz. Applicat | ABRACON | | ||
MINI MOLDED POWER INDUCTOR Features • Shielded construction for minimized EMI. • Low DCR (as low as 10mΩ) for better efficiency • High current up to 11A handling capability • Compact size that is suitable for high-density designs • Excellent for high-frequency switching applications due to SRF up to 185MHz. Applicat | ABRACON | | ||
MINI MOLDED POWER INDUCTOR Features • Shielded construction for minimized EMI. • Low DCR (as low as 10mΩ) for better efficiency • High current up to 11A handling capability • Compact size that is suitable for high-density designs • Excellent for high-frequency switching applications due to SRF up to 185MHz. Applicat | ABRACON | | ||
MINI MOLDED POWER INDUCTOR Features • Shielded construction for minimized EMI. • Low DCR (as low as 10mΩ) for better efficiency • High current up to 11A handling capability • Compact size that is suitable for high-density designs • Excellent for high-frequency switching applications due to SRF up to 185MHz. Applicat | ABRACON | | ||
功率电感 | ABRACON | | ||
Moiding power lnducto rs 文件：1.05932 Mbytes Page：7 Pages | LEIDITECH 雷卯电子 | | ||
Molding Power Inductors 文件：371.43 Kbytes Page：9 Pages | etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商 | | ||
Power Inductor 文件：237.22 Kbytes Page：6 Pages | TAI-TECH 台庆科技 | | ||
Power Inductor 文件：166.5 Kbytes Page：3 Pages | TAI-TECH 台庆科技 | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Abracon |
23+ |
TO-18 |
12800 |
原装正品代理商最优惠价格,现货或订货 |
|||
Abracon LLC |
25+ |
0805(2012 公制) |
9350 |
独立分销商 公司只做原装 诚心经营 免费试样正品保证 |
|||
ABRACON |
24+ |
con |
3000 |
优势库存,原装正品 |
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DdatasheetPDF页码索引
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