Power Assemblies

HEATSINKS Power Assemblies The current range of heatsinks is illustrated with a brief resumé of their characteristics. The products available are intended for use with all our power semiconductors - from the small stud base through to large disc devices and modules. All heatsinks are suitable f

This document is intended to provide information

Introduction This document is intended to provide information on the use of, and application hints related to, ST’s L3GD20H 3-axis digital gyroscope. The L3GD20H is a 3-axis angular rate sensor with a digital I2C/SPI serial interface standard output. The device has a full scale of ±245/±500/±20

Power Assemblies

HIGH VOLTAGE PLANAR RESISTORS

High Voltage Planar Resistors 4500 Series •Voltages up to 20kV dc. •Powers up to 4.5 Watts •TCR to 50ppm/°C •Customs design service available •Planar construction gives low inductance and capacitance Application Notes The terminations should not be bent closer than 1.5m

SINGLE-CHIP 4-BIT CMOS MICROCOMPUTER

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4-BIT CISC SINGLE-CHIP MICROCOMPUTER 4500 SERIES

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customs design service available

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High Voltage Planar Resistors

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