AMO价格

参考价格:¥0.0000

型号:AMO-BUSIKJ-BLK 品牌:ETS 备注:这里有AMO多少钱,2025年最近7天走势,今日出价,今日竞价,AMO批发/采购报价,AMO行情走势销售排行榜,AMO报价。
型号 功能描述 生产厂家&企业 LOGO 操作

Intel® Celeron™ N3350 DC SoC With Four Serial Ports Modular Fanless Box PC

Features ƒ Intel® Celeron™ N3350 Dual Core SoC ƒ VGA Display, 4 x RS-232/422/485, 2 x USB3.0 ƒ 1 x full-size miniPCIe for communication module #1 ƒ 1 x 2.5 SATA III drive bay and 1 x half-size mSATA ƒ -20 ~ 60 °C extended operating temperature ƒ 12V lockable DC jack power input ƒ Optional 1

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Intel® Atom™ E3940 QC SoC With Dual HDMI/ Dual LAN/ Four USB Modular Fanless Box PC

Features ƒ Intel® Atom™ E3940 Quad Core SoC ƒ Dual HDMI independent display support 4K resolution ƒ 1 x Full-size miniPCIe with SIM holder for communication module #1 ƒ 1 x M.2 2230 E Key for WIFI module #2 ƒ 1 x 2.5 SATA III SSD/HDD and 1 x mSATA ƒ TPM built in for system security ƒ -20 ~

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Intel® Celeron™ N3350 DC SoC With Dual LAN/ Four USB 3.0/M.2/TPM IoT Gateway Modular Fanless Box PC

Features ƒ Intel® Celeron™ N3350 Dual Core SoC ƒ VGA Display/2x RS-232/422/485/4x USB 3.0 ƒ 1 x Full-size miniPCIe with SIM holder for communication module #1 ƒ 1 x M.2 E-key for WIFI module #2 ƒ -20 ~ 60 °C extended operating temperature ƒ TPM 2.0 default built-in ƒ 12V lockable DC jack po

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Intel® Atom® E3940 SoC Modular Fanless Box PC

Features ƒ Intel® Atom® E3940 Quad Core SoC ƒ Dual independent displays with one 4K HDMI and one VGA ƒ 12V lockable DC jack power input ƒ 9-36V power module compatible with all-in-one ordering ƒ -20 ~ 60 °C extend operating temperature ƒ Mini PCIe expansion with SIM holder for communication

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Intel® Atom® E3940 SoC Modular Fanless Box PC

Features ƒ Intel® Atom® E3940 Quad Core SoC ƒ Dual independent displays with one 4K HDMI and one VGA ƒ 12V lockable DC jack power input ƒ 9-36V power module compatible with all-in-one ordering ƒ -20 ~ 60 °C extend operating temperature ƒ Mini PCIe expansion with SIM holder for communication

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Intel® Atom® E3940 SoC Modular Fanless Box PC

Features ƒ Intel® Atom® E3940 Quad Core SoC ƒ Dual independent displays with one 4K HDMI and one VGA ƒ 12V lockable DC jack power input ƒ 9-36V power module compatible with all-in-one ordering ƒ -20 ~ 60 °C extend operating temperature ƒ Mini PCIe expansion with SIM holder for communication

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Intel® Atom® E3940 SoC Modular Fanless Box PC

Features ƒ Intel® Atom® E3940 Quad Core SoC ƒ Dual independent displays with one 4K HDMI and one VGA ƒ 12V lockable DC jack power input ƒ 9-36V power module compatible with all-in-one ordering ƒ -20 ~ 60 °C extend operating temperature ƒ Mini PCIe expansion with SIM holder for communication

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6th Gen. Intel® Core™ i3/ i5/ i7 Modular Expansion Fanless Box PC

Features ƒ 6th Gen. Intel® Core™ i3/i5/i7 mobile processor (BGA) ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays : internal /

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Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Features ƒ Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays: in

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Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Features ƒ Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays: in

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Expansion Module for ARK-3530F PCIe x16 slot support add-on Graphic card up to 120W

Features ƒ PCIe x16 slot support add-on Graphic card up to 120W ƒ Smart Fan function for adjusting the fan speed automatically by CPU and system temperature

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Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Features ƒ Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays: in

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Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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Intel® 12th Gen Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC

Features ƒ Support Intel® 12th Gen. Core™ i3/i5/i7/i9 processor ƒ Triple independent display: HDMI + HDMI + Optional Display ƒ DDR5 SO-DIMM memory support up to 64 GB ƒ 9-36VDC wide range power input ƒ Up to 3sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support up to 4GbE, 8USB, 8COM,

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Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC

Features ƒ Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: HDMI + HDMI + Optional Display ƒ DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 9-36VDC wide range power input ƒ Up to 3sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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研华科技

Simplifying the multi-cloud with a domain focus application

Features ƒ High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor ƒ Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services ƒ Integrated IoT software for private cloud deployment, pla

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研华科技

Simplifying the multi-cloud with a domain focus application

Features ƒ High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor ƒ Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services ƒ Integrated IoT software for private cloud deployment, pla

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研华科技

Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Features ƒ Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays: in

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Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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研华科技

Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC

Features ƒ Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: HDMI + HDMI + Optional Display ƒ DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 9-36VDC wide range power input ƒ Up to 3sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

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6th Gen. Intel® Core™ i3/ i5/ i7 Modular Expansion Fanless Box PC

Features ƒ 6th Gen. Intel® Core™ i3/i5/i7 mobile processor (BGA) ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays : internal /

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研华科技

Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Features ƒ Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays: in

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研华科技

Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC

Features ƒ Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: HDMI + HDMI + Optional Display ƒ DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 9-36VDC wide range power input ƒ Up to 3sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

ADVANTECH

研华科技

Simplifying the multi-cloud with a domain focus application

Features ƒ High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor ƒ Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services ƒ Integrated IoT software for private cloud deployment, pla

ADVANTECH

研华科技

6th Gen. Intel® Core™ i3/ i5/ i7 Modular Expansion Fanless Box PC

Features ƒ 6th Gen. Intel® Core™ i3/i5/i7 mobile processor (BGA) ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays : internal /

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研华科技

Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Features ƒ Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays: in

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研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

ADVANTECH

研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

ADVANTECH

研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

ADVANTECH

研华科技

Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC

Features ƒ Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: HDMI + HDMI + Optional Display ƒ DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 9-36VDC wide range power input ƒ Up to 3sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

ADVANTECH

研华科技

Simplifying the multi-cloud with a domain focus application

Features ƒ High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor ƒ Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services ƒ Integrated IoT software for private cloud deployment, pla

ADVANTECH

研华科技

Ultra-slim Fanless Digital Signage Player

Features ƒ Powered by 6th/7th Gen Intel® Core™ and Intel® Celeron® processors ƒ Adopts embedded/non-embedded processors for different application needs ƒ 19mm-thin chassis ideal for space-limited installation ƒ Dual HDMI display output, resolution up to 4096 x 2304 UHD ƒ Fanless & Cable-less

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研华科技

6th Generation Intel® Core™ U series Fanless Signage Player with Triple Independent Display Support

Features ƒ Advanced graphics engine with Intel HD 520 ƒ Supports 4K/Ultra HD resolution by HDMI 2.0 and HEVC video decoding ƒ Integrated with Dual channel DDR4 2133 SO-DIMM ƒ Flexibility for expansion (Mini PCIe and M.2 2230/1630 E Key) and storage devices (2.5 SATA III HDD/SSD,m-SATA) ƒ Con

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Edge Intelligence System with Intel 11th generation with Edge X API and WISE-DeviceOn

Features ƒ Intel 11th gen. Core i5/i3/Celeron ƒ Pre-integrated Edge X with data acquisition API ƒ Pre-integrated WISE-DeviceOn for device management and remote control ƒ 8/16 GB DDR4 Memory Built-in ƒ 64 GB SATA Slim SSD Built-in ƒ Compact 156 x 112 x 60mm dimensions ƒ 4K HDMI and DP 1.4a D

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研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

ADVANTECH

研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

ADVANTECH

研华科技

Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC

Features ƒ Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 12-36VDC wide range power input ƒ Up to 4sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

ADVANTECH

研华科技

Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC

Features ƒ Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor ƒ Triple independent display: HDMI + HDMI + Optional Display ƒ DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB ƒ 9-36VDC wide range power input ƒ Up to 3sets 2.5 hard drive bays, support Intel® SW RAID ƒ Support

ADVANTECH

研华科技

Simplifying the multi-cloud with a domain focus application

Features ƒ High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor ƒ Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services ƒ Integrated IoT software for private cloud deployment, pla

ADVANTECH

研华科技

Intel® 11th gen Core™ i processor with Triple LAN/ Quadruple COM Din-Rail Fanless Box PC

Features ƒ Intel 11th gen. Core i5/i3 ƒ DIN-Rail system with essential I/O ports on front-side bezel ƒ 3 x Intel GbE, 4x RS-232/422/485, 8-bit DIO, optional CANBus ƒ 3 Expansions: M.2 E-Key 2230, M.2 B-Key 2280, 1 x Full-size mSATA share with mPCIe slot ƒ Dual independent displays with one 4

ADVANTECH

研华科技

6th Gen. Intel® Core™ i3/ i5/ i7 Modular Expansion Fanless Box PC

Features ƒ 6th Gen. Intel® Core™ i3/i5/i7 mobile processor (BGA) ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays : internal /

ADVANTECH

研华科技

Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC

Features ƒ Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays: in

ADVANTECH

研华科技

Intel® Celeron™ N3350 DC SoC With Four Serial Ports Modular Fanless Box PC

Features ƒ Intel® Celeron™ N3350 Dual Core SoC ƒ VGA Display, 4 x RS-232/422/485, 2 x USB3.0 ƒ 1 x full-size miniPCIe for communication module #1 ƒ 1 x 2.5 SATA III drive bay and 1 x half-size mSATA ƒ -20 ~ 60 °C extended operating temperature ƒ 12V lockable DC jack power input ƒ Optional 1

ADVANTECH

研华科技

Intel® Atom™ E3940 QC SoC With Dual HDMI/ Dual LAN/ Four USB Modular Fanless Box PC

Features ƒ Intel® Atom™ E3940 Quad Core SoC ƒ Dual HDMI independent display support 4K resolution ƒ 1 x Full-size miniPCIe with SIM holder for communication module #1 ƒ 1 x M.2 2230 E Key for WIFI module #2 ƒ 1 x 2.5 SATA III SSD/HDD and 1 x mSATA ƒ TPM built in for system security ƒ -20 ~

ADVANTECH

研华科技

Intel® Celeron™ N3350 DC SoC With Dual LAN/ Four USB 3.0/M.2/TPM IoT Gateway Modular Fanless Box PC

Features ƒ Intel® Celeron™ N3350 Dual Core SoC ƒ VGA Display/2x RS-232/422/485/4x USB 3.0 ƒ 1 x Full-size miniPCIe with SIM holder for communication module #1 ƒ 1 x M.2 E-key for WIFI module #2 ƒ -20 ~ 60 °C extended operating temperature ƒ TPM 2.0 default built-in ƒ 12V lockable DC jack po

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研华科技

Intel® Celeron™ N3160 Fanless Embedded Box PC with Rich Expansion and Dual Removable 2.5

Features ƒƒ Intel® Celeron™ N3160 Quad Core 2.24GHz SoC with Turbo boost Support ƒƒ Supports VGA /DVI-D/HDMI triple independent display ƒƒ Support 2 GbE, 3 USB 3.0, 3 USB 2.0, 1 DIO, audio and 4 COM ports ƒƒ Two removable 2.5 SATA HDD drive bays ƒƒ Flexible Expansion via PCI/PCIe x1 ƒƒ Suppo

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研华科技

Intel® Celeron™ N3160 Fanless Embedded Box PC with Rich Expansion and Dual Removable 2.5

Features ƒƒ Intel® Celeron™ N3160 Quad Core 2.24GHz SoC with Turbo boost Support ƒƒ Supports VGA /DVI-D/HDMI triple independent display ƒƒ Support 2 GbE, 3 USB 3.0, 3 USB 2.0, 1 DIO, audio and 4 COM ports ƒƒ Two removable 2.5 SATA HDD drive bays ƒƒ Flexible Expansion via PCI/PCIe x1 ƒƒ Suppo

ADVANTECH

研华科技

Ultra-slim Fanless Digital Signage Player

Features ƒ Powered by 6th/7th Gen Intel® Core™ and Intel® Celeron® processors ƒ Adopts embedded/non-embedded processors for different application needs ƒ 19mm-thin chassis ideal for space-limited installation ƒ Dual HDMI display output, resolution up to 4096 x 2304 UHD ƒ Fanless & Cable-less

ADVANTECH

研华科技

6th Generation Intel® Core™ U series Fanless Signage Player with Triple Independent Display Support

Features ƒ Advanced graphics engine with Intel HD 520 ƒ Supports 4K/Ultra HD resolution by HDMI 2.0 and HEVC video decoding ƒ Integrated with Dual channel DDR4 2133 SO-DIMM ƒ Flexibility for expansion (Mini PCIe and M.2 2230/1630 E Key) and storage devices (2.5 SATA III HDD/SSD,m-SATA) ƒ Con

ADVANTECH

研华科技

Intel® Atom™ E3940 QC SoC With Dual HDMI/ Dual LAN/ Four USB Modular Fanless Box PC

Features ƒ Intel® Atom™ E3940 Quad Core SoC ƒ Dual HDMI independent display support 4K resolution ƒ 1 x Full-size miniPCIe with SIM holder for communication module #1 ƒ 1 x M.2 2230 E Key for WIFI module #2 ƒ 1 x 2.5 SATA III SSD/HDD and 1 x mSATA ƒ TPM built in for system security ƒ -20 ~

ADVANTECH

研华科技

Intel® Celeron™ N3350 DC SoC With Dual LAN/ Four USB 3.0/M.2/TPM IoT Gateway Modular Fanless Box PC

Features ƒ Intel® Celeron™ N3350 Dual Core SoC ƒ VGA Display/2x RS-232/422/485/4x USB 3.0 ƒ 1 x Full-size miniPCIe with SIM holder for communication module #1 ƒ 1 x M.2 E-key for WIFI module #2 ƒ -20 ~ 60 °C extended operating temperature ƒ TPM 2.0 default built-in ƒ 12V lockable DC jack po

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研华科技

Intel Celeron N3350 DC SoC With Dual LAN/ Four USB 3.0/M.2/TPM IoT Gateway Modular Fanless Box PC

文件:1.35916 Mbytes Page:3 Pages

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Intel 6th Generation Core i3/i5/i7 Modular Fanless Box PC

文件:1.33531 Mbytes Page:4 Pages

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研华科技

Intel 6th Generation Core i3/i5/i7 Modular Fanless Box PC

文件:1.33531 Mbytes Page:4 Pages

ADVANTECH

研华科技

AMO产品属性

  • 类型

    描述

  • 型号

    AMO

  • 制造商

    Pentair Technical Products/Hoffman

  • 功能描述

    Barrier Plate , 72.12x18.12, Steel

更新时间:2025-8-8 17:28:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
KIRYUNG
24+
SMD
2650
原装优势!绝对公司现货
2015+
SMD/DIP
19889
一级代理原装现货,特价热卖!
PLUSCHIP
23+
QFN
7300
专注配单,只做原装进口现货
N/A
2450+
SMD
6540
只做原装正品现货或订货!终端客户免费申请样品!
HITTITE
23+
SOP8
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
A
24+
b
12
AVX
10
公司优势库存 热卖中!!
PTC
22+
SOP-16
8200
原装现货库存.价格优势!!
ST
23+
原厂原封
16900
正规渠道,只有原装!
ST
2511
原厂原封
16900
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价

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