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AMO价格
参考价格:¥0.0000
型号:AMO-BUSIKJ-BLK 品牌:ETS 备注:这里有AMO多少钱,2025年最近7天走势,今日出价,今日竞价,AMO批发/采购报价,AMO行情走势销售排行榜,AMO报价。型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
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Intel® Celeron™ N3350 DC SoC With Four Serial Ports Modular Fanless Box PC Features Intel® Celeron™ N3350 Dual Core SoC VGA Display, 4 x RS-232/422/485, 2 x USB3.0 1 x full-size miniPCIe for communication module #1 1 x 2.5 SATA III drive bay and 1 x half-size mSATA -20 ~ 60 °C extended operating temperature 12V lockable DC jack power input Optional 1 | ADVANTECH 研华科技 | |||
Intel® Atom™ E3940 QC SoC With Dual HDMI/ Dual LAN/ Four USB Modular Fanless Box PC Features Intel® Atom™ E3940 Quad Core SoC Dual HDMI independent display support 4K resolution 1 x Full-size miniPCIe with SIM holder for communication module #1 1 x M.2 2230 E Key for WIFI module #2 1 x 2.5 SATA III SSD/HDD and 1 x mSATA TPM built in for system security -20 ~ | ADVANTECH 研华科技 | |||
Intel® Celeron™ N3350 DC SoC With Dual LAN/ Four USB 3.0/M.2/TPM IoT Gateway Modular Fanless Box PC Features Intel® Celeron™ N3350 Dual Core SoC VGA Display/2x RS-232/422/485/4x USB 3.0 1 x Full-size miniPCIe with SIM holder for communication module #1 1 x M.2 E-key for WIFI module #2 -20 ~ 60 °C extended operating temperature TPM 2.0 default built-in 12V lockable DC jack po | ADVANTECH 研华科技 | |||
Intel® Atom® E3940 SoC Modular Fanless Box PC Features Intel® Atom® E3940 Quad Core SoC Dual independent displays with one 4K HDMI and one VGA 12V lockable DC jack power input 9-36V power module compatible with all-in-one ordering -20 ~ 60 °C extend operating temperature Mini PCIe expansion with SIM holder for communication | ADVANTECH 研华科技 | |||
Intel® Atom® E3940 SoC Modular Fanless Box PC Features Intel® Atom® E3940 Quad Core SoC Dual independent displays with one 4K HDMI and one VGA 12V lockable DC jack power input 9-36V power module compatible with all-in-one ordering -20 ~ 60 °C extend operating temperature Mini PCIe expansion with SIM holder for communication | ADVANTECH 研华科技 | |||
Intel® Atom® E3940 SoC Modular Fanless Box PC Features Intel® Atom® E3940 Quad Core SoC Dual independent displays with one 4K HDMI and one VGA 12V lockable DC jack power input 9-36V power module compatible with all-in-one ordering -20 ~ 60 °C extend operating temperature Mini PCIe expansion with SIM holder for communication | ADVANTECH 研华科技 | |||
Intel® Atom® E3940 SoC Modular Fanless Box PC Features Intel® Atom® E3940 Quad Core SoC Dual independent displays with one 4K HDMI and one VGA 12V lockable DC jack power input 9-36V power module compatible with all-in-one ordering -20 ~ 60 °C extend operating temperature Mini PCIe expansion with SIM holder for communication | ADVANTECH 研华科技 | |||
6th Gen. Intel® Core™ i3/ i5/ i7 Modular Expansion Fanless Box PC Features 6th Gen. Intel® Core™ i3/i5/i7 mobile processor (BGA) Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays : internal / | ADVANTECH 研华科技 | |||
Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC Features Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays: in | ADVANTECH 研华科技 | |||
Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC Features Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays: in | ADVANTECH 研华科技 | |||
Expansion Module for ARK-3530F PCIe x16 slot support add-on Graphic card up to 120W Features PCIe x16 slot support add-on Graphic card up to 120W Smart Fan function for adjusting the fan speed automatically by CPU and system temperature | ADVANTECH 研华科技 | |||
Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC Features Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays: in | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 12th Gen Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC Features Support Intel® 12th Gen. Core™ i3/i5/i7/i9 processor Triple independent display: HDMI + HDMI + Optional Display DDR5 SO-DIMM memory support up to 64 GB 9-36VDC wide range power input Up to 3sets 2.5 hard drive bays, support Intel® SW RAID Support up to 4GbE, 8USB, 8COM, | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC Features Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: HDMI + HDMI + Optional Display DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB 9-36VDC wide range power input Up to 3sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Simplifying the multi-cloud with a domain focus application Features High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services Integrated IoT software for private cloud deployment, pla | ADVANTECH 研华科技 | |||
Simplifying the multi-cloud with a domain focus application Features High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services Integrated IoT software for private cloud deployment, pla | ADVANTECH 研华科技 | |||
Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC Features Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays: in | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC Features Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: HDMI + HDMI + Optional Display DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB 9-36VDC wide range power input Up to 3sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
6th Gen. Intel® Core™ i3/ i5/ i7 Modular Expansion Fanless Box PC Features 6th Gen. Intel® Core™ i3/i5/i7 mobile processor (BGA) Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays : internal / | ADVANTECH 研华科技 | |||
Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC Features Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays: in | ADVANTECH 研华科技 | |||
Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC Features Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: HDMI + HDMI + Optional Display DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB 9-36VDC wide range power input Up to 3sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Simplifying the multi-cloud with a domain focus application Features High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services Integrated IoT software for private cloud deployment, pla | ADVANTECH 研华科技 | |||
6th Gen. Intel® Core™ i3/ i5/ i7 Modular Expansion Fanless Box PC Features 6th Gen. Intel® Core™ i3/i5/i7 mobile processor (BGA) Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays : internal / | ADVANTECH 研华科技 | |||
Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC Features Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays: in | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC Features Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: HDMI + HDMI + Optional Display DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB 9-36VDC wide range power input Up to 3sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Simplifying the multi-cloud with a domain focus application Features High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services Integrated IoT software for private cloud deployment, pla | ADVANTECH 研华科技 | |||
Ultra-slim Fanless Digital Signage Player Features Powered by 6th/7th Gen Intel® Core™ and Intel® Celeron® processors Adopts embedded/non-embedded processors for different application needs 19mm-thin chassis ideal for space-limited installation Dual HDMI display output, resolution up to 4096 x 2304 UHD Fanless & Cable-less | ADVANTECH 研华科技 | |||
6th Generation Intel® Core™ U series Fanless Signage Player with Triple Independent Display Support Features Advanced graphics engine with Intel HD 520 Supports 4K/Ultra HD resolution by HDMI 2.0 and HEVC video decoding Integrated with Dual channel DDR4 2133 SO-DIMM Flexibility for expansion (Mini PCIe and M.2 2230/1630 E Key) and storage devices (2.5 SATA III HDD/SSD,m-SATA) Con | ADVANTECH 研华科技 | |||
Edge Intelligence System with Intel 11th generation with Edge X API and WISE-DeviceOn Features Intel 11th gen. Core i5/i3/Celeron Pre-integrated Edge X with data acquisition API Pre-integrated WISE-DeviceOn for device management and remote control 8/16 GB DDR4 Memory Built-in 64 GB SATA Slim SSD Built-in Compact 156 x 112 x 60mm dimensions 4K HDMI and DP 1.4a D | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 10th Gen Xeon® W / Core™ i LGA1200 Expansion Fanless Box PC Features Support Intel® 10th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM ECC/non-ECC memory support up to 64 GB 12-36VDC wide range power input Up to 4sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Intel® 12th Gen Xeon® W Core™ i3/i5/i7/i9 LGA1700 Expansion Fanless Box PC Features Support Intel® 12th Gen. Xeon® W and Core™ i3/i5/i7/i9 processor Triple independent display: HDMI + HDMI + Optional Display DDR5 SO-DIMM ECC/non-ECC memory support up to 64 GB 9-36VDC wide range power input Up to 3sets 2.5 hard drive bays, support Intel® SW RAID Support | ADVANTECH 研华科技 | |||
Simplifying the multi-cloud with a domain focus application Features High-performance edge cloud server with Intel® 10th Gen. Xeon® W and Core™ i3/i7 processor Available with open and standard structure: Kubernetes (MicroK8S) built-in, multiple DB connections, and on-demand micro-services Integrated IoT software for private cloud deployment, pla | ADVANTECH 研华科技 | |||
Intel® 11th gen Core™ i processor with Triple LAN/ Quadruple COM Din-Rail Fanless Box PC Features Intel 11th gen. Core i5/i3 DIN-Rail system with essential I/O ports on front-side bezel 3 x Intel GbE, 4x RS-232/422/485, 8-bit DIO, optional CANBus 3 Expansions: M.2 E-Key 2230, M.2 B-Key 2280, 1 x Full-size mSATA share with mPCIe slot Dual independent displays with one 4 | ADVANTECH 研华科技 | |||
6th Gen. Intel® Core™ i3/ i5/ i7 Modular Expansion Fanless Box PC Features 6th Gen. Intel® Core™ i3/i5/i7 mobile processor (BGA) Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays : internal / | ADVANTECH 研华科技 | |||
Intel®Xeon® E3 / Core™ i3/i5/i7 LGA1151 Modular Expansion Fanless Box PC Features Support Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 processor Triple independent display: VGA + HDMI + Optional Display DDR4 SO-DIMM memory support up to 32 GB Option 9-36V power module compatible with all-in-one ordering Optional modular design for 2.5 hard drive bays: in | ADVANTECH 研华科技 | |||
Intel® Celeron™ N3350 DC SoC With Four Serial Ports Modular Fanless Box PC Features Intel® Celeron™ N3350 Dual Core SoC VGA Display, 4 x RS-232/422/485, 2 x USB3.0 1 x full-size miniPCIe for communication module #1 1 x 2.5 SATA III drive bay and 1 x half-size mSATA -20 ~ 60 °C extended operating temperature 12V lockable DC jack power input Optional 1 | ADVANTECH 研华科技 | |||
Intel® Atom™ E3940 QC SoC With Dual HDMI/ Dual LAN/ Four USB Modular Fanless Box PC Features Intel® Atom™ E3940 Quad Core SoC Dual HDMI independent display support 4K resolution 1 x Full-size miniPCIe with SIM holder for communication module #1 1 x M.2 2230 E Key for WIFI module #2 1 x 2.5 SATA III SSD/HDD and 1 x mSATA TPM built in for system security -20 ~ | ADVANTECH 研华科技 | |||
Intel® Celeron™ N3350 DC SoC With Dual LAN/ Four USB 3.0/M.2/TPM IoT Gateway Modular Fanless Box PC Features Intel® Celeron™ N3350 Dual Core SoC VGA Display/2x RS-232/422/485/4x USB 3.0 1 x Full-size miniPCIe with SIM holder for communication module #1 1 x M.2 E-key for WIFI module #2 -20 ~ 60 °C extended operating temperature TPM 2.0 default built-in 12V lockable DC jack po | ADVANTECH 研华科技 | |||
Intel® Celeron™ N3160 Fanless Embedded Box PC with Rich Expansion and Dual Removable 2.5 Features Intel® Celeron™ N3160 Quad Core 2.24GHz SoC with Turbo boost Support Supports VGA /DVI-D/HDMI triple independent display Support 2 GbE, 3 USB 3.0, 3 USB 2.0, 1 DIO, audio and 4 COM ports Two removable 2.5 SATA HDD drive bays Flexible Expansion via PCI/PCIe x1 Suppo | ADVANTECH 研华科技 | |||
Intel® Celeron™ N3160 Fanless Embedded Box PC with Rich Expansion and Dual Removable 2.5 Features Intel® Celeron™ N3160 Quad Core 2.24GHz SoC with Turbo boost Support Supports VGA /DVI-D/HDMI triple independent display Support 2 GbE, 3 USB 3.0, 3 USB 2.0, 1 DIO, audio and 4 COM ports Two removable 2.5 SATA HDD drive bays Flexible Expansion via PCI/PCIe x1 Suppo | ADVANTECH 研华科技 | |||
Ultra-slim Fanless Digital Signage Player Features Powered by 6th/7th Gen Intel® Core™ and Intel® Celeron® processors Adopts embedded/non-embedded processors for different application needs 19mm-thin chassis ideal for space-limited installation Dual HDMI display output, resolution up to 4096 x 2304 UHD Fanless & Cable-less | ADVANTECH 研华科技 | |||
6th Generation Intel® Core™ U series Fanless Signage Player with Triple Independent Display Support Features Advanced graphics engine with Intel HD 520 Supports 4K/Ultra HD resolution by HDMI 2.0 and HEVC video decoding Integrated with Dual channel DDR4 2133 SO-DIMM Flexibility for expansion (Mini PCIe and M.2 2230/1630 E Key) and storage devices (2.5 SATA III HDD/SSD,m-SATA) Con | ADVANTECH 研华科技 | |||
Intel® Atom™ E3940 QC SoC With Dual HDMI/ Dual LAN/ Four USB Modular Fanless Box PC Features Intel® Atom™ E3940 Quad Core SoC Dual HDMI independent display support 4K resolution 1 x Full-size miniPCIe with SIM holder for communication module #1 1 x M.2 2230 E Key for WIFI module #2 1 x 2.5 SATA III SSD/HDD and 1 x mSATA TPM built in for system security -20 ~ | ADVANTECH 研华科技 | |||
Intel® Celeron™ N3350 DC SoC With Dual LAN/ Four USB 3.0/M.2/TPM IoT Gateway Modular Fanless Box PC Features Intel® Celeron™ N3350 Dual Core SoC VGA Display/2x RS-232/422/485/4x USB 3.0 1 x Full-size miniPCIe with SIM holder for communication module #1 1 x M.2 E-key for WIFI module #2 -20 ~ 60 °C extended operating temperature TPM 2.0 default built-in 12V lockable DC jack po | ADVANTECH 研华科技 | |||
Intel Celeron N3350 DC SoC With Dual LAN/ Four USB 3.0/M.2/TPM IoT Gateway Modular Fanless Box PC 文件:1.35916 Mbytes Page:3 Pages | ADVANTECH 研华科技 | |||
Intel 6th Generation Core i3/i5/i7 Modular Fanless Box PC 文件:1.33531 Mbytes Page:4 Pages | ADVANTECH 研华科技 | |||
Intel 6th Generation Core i3/i5/i7 Modular Fanless Box PC 文件:1.33531 Mbytes Page:4 Pages | ADVANTECH 研华科技 |
AMO产品属性
- 类型
描述
- 型号
AMO
- 制造商
Pentair Technical Products/Hoffman
- 功能描述
Barrier Plate , 72.12x18.12, Steel
IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
KIRYUNG |
24+ |
SMD |
2650 |
原装优势!绝对公司现货 |
|||
2015+ |
SMD/DIP |
19889 |
一级代理原装现货,特价热卖! |
||||
PLUSCHIP |
23+ |
QFN |
7300 |
专注配单,只做原装进口现货 |
|||
N/A |
2450+ |
SMD |
6540 |
只做原装正品现货或订货!终端客户免费申请样品! |
|||
HITTITE |
23+ |
SOP8 |
3000 |
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、 |
|||
A |
24+ |
b |
12 |
||||
AVX |
10 |
公司优势库存 热卖中!! |
|||||
PTC |
22+ |
SOP-16 |
8200 |
原装现货库存.价格优势!! |
|||
ST |
23+ |
原厂原封 |
16900 |
正规渠道,只有原装! |
|||
ST |
2511 |
原厂原封 |
16900 |
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价 |
AMO规格书下载地址
AMO参数引脚图相关
- avb
- atmega8
- atmega16
- atmega
- at91sam9263
- at91sam9261
- at89s52
- at89s51
- at89c52
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- at89c2051
- as3410
- arm应用
- arm内核
- arm11
- an983b
- an158
- ams1117
- amp连接器
- AMP04FP
- AMP04ES
- AMP04EP
- AMP04
- AMP03GS
- AMP03GP
- AMP03FJ
- AMP03BJ
- AMP03
- AMP02FS
- AMP02FPZ
- AMP02FP
- AMP02EPZ
- AMP02EP
- AMP02
- AMP01GSZ
- AMP01GS
- AMP01FX
- AMP01EX
- AMP01BX
- AMP01AX
- AMP01
- AMO-WIFI05E
- AMO-S1
- AMO-R010E
- AMO-MB3
- amoled
- AMO-BUSIKJ-BLU
- AMO-BUSIKJ-BLK
- A-MO-8/8-SRS
- A-MO-8/8-SFS-R
- A-MO-6/6-SF
- A-MO-6/4-F50
- A-MO-4/4-SR
- A-MO-4/4-SF
- A-MO-10/10-F50
- AMN44122
- AMN44121
- AMN43122
- AMN43121
- AMN42122
- AMN42121
- AMN41122
- AMN41121
- AMN34112
- AMN34111
- AMN33112
- AMN33111
- AMN32112
- AMN32111
- AMN31112
- AMN31111
- AMN24112
- AMN24111
- AMN23112
- AMN23111
- AMM-4SF
- AMM-4F
- AMM-2IF
- AMM-2F
- AMLKBX
- AMLKB4
- AMLKB2
- AMLD-Z
- AMLD-RZ
- AMLDL-Z
- AMLD-IZ
- AMLB-Z
- AMLBW-Z
- AMLB-IZ
- AML52-N
- AML51-J
- AML51-C
- AML51
- AML3400
- AML2002
AMO数据表相关新闻
AMPHENOL WEIDMULLER JST CVILUX KET KST BOSCH/博世 DELPHI/德尔福 APTIV/安波福 TE/泰科 MOLEX
AMPHENOL WEIDMULLER JST CVILUX KET KST BOSCH/博世 DELPHI/德尔福 APTIV/安波福 TE/泰科 MOLEX
2025-3-26AMPHENOL/FCI 原装正品 51742-10602400CALF 电源对板连接器
型号:51742-10602400CALF 品牌:AMPHENOL/FCI 封装:电源对板连接器 包装:528PCS/包 原装正品 公司现货库存!
2020-8-19AMMP-6333
射频放大器 18 - 33 GHz 0.2W Driver Amplifier in SMT Package
2019-12-9AMMC-6241
射频放大器 LNA MMIC 30-41GHz
2019-12-9AMPI0410ED100MT
AMPI0410ED100MT,全新原装当天发货或门市自取0755-82732291.
2019-3-28AMMP-6233-BLKG深圳市迈仕达电子科技有限公司
功能描述射频放大器 7-21GHz High Lin LNARoHS否制造商Skyworks Solutions, Inc.类型Low Noise Amplifier工作频率2.3 GHz to 2.8 GHzP1dB18.5 dBm输出截获点37.5 dBm功率增益类型32 dB噪声系数0.85 dB工作电源电压5 V电源电流125 mA测试频率2.6 GHz最大工作温度+ 85 C安装风格SMD/SMT封装 / 箱体QFN-16封装Reel
2019-3-22
DdatasheetPDF页码索引
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