6th Gen. Intel® Core™ i3/ i5/ i7 Modular Expansion Fanless Box PC

Features ƒ 6th Gen. Intel® Core™ i3/i5/i7 mobile processor (BGA) ƒ Triple independent display: VGA + HDMI + Optional Display ƒ DDR4 SO-DIMM memory support up to 32 GB ƒ Option 9-36V power module compatible with all-in-one ordering ƒ Optional modular design for 2.5 hard drive bays : internal /

LINEAR OUTPUT HALL EFFECT SENSORS

LINEAR OUTPUT HALL EFFECT SENSORS

Low Thermal EMF Reed Relays

LOW THERMAL EMF REED RELAYS The 3500 Series is ideally suited to the needs of Instrumentation, Data Acquisition and Process Control. The specification tables allow you to select the appropriate relay for your particular application. Recommended for use in high accuracy DVM’s, Multiplexers and Dig

RAST 2.5 connectors, pitch 2.5/5.0 mm

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4700

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Premier Supplier of Electronic Hardware

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