型号 功能描述 生产厂家&企业 LOGO 操作
ADSP-BF703

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

封装/外壳:184-LFBGA,CSPBGA 包装:托盘 描述:IC DSP LP 256KB L2SR 184BGA 集成电路(IC) DSP(数字信号处理器)

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

封装/外壳:184-LFBGA,CSPBGA 包装:管件 描述:IC DSP LP 256KB L2SR 184BGA 集成电路(IC) DSP(数字信号处理器)

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

702/703 Flanged Diaphragm Seal

FEATURES „„ Large diaphragm provides ample displacement for low pressure applications

ASHCROFT

雅斯科

702/703 Flanged Diaphragm Seal

FEATURES „„ Large diaphragm provides ample displacement for low pressure applications

ASHCROFT

雅斯科

PHENOLIC INSTRUMENT CASES

[KEYSTONE] PHENOLIC INSTRUMENT CASES •Choice of Sizes •Sturdy construction •Flush mounting panels •Cases and panels are sold separately •Covers available in Phenolic or Aluminum •Covers can be machined to accept dials, switches, displays •Panel mounting screws available

etc2List of Unclassifed Manufacturers

etc未分类制造商etc2未分类制造商

Capacity (20-hour) 280Ah

文件:258.29 Kbytes Page:1 Pages

GSYUASABATTERY

Toggle switches

文件:506.4 Kbytes Page:3 Pages

APEX-ELECTRONICS

更新时间:2025-8-13 12:35:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ADI(亚德诺)/LINEAR
2021+
-
499
Analog Devices Inc.
23+
184-CSPBGA12x12
7300
专注配单,只做原装进口现货
ADI(亚德诺)
2511
CSPBGA-184
5904
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价
ADI(亚德诺)
24+
N/A
10000
原装,正品
ADI/亚德诺
23+
TRAY
3000
只做原装正品,假一赔十
Analog Devices Inc.
23+
184-LFBGA
11200
主营:汽车电子,停产物料,军工IC
Analog Devices Inc.
25+
184-LFBGA,CSPBGA
25000
DSP数字信号处理器-中天科工原装正品
ADI(亚德诺)
24+
BGA-184(12x12)
1040
深耕行业12年,可提供技术支持。
ADI/亚德诺
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
ADI
25+
电联咨询
7800
公司现货,提供拆样技术支持

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