型号 功能描述 生产厂家 企业 LOGO 操作
ADSP-BF703

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

ADSP-BF703

低功耗400MHz BLACKFIN+嵌入式处理器,带256KB L2 SRAM和DDR2/LPDDR接口

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Blackfin Core Embedded Processor

FEATURES Blackfin+ core with up to 400 MHz performance Dual 16-bit or single 32-bit MAC support per cycle 16-bit complex MAC and many other instruction set enhancements Instruction set compatible with previous Blackfin products Low-cost packaging 88-Lead LFCSP_VQ (QFN) package (12 mm × 12 m

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

封装/外壳:184-LFBGA,CSPBGA 包装:托盘 描述:IC DSP LP 256KB L2SR 184BGA 集成电路(IC) DSP(数字信号处理器)

AD

亚德诺

封装/外壳:184-LFBGA,CSPBGA 包装:管件 描述:IC DSP LP 256KB L2SR 184BGA 集成电路(IC) DSP(数字信号处理器)

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

Instruction set compatible with previous Blackfin products

文件:2.96096 Mbytes Page:116 Pages

AD

亚德诺

702/703 Flanged Diaphragm Seal

FEATURES „„ Large diaphragm provides ample displacement for low pressure applications

ASHCROFT

雅斯科

702/703 Flanged Diaphragm Seal

FEATURES „„ Large diaphragm provides ample displacement for low pressure applications

ASHCROFT

雅斯科

PHENOLIC INSTRUMENT CASES

[KEYSTONE] PHENOLIC INSTRUMENT CASES •Choice of Sizes •Sturdy construction •Flush mounting panels •Cases and panels are sold separately •Covers available in Phenolic or Aluminum •Covers can be machined to accept dials, switches, displays •Panel mounting screws available

ETCList of Unclassifed Manufacturers

未分类制造商

Capacity (20-hour) 280Ah

文件:258.29 Kbytes Page:1 Pages

GSYUASABATTERY

Toggle switches

文件:506.4 Kbytes Page:3 Pages

APEX-ELECTRONICS

更新时间:2025-12-28 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ADI(亚德诺)
24+
BGA-184(12x12)
1040
深耕行业12年,可提供技术支持。
ADI(亚德诺)
24+
CSPBGA-184
7628
原厂可订货,技术支持,直接渠道。可签保供合同
Analog
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
Analog Devices Inc.
23+
184-LFBGA,CSPBGA
3500
只做原装,假一赔十
ADI/亚德诺
23+
TRAY
3000
只做原装正品,假一赔十
ADI/亚德诺
25+
原厂封装
10280
原厂授权代理,专注军工、汽车、医疗、工业、新能源!
ADI(亚德诺)
23+
N/A
10000
公司只做原装,可来电咨询
ADI(亚德诺)/LINEAR
2447
-
315000
189个/托盘一级代理专营品牌!原装正品,优势现货,长
Analog Devices Inc.
23+
184-LFBGA
11200
主营:汽车电子,停产物料,军工IC
Analog Devices Inc.
25+
184-LFBGA,CSPBGA
25000
DSP数字信号处理器-中天科工原装正品

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