NPN SILICON TRANSISTOR

9012 Transistor Chip Manual █ Introduction to the chip Chip size: 4 inches (100mm) Chip code: A043BJ-00 Chip thickness: 240±20µm Die size: 430× 430µm 2 Welding position size: B pole 107×107µm2, E pole 101×101µm2 Electrode metal: aluminum Back metal: gold Typical pa

晶体管

NPN SILICON TRANSISTOR

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晶体管

RADIATION HARDENED SEGR-RESISTANT N-CHANNEL ENHANCEMENT MODE POWER MOSFET

Features • Harris FSC260R die • total dose: 100 kRAD(Si) within pre-radiation parameter limits • dose rate: 3 x 109RAD(Si)/sec @ 80BVDSS typical • dose rate: 2 x 1012RAD(Si)/sec @ ID £IDM typical • neutron: 1013 neutrons/cm2 within pre-radiation parameter limits • photocurrent: 17 nA/RAD(Si)

RADIATION HARDENED SEGR-RESISTANT N-CHANNEL ENHANCEMENT MODE POWER MOSFET

Features • Harris FSC260R die • total dose: 100 kRAD(Si) within pre-radiation parameter limits • dose rate: 3 x 109RAD(Si)/sec @ 80BVDSS typical • dose rate: 2 x 1012RAD(Si)/sec @ ID £IDM typical • neutron: 1013 neutrons/cm2 within pre-radiation parameter limits • photocurrent: 17 nA/RAD(Si)

SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

VBR: 6.8 - 440 Volts PPK: 400 Watts FEATURES : * 400W surge capability at 1ms * Excellent clamping capability * Low zener impedance * Fast response time : typically less then 1.0 ps from 0 volt to VBR(min.) * Typical IR less then 1mA above 10V

SURFACE MOUNT TRANSIENT VOLTAGE SUPPRESSOR

VBR : 6.8 - 440 Volts PPK : 400 Watts FEATURES : * 400W surge capability at 1ms * Excellent clamping capability * Low zener impedance * Fast response time : typically less then 1.0 ps from 0 volt to VBR(min.) * Typical IR less then 1mA above 10V * Pb / RoHS Free

Silicon planar type

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