包装：散装 描述：HEX DIE 9/16-18 工具 专用工具

TPSM8286xA 2.4V to 5.5V Input, 4A/6A Step-Down Power Module with Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

TPSM8286xA 2.4V to 5.5V Input, 4A/6A, Step-Down Power Module With Integrated Inductor in a Thin, Overmolded QFN and MagPack™ Package

1 Features • Up to 96% efficiency • Excellent thermal performance • 1% output voltage accuracy • DCS-Control topology for fast transient response • Designed for low EMI requirements – MagPack technology shields inductor and IC – No bond wire package – Simplified layout through opti

TPSM8286xx 2.4V to 5.5V Input, 4A/6A, Step-Down MagPack™ Power Module With Integrated Inductor and I2C interface

1 Features • Up to 96% efficiency • Excellent thermal performance • I2C-compatible interface up to 3.4Mbps • 1% output voltage accuracy • DCS-Control topology for fast transient response • I2C Programmable: – Output voltage • 0.4 – 1.675V in 5mV steps • 0.8 – 3.35V in 10mV steps

TPSM82864A/TPSM82866A 2.4-V to 5.5-V Input, 4-A/6-A Step-Down Power Module with an Integrated Inductor in a 3.5-mm 횞 4.0-mm Thin Overmolded QFN Package

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