8103价格

参考价格:¥0.7605

型号:8103 品牌:VIDEK 备注:这里有8103多少钱,2025年最近7天走势,今日出价,今日竞价,8103批发/采购报价,8103行情走势销售排行榜,8103报价。
型号 功能描述 生产厂家 企业 LOGO 操作
8103

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

8103

包装:散装 描述:CBL CLAMP P-TYPE SILVER FASTENER 电缆,电线 - 管理 电缆支撑与紧固件

KEYSTONE

Keystone Electronics Corp.

8103

封装/外壳:垂直式,4 PC 引脚 包装:托盘 描述:CMC 1MH 4.8A 2LN TH 滤波器 共模扼流圈

ETC

知名厂家

8103

T1/CEPT ISDN PRI Transformers

文件:84.67 Kbytes Page:1 Pages

FILTRAN

费尔兰特

8103

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

8103

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:100.75 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

8103

Low Capacitance for EIA RS-232 and EIA RS-422 Applications

文件:365.47 Kbytes Page:2 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

8103

Thermal Cutoff

文件:61.31 Kbytes Page:1 Pages

NTE

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene짰 insulation, twisted pairs, overall Beldfoil

文件:33.82 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene짰 insulation, twisted pairs, overall Beldfoil

文件:33.82 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene짰 insulation, twisted pairs, overall Beldfoil

文件:33.82 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene짰 insulation, twisted pairs, overall Beldfoil

文件:33.82 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

IC VCXO ATTENUATOR/MULT 32VFQFPN

RENESAS

瑞萨

Twin cylinder

文件:89.44 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:88.76 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:88.16 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:86.86 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:86.74 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:85.04 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:83.32 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:93.95 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:92.77 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:91.98 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:90.82 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:89.35 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:86.78 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:89.5 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:91.58 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:89.76 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:88.57 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:87.27 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:86.13 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:91.44 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

8103产品属性

  • 类型

    描述

  • 型号

    8103

  • 制造商

    Kontron

  • 功能描述

    KTGM45/FLEX W/3XGB LAN, AMT 4.0 SUPPORT - Boxed Product(Development Kits)

更新时间:2025-11-17 23:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
LCCC-20
907
深耕行业12年,可提供技术支持。
MMI
24+
NA/
287
优势代理渠道,原装正品,可全系列订货开增值税票
AMD
24+
CDIP
80000
只做自己库存 全新原装进口正品假一赔百 可开13%增
ST
24+
106
现货供应
KOREA
25+
SOP28
54648
百分百原装现货 实单必成
IDT
1345+
QFN
40
一级代理,专注军工、汽车、医疗、工业、新能源、电力
Molex
25+
600
公司优势库存 热卖中!!
3M
23+
NA
686
专做原装正品,假一罚百!
KOREA
08+
SOP28
880000
明嘉莱只做原装正品现货
BOURNS/伯恩斯
2450+
SMD
6540
只做原厂原装现货或订货假一赔十!

8103数据表相关新闻