8103价格

参考价格:¥0.7605

型号:8103 品牌:VIDEK 备注:这里有8103多少钱,2026年最近7天走势,今日出价,今日竞价,8103批发/采购报价,8103行情走势销售排行榜,8103报价。
型号 功能描述 生产厂家 企业 LOGO 操作
8103

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

8103

包装:散装 描述:CBL CLAMP P-TYPE SILVER FASTENER 电缆,电线 - 管理 电缆支撑与紧固件

KEYSTONE

Keystone Electronics Corp.

8103

封装/外壳:垂直式,4 PC 引脚 包装:托盘 描述:CMC 1MH 4.8A 2LN TH 滤波器 共模扼流圈

ETC

知名厂家

8103

T1/CEPT ISDN PRI Transformers

文件:84.67 Kbytes Page:1 Pages

FILTRAN

费尔兰特

8103

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

8103

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:100.75 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

8103

Low Capacitance for EIA RS-232 and EIA RS-422 Applications

文件:365.47 Kbytes Page:2 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

8103

Thermal Cutoff

文件:61.31 Kbytes Page:1 Pages

NTE

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

Belden Inc. [BELDEN]^1310

Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.

BELDEN

百通

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

STANDARD HIGH-SPEED PAL) CIRCUITS

Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices

TI

德州仪器

LAB PAL™ LABEL PRINTER

文件:708.07 Kbytes Page:1 Pages

Brady

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene짰 insulation, twisted pairs, overall Beldfoil

文件:33.82 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene짰 insulation, twisted pairs, overall Beldfoil

文件:33.82 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene짰 insulation, twisted pairs, overall Beldfoil

文件:33.82 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene짰 insulation, twisted pairs, overall Beldfoil

文件:33.82 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

24 AWG stranded (7x32) TC conductors, Datalene insulation

文件:103.16 Kbytes Page:3 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

IC VCXO ATTENUATOR/MULT 32VFQFPN

RENESAS

瑞萨

LAB PAL™ LABEL PRINTER

文件:708.07 Kbytes Page:1 Pages

Brady

Twin cylinder

文件:89.44 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:88.76 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:88.16 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:86.86 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:86.74 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:85.04 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:83.32 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:93.95 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:92.77 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:91.98 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:90.82 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:89.35 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:86.78 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:89.5 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:91.58 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:89.76 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:88.57 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

Twin cylinder

文件:87.27 Kbytes Page:1 Pages

FESTOFesto Corporation.

费斯托费斯托(中国)有限公司

8103产品属性

  • 类型

    描述

  • 型号

    8103

  • 功能描述

    共模滤波器/扼流器 1mH MIN

  • RoHS

  • 制造商

    TDK

  • 阻抗

    35 Ohms

  • 最大直流电流

    0.1 A

  • 最大直流电阻

    1.5 Ohms

  • 自谐振频率

    Q

  • 工作温度范围

    - 25 C to + 85 C

  • 端接类型

    SMD/SMT

  • 封装/箱体

    0302(0806 metric)

  • 系列

    TCE

更新时间:2026-1-1 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
MMI
24+
NA/
287
优势代理渠道,原装正品,可全系列订货开增值税票
TI(德州仪器)
24+
LCCC-20
907
深耕行业12年,可提供技术支持。
AMD
24+
CDIP
80000
只做自己库存 全新原装进口正品假一赔百 可开13%增
KOREA
25+
SOP28
54648
百分百原装现货 实单必成
KOREA
08+
SOP28
880000
明嘉莱只做原装正品现货
3M
23+
NA
686
专做原装正品,假一罚百!
TI
24+
10
Texas
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
Molex
25+
600
公司优势库存 热卖中!!
3M
5
全新原装 货期两周

8103数据表相关新闻