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8103价格

参考价格：￥0.7605

型号：8103 品牌：VIDEK 备注：这里有8103多少钱，2026年最近7天走势，今日出价，今日竞价，8103批发/采购报价，8103行情走势销售排行榜，8103报价。

型号	功能描述	生产厂家企业	LOGO
8103	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
8103	Gender Changers & Port Savers Low Profile Gender Changers Features & Benefits Compact space saving design Competitive price without compromise to quality Comprehensive selection of connector types	VIDEK	VIDEK
8103	包装：散装描述：CBL CLAMP P-TYPE SILVER FASTENER 电缆，电线 - 管理电缆支撑与紧固件	KEYSTONE Keystone Electronics Corp.	KEYSTONE
8103	封装/外壳：垂直式，4 PC 引脚包装：托盘描述：CMC 1MH 4.8A 2LN TH 滤波器共模扼流圈	ETC 知名厂家	ETC
8103	T1/CEPT ISDN PRI Transformers 文件：84.67 Kbytes Page：1 Pages	FILTRAN 费尔兰特	FILTRAN
8103	Thermal Cutoff 文件：61.31 Kbytes Page：1 Pages	NTE	NTE
8103	24 AWG stranded (7x32) TC conductors, Datalene insulation 文件：103.16 Kbytes Page：3 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
8103	24 AWG stranded (7x32) TC conductors, Datalene insulation 文件：100.75 Kbytes Page：3 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
8103	Low Capacitance for EIA RS-232 and EIA RS-422 Applications 文件：365.47 Kbytes Page：2 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC
8103	METAL CABLE CLAMPS 文件：279.99 Kbytes Page：1 Pages	KEYSTONE Keystone Electronics Corp.	KEYSTONE
81036072A	丝印代码：81036072A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
8103607RA	丝印代码：8103607RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
8103607SA	丝印代码：8103607SA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
81036082A	丝印代码：81036082A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
8103608RA	丝印代码：8103608RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
81036092A	丝印代码：81036092A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
8103609RA	丝印代码：8103609RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
81036102A	丝印代码：81036102A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
8103610RA	丝印代码：8103610RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
8103610SA	丝印代码：8103610SA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
81036112A	丝印代码：81036112A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
8103611RA	丝印代码：8103611RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
81036142A	丝印代码：81036142A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8A-2MFKB	丝印代码：81036112A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8A-2MFKB.A	丝印代码：81036112A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8A-2MJB	丝印代码：8103611RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8A-2MJB.A	丝印代码：8103611RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8AMFKB	丝印代码：81036072A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8AMFKB.A	丝印代码：81036072A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8AMJB	丝印代码：8103607RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8AMJB.A	丝印代码：8103607RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8AMWB	丝印代码：8103607SA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16L8AMWB.A	丝印代码：8103607SA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R4A-2MFKB	丝印代码：81036142A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R4A-2MFKB.A	丝印代码：81036142A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R4AMFKB	丝印代码：81036102A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R4AMFKB.A	丝印代码：81036102A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R4AMJB	丝印代码：8103610RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R4AMJB.A	丝印代码：8103610RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R4AMWB	丝印代码：8103610SA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R4AMWB.A	丝印代码：8103610SA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R6AMFKB	丝印代码：81036092A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R6AMFKB.A	丝印代码：81036092A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R6AMJB	丝印代码：8103609RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R6AMJB.A	丝印代码：8103609RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R8AMFKB	丝印代码：81036082A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R8AMFKB.A	丝印代码：81036082A；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R8AMJB	丝印代码：8103608RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
PAL16R8AMJB.A	丝印代码：8103608RA；STANDARD HIGH-SPEED PAL) CIRCUITS Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min Choice of Input/Output Configuration Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package description These programmable array logic devices	TI 德州仪器	TI
8103.0030	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
8103.00305	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
8103.01152	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
8103.013048	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
8103-060100	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
8103-0601000	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
8103-06010000	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
8103-060500	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
8103-0605000	Belden Inc. [BELDEN]^1310 Product Description Computer EIA RS-232/422 Cable, 24 AWG stranded (7x32) tinned copper conductors, Datalene® insulation, twisted pairs, overall Beldfoil® (100 coverage) + tinned copper braid shield (65 coverage), 24 AWG stranded tinned copper drain wire, PVC jacket.	BELDEN 百通	BELDEN
81030	LAB PAL™ LABEL PRINTER 文件：708.07 Kbytes Page：1 Pages	BRADY	BRADY
8103060100	24 AWG stranded (7x32) TC conductors, Datalene짰 insulation, twisted pairs, overall Beldfoil 文件：33.82 Kbytes Page：3 Pages	ETCList of Unclassifed Manufacturers 未分类制造商	ETC

8103产品属性

类型
描述
符合标准：
欧洲标准 Eca
线芯绞距：
7/32 AWG
阻抗特性：
100 Ω
电缆形状：
双绞线
外层护套材料：
PVC
外径：
7.19mm
护套颜色：
铬
屏蔽类型：
SF/UTP
长度：
152m
屏蔽/无屏蔽：
屏蔽
美国线规：
24 AWG
芯数：
6
横截面积：
0.22 mm²
线对数目：
3

8103供应商更多...

更新时间：2026-8-4 10:20:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
深圳市得捷芯城科技有限公司	8103607RA	TI	25+	-	7786	原装正品现货,原厂订货,可支持含税原型号开票。	询价
深圳市骏凯诚科技有限公司	8103607SA	Advanced Micro Devices	26+	20-CFlatPack	2000	全新原装正品	询价
深圳市英科美电子有限公司	8103-RC	BOURNS/伯恩斯	2223+	SMD	26800	只做原装正品假一赔十为客户做到零风险	询价
深圳市腾亿芯科技有限公司	81035M	ST	25+	高频管	20000	原装，请咨询	询价
现代芯城（深圳）科技有限公司	81036-560303-RB		26+	N/A	46000	一级代理-主营优势-实惠价格-不悔选择	询价
深圳市振宏微科技有限公司	81036-650203	3M	25+	NA	686	专做原装正品,假一罚百!	询价
深圳市富芯乐电子科技有限公司	81036082A	AMD	24+	NA	2195	只做原装正品现货欢迎来电查询15919825718	询价
瀚佳科技(深圳)有限公司	81032E-UE806	KOREA	24+	SOP28	63200	一级代理/放心采购	询价
深圳市高捷芯城科技有限公司	8103-RC	Bourns	25+	N/A	11491	样件支持,可原厂排单订货!	询价
上海市鑫鸿达电子	8103060100		2022+		7	全新原装货期两周	询价

8103芯片相关品牌

8103规格书下载地址

8103参数引脚图相关

8103数据表相关新闻

80RXS1632AALGI
进口代理
2024-8-23
8145L-SOT89R-DTG_UTC代理商
8145L-SOT89R-DTG_UTC代理商
2023-3-6
8145L-SC59.3R-3TG_UTC代理商
8145L-SC59.3R-3TG_UTC代理商
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80亿碳化硅项目建成投产！
80亿碳化硅项目建成投产！
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8121SDV3GE微动瞬时按动开关
8121SDV3GE微动瞬时按动开关 C&K 的 8020 系列微动式瞬间按动开关因触感良好，而且终端选择种类繁多，多被用于电信设备和计算机外围设备。C&K 的 8020 开关端子密封，底部可水洗清洁
2019-8-8
8100-4027
深圳科雨电子有限公司，联系人：卢小姐手机：18975515225 原装正品大量现货，有需要的可以联系我 QQ:97877805 微信：wei555222777
2019-6-20

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找IC，尽在114IC

8103价格

8103产品属性

8103供应商更多...

8103芯片相关品牌

8103规格书下载地址

8103参数引脚图相关

8103数据表相关新闻

80RXS1632AALGI

8145L-SOT89R-DTG_UTC代理商

8145L-SC59.3R-3TG_UTC代理商

80亿碳化硅项目建成投产！

8121SDV3GE微动瞬时按动开关

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