CUSTOMER PRODUCT SPECIFICATION

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Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

Channel style heat sink with folded back fins

Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card.

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包装：散装 描述：HEAT SINK 风扇，热管理 热敏 - 散热器

包装：卷带（TR） 描述：BOARD LEVEL HEAT SINK 风扇，热管理 热敏 - 散热器

How to Use This Catalog

文件：8.73467 Mbytes Page：116 Pages

High voltage high and low-side driver

Features  High voltage rail up to 600 V  dV/dt immunity ± 50 V/ns over full temperature range  Driver current capability: – 290 mA source – 430 mA sink  Switching times 75/35 ns rise/fall with 1 nF load  3.3 V, 5 V TTL/CMOS inputs with hysteresis  Integrated bootstrap diode  Inter

High voltage high and low-side driver

Features  High voltage rail up to 600 V  dV/dt immunity ± 50 V/ns over full temperature range  Driver current capability: – 290 mA source – 430 mA sink  Switching times 75/35 ns rise/fall with 1 nF load  3.3 V, 5 V TTL/CMOS inputs with hysteresis  Integrated bootstrap diode  Inter