6108价格

参考价格:¥347.2180

型号:6108 品牌:Pomona 备注:这里有6108多少钱,2025年最近7天走势,今日出价,今日竞价,6108批发/采购报价,6108行情走势销售排行榜,6108报价。
型号 功能描述 生产厂家&企业 LOGO 操作
6108

40 In. SOIC Clip Test Clip

文件:38.95 Kbytes Page:1 Pages

POMONA

Pomona Electronics

6108

包装:散装 描述:TEST CLIP SOIC 40 (2 X 20) 测试与计量 测试夹 - IC

POMONA

Pomona Electronics

6108

包装:盒 描述:TEST CLIP SOIC 40 (2 X 20) 测试与计量 测试夹 - IC

POMONA

Pomona Electronics

FIBER OPTIC PIN PHOTODIODE

DESCRIPTION The 61082 is designed for high speed use in fiber optic receivers. The case is electrically isolated to enhance EMI/RFI shielding. The Pin Photodiodes are designed to interface with multimode optical fibers from 50-125 microns. Available custom binned to customer specifications and/or

MICROPAC

FIBER OPTIC PIN PHOTODIODE

DESCRIPTION The 61082 is designed for high speed use in fiber optic receivers. The case is electrically isolated to enhance EMI/RFI shielding. The Pin Photodiodes are designed to interface with multimode optical fibers from 50-125 microns. Available custom binned to customer specifications and/or

MICROPAC

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BERGSTAK 0.8MM RECEPTACLE ASSY

BERGSTAK 0.8MM RECEPTACLE ASSY

FCI-CONNECTOR

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BERGSTAK 0.8MM RECEPTACLE ASSY

BERGSTAK 0.8MM RECEPTACLE ASSY

FCI-CONNECTOR

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺集团

6108产品属性

  • 类型

    描述

  • 型号

    6108

  • 功能描述

    板对板与夹层连接器 40P RECPT W/POLARIZATION

  • RoHS

  • 制造商

    JAE Electronics

  • 系列

    WP3

  • 产品类型

    Receptacles

  • 节距

    0.4 mm

  • 叠放高度

    1 mm

  • 位置/触点数量

    50

  • 排数

    2

  • 外壳材料

    Plastic

  • 触点材料

    Copper Alloy

  • 触点电镀

    Gold

  • 电压额定值

    50 V

  • 电流额定值

    0.4 A

更新时间:2025-8-12 11:16:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
AMPHENOL/安费诺
2508+
/
470984
一级代理,原装现货
FCI
2016+
CONNECTOR
52000
只做原装,假一罚十,公司专营进口连接器!
伯恩斯
20+
SOP8
6588
AMPHENOL/安费诺
25+
Connection
35670
AMPHENOL/安费诺原装现货61083-184402LF即刻询购立享优惠#长期有排单订
23+
QFP
5000
原厂授权代理,海外优势订货渠道。可提供大量库存,详
三年内
1983
只做原装正品
AMPHENOL/安费诺
22+
SMD
5800
专营AMPHENOL/FCI/优势资源/支持实单订货
AMPHENOL/安费诺
25+
SMD
515000
明嘉莱只做原装正品现货
AMPHENOL/安费诺
2447
SMD
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
N/A
24+
10000

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