61082价格

参考价格:¥14.5530

型号:61082-041400LF 品牌:FCI 备注:这里有61082多少钱,2025年最近7天走势,今日出价,今日竞价,61082批发/采购报价,61082行情走势销售排行榜,61082报价。
型号 功能描述 生产厂家 企业 LOGO 操作
61082

FIBER OPTIC PIN PHOTODIODE

DESCRIPTION The 61082 is designed for high speed use in fiber optic receivers. The case is electrically isolated to enhance EMI/RFI shielding. The Pin Photodiodes are designed to interface with multimode optical fibers from 50-125 microns. Available custom binned to customer specifications and/or

MICROPAC

61082

BERCSTAK 0.8MM RECEPTACLE ASSY

文件:473.99 Kbytes Page:6 Pages

FCI-CONNECTOR

FIBER OPTIC PIN PHOTODIODE

DESCRIPTION The 61082 is designed for high speed use in fiber optic receivers. The case is electrically isolated to enhance EMI/RFI shielding. The Pin Photodiodes are designed to interface with multimode optical fibers from 50-125 microns. Available custom binned to customer specifications and/or

MICROPAC

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BERGSTAK 0.8MM RECEPTACLE ASSY

BERGSTAK 0.8MM RECEPTACLE ASSY

FCI-CONNECTOR

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BERGSTAK 0.8MM RECEPTACLE ASSY

BERGSTAK 0.8MM RECEPTACLE ASSY

FCI-CONNECTOR

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

AMPHENOL

安费诺

61082产品属性

  • 类型

    描述

  • 型号

    61082

  • 功能描述

    板对板与夹层连接器 80P SMT RECPT

  • RoHS

  • 制造商

    JAE Electronics

  • 系列

    WP3

  • 产品类型

    Receptacles

  • 节距

    0.4 mm

  • 叠放高度

    1 mm

  • 位置/触点数量

    50

  • 排数

    2

  • 外壳材料

    Plastic

  • 触点材料

    Copper Alloy

  • 触点电镀

    Gold

  • 电压额定值

    50 V

  • 电流额定值

    0.4 A

更新时间:2025-11-18 10:38:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
AFCI
2022+
12000
原厂原装,假一罚十
FCI 只做原装
24+
SMD
39500
进口原装现货 支持实单价优
FCI
2223+
26800
只做原装正品假一赔十为客户做到零风险
AMPHENOL/安费诺
25+
连接器
13250
原装正品现货供应商原厂货源渠道订货
FCI
2023+
SMD60
30000
一级代理优势现货,全新正品直营店
FCI
24+
SMD40P
9000
只做原装正品 有挂有货 假一赔十
FCI
24+
connector
49823
只做原装进口现货连接器
AMPHENOL/安费诺
2022+
NA
10000
只做原装,价格优惠,长期供货。
Amphenol/安费诺
24+
28616
原厂现货渠道
FCI Electronics(法马通)
24+
N/A
9548
原厂可订货,技术支持,直接渠道。可签保供合同

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