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61082价格
参考价格:¥14.5530
型号:61082-041400LF 品牌:FCI 备注:这里有61082多少钱,2025年最近7天走势,今日出价,今日竞价,61082批发/采购报价,61082行情走势销售排行榜,61082报价。| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
61082 | FIBER OPTIC PIN PHOTODIODE DESCRIPTION The 61082 is designed for high speed use in fiber optic receivers. The case is electrically isolated to enhance EMI/RFI shielding. The Pin Photodiodes are designed to interface with multimode optical fibers from 50-125 microns. Available custom binned to customer specifications and/or | MICROPAC | ||
61082 | BERCSTAK 0.8MM RECEPTACLE ASSY 文件:473.99 Kbytes Page:6 Pages | FCI-CONNECTOR | ||
FIBER OPTIC PIN PHOTODIODE DESCRIPTION The 61082 is designed for high speed use in fiber optic receivers. The case is electrically isolated to enhance EMI/RFI shielding. The Pin Photodiodes are designed to interface with multimode optical fibers from 50-125 microns. Available custom binned to customer specifications and/or | MICROPAC | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BERGSTAK 0.8MM RECEPTACLE ASSY BERGSTAK 0.8MM RECEPTACLE ASSY | FCI-CONNECTOR | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BERGSTAK 0.8MM RECEPTACLE ASSY BERGSTAK 0.8MM RECEPTACLE ASSY | FCI-CONNECTOR | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 | |||
BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac | AMPHENOL 安费诺 |
61082产品属性
- 类型
描述
- 型号
61082
- 功能描述
板对板与夹层连接器 80P SMT RECPT
- RoHS
否
- 制造商
JAE Electronics
- 系列
WP3
- 产品类型
Receptacles
- 节距
0.4 mm
- 叠放高度
1 mm
- 位置/触点数量
50
- 排数
2
- 外壳材料
Plastic
- 触点材料
Copper Alloy
- 触点电镀
Gold
- 电压额定值
50 V
- 电流额定值
0.4 A
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
AFCI |
2022+ |
12000 |
原厂原装,假一罚十 |
||||
FCI 只做原装 |
24+ |
SMD |
39500 |
进口原装现货 支持实单价优 |
|||
FCI |
2223+ |
26800 |
只做原装正品假一赔十为客户做到零风险 |
||||
AMPHENOL/安费诺 |
25+ |
连接器 |
13250 |
原装正品现货供应商原厂货源渠道订货 |
|||
FCI |
2023+ |
SMD60 |
30000 |
一级代理优势现货,全新正品直营店 |
|||
FCI |
24+ |
SMD40P |
9000 |
只做原装正品 有挂有货 假一赔十 |
|||
FCI |
24+ |
connector |
49823 |
只做原装进口现货连接器 |
|||
AMPHENOL/安费诺 |
2022+ |
NA |
10000 |
只做原装,价格优惠,长期供货。 |
|||
Amphenol/安费诺 |
24+ |
28616 |
原厂现货渠道 |
||||
FCI Electronics(法马通) |
24+ |
N/A |
9548 |
原厂可订货,技术支持,直接渠道。可签保供合同 |
61082规格书下载地址
61082参数引脚图相关
- 74ls373
- 74ls244
- 74ls192
- 74ls164
- 74ls138
- 74ls04
- 74ls00
- 74hc595
- 74hc573
- 74hc541
- 74hc244
- 74hc164
- 7490
- 7241
- 7169
- 700t
- 6657
- 6612
- 6445
- 6280
- 610-R10
- 610-R01
- 610PTBO
- 610PT
- 610NM
- 610JE
- 610HE
- 610FE
- 6109PBG
- 61099
- 61095-1
- 61095
- 61090
- 61089B
- 61089
- 61085-3
- 61085-1
- 61085
- 61084
- 61083
- 61082-082402LF
- 61082-081502LF
- 61082-081402LF
- 61082-081400LF
- 61082-081000
- 61082-063402LF
- 61082-063400LF
- 61082-063000
- 61082-062422LF
- 61082-062402LF
- 61082-062400LF
- 61082-061402LF
- 61082-061400LF
- 61082-043402LF
- 61082-043400LF
- 61082-043000
- 61082-042402LF
- 61082-042400LF
- 61082-041402LF
- 61082-041400LF
- 61080
- 6108.4R
- 6108.3R
- 6108.3HR
- 6108
- 61074-1
- 61070-2
- 61070-1
- 61-070
- 6107
- 61067-1
- 6-106507-2
- 610643-000
- 61063
- 61060-2
- 61060-1
- 61060
- 6106
- 6105-EM-119E
- 6105-B
- 61059
- 61058
- 6105-61/2
- 6105-6.5
- 61056
- 61055
- 61053
- 61050
- 61048-2
- 61048
- 6102A
- 61029-2
- 61029-1
- 6102-5
- 6102-3
- 6102-1
- 610-1R0
61082数据表相关新闻
6116SA15SOG
6116SA15SOG
2023-4-12614004135023
进口代理
2022-10-1861082-121402LF
进口代理
2022-9-2960619-1技术参数 60619-1原装正品现货
60619-1技术参数 60619-1原装正品现货
2020-5-156032-C0348ML-1C1
6032-C0348ML-1C1,全新原装当天发货或门市自取0755-82732291.
2019-11-276098-4333
深圳科雨电子有限公司,联系人:卢小姐 手机:18975515225 原装正品 大量现货,有需要的可以联系我 QQ:97877805 微信:wei555222777
2019-6-20
DdatasheetPDF页码索引
- P1
- P2
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- P4
- P5
- P6
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- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
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