型号 功能描述 生产厂家 企业 LOGO 操作
233-60AB

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

233-60AB

包装:散装 描述:HEATSINK TO-220 VERT/HORZ BLK 风扇,热管理 热敏 - 散热器

ETC

知名厂家

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

• No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are s

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes Page:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes Page:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

包装:散装 描述:HEATSINK TO-220 VERT BLK W/TABS 风扇,热管理 热敏 - 散热器

ETC

知名厂家

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes Page:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS

文件:922.36 Kbytes Page:20 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

233-60AB产品属性

  • 类型

    描述

  • 型号

    233-60AB

  • 功能描述

    散热片 VERT/HORZ CLIP-ON

  • RoHS

  • 制造商

    Ampro By ADLINK

  • 产品

    Heat Sink Accessories

  • 安装风格

    Through Hole

  • 设计目的

    Express-HRR

更新时间:2025-12-25 10:16:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
TE
25+
100
原厂现货渠道
TE/泰科
2508+
/
415341
一级代理,原装现货
24+
N/A
73000
一级代理-主营优势-实惠价格-不悔选择
TE/泰科
23+
NA/原装
82985
代理-优势-原装-正品-现货*期货
TE
24+
con
20
现货常备产品原装可到京北通宇商城查价格
TE
24+
con
35960
查现货到京北通宇商城
TE
20
WAKEFIELD
180
全新原装 货期两周
N/A
23+
80000
专注配单,只做原装进口现货
TE/泰科
2447
SMD
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货

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