位置：233-60ABE-10 > 233-60ABE-10详情
233-60ABE-10中文资料
233-60ABE-10数据手册规格书PDF详情
• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
FEATURES AND BENEFITS
更新时间：2025-12-2 16:20:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TE |
25+ |
100 |
原厂现货渠道 |
||||
N/A |
23+ |
80000 |
专注配单,只做原装进口现货 |
||||
TE |
24+ |
con |
35960 |
查现货到京北通宇商城 |
|||
TE/泰科 |
2508+ |
/ |
415341 |
一级代理，原装现货 |
|||
TE/泰科 |
2447 |
SMD |
100500 |
一级代理专营品牌!原装正品,优势现货,长期排单到货 |
|||
24+ |
N/A |
73000 |
一级代理-主营优势-实惠价格-不悔选择 |
||||
TE/泰科 |
23+ |
NA/原装 |
82985 |
代理-优势-原装-正品-现货*期货 |
|||
TE |
20 |
||||||
TE |
24+ |
con |
20 |
现货常备产品原装可到京北通宇商城查价格 |
|||
TE |
24+ |
con |
2500 |
优势库存,原装正品 |
233-60ABE-10 资料下载更多...
233-60ABE-10 芯片相关型号
Datasheet数据表PDF页码索引
- P1
- P2
- P3
- P4
- P5
- P6
- P7
- P8
- P9
- P10
- P11
- P12
- P13
- P14
- P15
- P16
- P17
- P18
- P19
- P20
- P21
- P22
- P23
- P24
- P25
- P26
- P27
- P28
- P29
- P30
- P31
- P32
- P33
- P34
- P35
- P36
- P37
- P38
- P39
- P40
- P41
- P42
- P43
- P44
- P45
- P46
- P47
- P48
- P49
- P50
- P51
- P52
- P53
- P54
- P55
- P56
- P57
- P58
- P59
- P60
- P61
- P62
- P63
- P64
- P65
- P66
- P67
- P68
- P69
- P70
- P71
- P72
- P73
- P74
- P75
- P76
- P77
- P78
- P79
- P80
- P81
- P82
- P83
- P84
- P85
- P86
- P87
- P88
- P89
- P90
- P91
- P92
- P93
- P94
- P95
- P96
- P97
- P98
- P99
- P100
- P101
- P102
- P103
- P104
- P105
- P106
- P107
