Industrial Grade Cyber Security Appliance based on Intel® Atom™ x5-E3940/ x5-E3930 Processor

Features ƒ Industrial Grade DIN Rail fanless Cyber Security Appliance ƒ Supports Intel® Atom™ x5-E3940 Processor ƒ 1 x DDR3L 1600/1867MHz SODIMM, up to 8G ƒ 1 x GbE Copper Mgmt. port ƒ 4 x 10/100/1000 Mbps Copper ports with 2 segments of LAN bypass ƒ 2 x 10/100/1000 Mbps SFP ports ƒ 1 x 2.5

1U short-depth Optimized Chassis for ASMB-61 Series Edge Accelerator Server Board

Features ƒ Supports ASMB-61 edge series proprietary motherboard ƒ 18 short-depth chassis design ƒ Four PCIe expansion slots support ƒ GPU Card support with active FAN ƒ Two hot-swappable 2.5 SATA/SAS/SSD drive bays ƒ Multiple power supply options ƒ 1U Front Bezel in option

1U 18 short-depth Edge Accelerator Server with Intel® Xeon® W & 10th Gen. Core™ processors, supporting 4 expansion slots

Features ƒ Processor: Single Intel® Xeon® W & 10th Gen. Core™ processors ƒ Memory: DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB ƒ One PCIe x16 slot or two PCIe x8 slots support FH/10.5” Length Cards* ƒ Two PCIeX4 slots support one external and one internal Low Profile Cards ƒ Two ho

4U Rackmount Intel® Xeon® Scalable GPU Server, Supporting 10 x PCIe x16 Double-Deck Cards Plus 1 x PCIe x16 and 1 x PCIe x8 Single-Deck Cards

Features ƒ Processor: Dual 2nd Gen Intel® Xeon® Scalable Processors ƒ Memory: 24 x DDR4 2666/2933 MHz ECC RDIMM/LRDIMM / Intel Optane DC Persistent Memory, up to 6TB ƒ Remote Management: IPMI function support ƒ Expansion: Supporting 10 * PCIe x16 double-deck card with peer to peer feature +

Modular AI Platform for Scalable Surveillance and Fleet Management

Features ƒ Equipped with DeviceOn/iService software for remote device management ƒ Scalable computing performance via CPU boards for specific application requirements ƒ Advanced video surveillance system with AI accelerator for video AI capabilities ƒ Modular design supports the latest RF co

7 In-Vehicle Smart Display with Smart Display 2.0

Features ƒ 7 WVGA (16:10) TFT LCD with 4-wire resistive touch control ƒ Rugged, vehicle-grade design ƒ Smart display port 2.0 and 10-meter/5-meter connector cable ƒ Easily paired with TREK computing box via a single-cable connection ƒ Built-in light sensor for automatic dimming ƒ Extended I/

Intel® & NVIDIA® Jetson Orin™ NX Dual-System AI Computing Solution

Features ƒ Equipped with DeviceOn/iService software for remote device management ƒ Intel® & NVIDIA® Dual-System to provide the best computing performance ƒ Scalable rugged AI platform to enhance efficiency ƒ Scalable computing performance via CPU boards for specific application requirements

Modular AI Platform for Scalable Surveillance and Fleet Management

Features ƒ Equipped with DeviceOn/iService software for remote device management ƒ Scalable computing performance via CPU boards for specific application requirements ƒ Advanced video surveillance system with AI accelerator for video AI capabilities ƒ Modular design supports the latest RF co

7 In-Vehicle Smart Display with Smart Display 2.0

Features ƒ 7 WVGA (16:10) TFT LCD with 4-wire resistive touch control ƒ Rugged, vehicle-grade design ƒ Smart display port 2.0 and 10-meter/5-meter connector cable ƒ Easily paired with TREK computing box via a single-cable connection ƒ Built-in light sensor for automatic dimming ƒ Extended I/

Modular AI Platform for Scalable Surveillance and Fleet Management

Features ƒ Equipped with DeviceOn/iService software for remote device management ƒ Scalable computing performance via CPU boards for specific application requirements ƒ Advanced video surveillance system with AI accelerator for video AI capabilities ƒ Modular design supports the latest RF co

Intel® & NVIDIA® Jetson Orin™ NX Dual-System AI Computing Solution

Features ƒ Equipped with DeviceOn/iService software for remote device management ƒ Intel® & NVIDIA® Dual-System to provide the best computing performance ƒ Scalable rugged AI platform to enhance efficiency ƒ Scalable computing performance via CPU boards for specific application requirements

Modular AI Platform for Scalable Surveillance and Fleet Management

Features ƒ Equipped with DeviceOn/iService software for remote device management ƒ Scalable computing performance via CPU boards for specific application requirements ƒ Advanced video surveillance system with AI accelerator for video AI capabilities ƒ Modular design supports the latest RF co

Industrial Grade Cyber Security Appliance based on Intel® Atom™ x5-E3940/ x5-E3930 Processor

Features ƒ Industrial Grade DIN Rail fanless Cyber Security Appliance ƒ Supports Intel® Atom™ x5-E3940 Processor ƒ 1 x DDR3L 1600/1867MHz SODIMM, up to 8G ƒ 1 x GbE Copper Mgmt. port ƒ 4 x 10/100/1000 Mbps Copper ports with 2 segments of LAN bypass ƒ 2 x 10/100/1000 Mbps SFP ports ƒ 1 x 2.5

Rockchip RK3399 Cortex-A72 2.5 SBC with UIO40-Express

Features ƒ Rockchip RK3399 ARM Dual Cortex-A72 and Quad Cortex-A53 1.8 GHz ƒ Onboard LPDDR4 2 GB ƒ 1 HDMI, 1 Dual Channel 24 bit LVDS or 1eDP ƒ 2 2-wire RS-232, 1 USB3.0, 4 USB2.0, 1 Micro SD, 1 Mic. in / Line out ƒ 1 mini-PCIe for LTE/WiFi/BT ƒ Supports Debian9/10 and Android7.1/10.0 ƒ Sup

NXP i.MX8M Plus Cortex®-A53 2.5 SBC with UIO40-Express

Features ƒ NXP Arm® Cortex®-A53 i.MX8M Plus Quad/Dual up to 1.8 GHz ƒ Onboard LPDDR4 4 GB/ 6 GB, 4000MT/s memory ƒ HDMI 1920x1080 at 60Hz, 1 Single or 1 Dual Channel 24 bit LVDS (or 1 4-Lane MIPI-DSI by BOM Option) ƒ 1 4-wire RS-232/422/485, 1 USB3.2 Gen1 By 1, 1 USB2.0, 1 Micro SD, 1 Mic. i

MediaTek Genio 1200 Cortex A78 & A55 2.5 SBC with UIO40-Express

Features ƒ MediaTek Genio 1200 4 cores A78 & 4 cores A55 ƒ Onboard LPDDR4 8GB, 4000MT/s memory ƒ HDMI 4k60fps, 1 x Dual Channel 24 bit LVDS ƒ 1 x 4-wire RS-232/422/485, 2 x USB3.2 Gen1 By 1, 2 x USB2.0, 1 x Micro SD, 1 x Mic. in / Line out ƒ 1 x M.2 3052 Key B for 5G, 1 x M.2 2230 Key E Slot

Intel® Celeron™J1900 Fanless Compact System with 8GB on board

Features ƒ Built-in Intel® Celeron™ J1900 quad-core processor, 2.0 GHz ƒ Fanless, compact system design ƒ 8 GB of DDR3 memory onboard with optional NVRAM ƒ 4 x LAN, 6 x USB, 14 x COM, and 1 x USB 3.0 ports ƒ Replaceable secondary display (VGA 2/DVI-D/LVDS/HDMI) ƒ Supports dual outputs of ful

Modular AI Platform for Scalable Surveillance and Fleet Management

Features ƒ Equipped with DeviceOn/iService software for remote device management ƒ Scalable computing performance via CPU boards for specific application requirements ƒ Advanced video surveillance system with AI accelerator for video AI capabilities ƒ Modular design supports the latest RF co

Intel® & NVIDIA® Jetson Orin™ NX Dual-System AI Computing Solution

Features ƒ Equipped with DeviceOn/iService software for remote device management ƒ Intel® & NVIDIA® Dual-System to provide the best computing performance ƒ Scalable rugged AI platform to enhance efficiency ƒ Scalable computing performance via CPU boards for specific application requirements

Intel® Atom® x6000 Series Processor (Code Name: Elkhart Lake) Pico-ITX SBC

Features ƒ Intel Atom x6000E Series ƒ Onboard LPDDR4x up to 8GB and EMMC up to 128GB ƒ Support 12~24V wide voltage range and -40~85°C operating temperature ƒ 2x GbE LAN, 2x USB3.2, 2x RS-232/422/485, I2C ƒ M.2 E-Key and B-Key for SATA storage, option to support RS-232 module ƒ Support iManag

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W ƒ On-board LPDDR4x-4267 up to 32G with IBECC for Industrial Sku ƒ Dual independent display: eDP/MIPI-DSI, DP up to 8K ƒ 2 GbE, 2 USB 3.2, COM Port, SMBus/I2C ƒ Expansion: M.2 E-Key, M.2 B-Key/M-Key NVMe x2 ƒ Supports i

12th Gen. Intel® Core™ Processors S-series (LGA1700) on 4 EPIC SBC

Features ƒ 12th Gen. Intel® Core™ Processor up to 16 Cores, TDP 35W ƒ High scalability with socket type CPU (LGA1700) & Support Std. CPU cooler ƒ DDR5 4800 up to 32GB + 3 simultaneous display: Dual HDMI + eDP ƒ Dual High Speed 2.5G Ethernet with TSN, 2x COM, CANbus, TPM ƒ 3 Expansions: Dual M

Intel® Atom® x6000E series and Intel Celeron N and J series 3.5 SBC

Features ƒ Atom® x6000E series and Intel® Celeron® J and N series with Quad/Dual Cores, TDP 6W/ 10W/ 12W ƒ Single Channel DDR4-3200 up to 32GB ƒ 3 independent displays via LVDS, DP1.4, and HDMI2.0 up to 4K@60Hz ƒ Dual GbE, 6 USB, 6 UART, TPM2.0 ƒ CE/FCC Class B, Coastline I/O ESD 8KV/15KV Cr

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

12th Gen. Intel® CoreTM i7/ i5/ i3 P-series 3.5 SBC

Features ƒ 12th Gen. Intel® Core™ Processor up to 12 Cores, TDP 28/15W ƒ Dual Channel DDR5-4800 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP ƒ 2 GbE, 6 USB, USB4/TBT4, 4 UART, 2 CANBus, 3 I2C ƒ 3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe) ƒ Supports iManager & Sof

M.2 B-key & F/S miniPCIe Dual Intel® GbE

Features ƒ Low-profile design(11mm) MIO expansion board ƒ Rich I/O: 2 x Intel GbE, 4 x USB2.0, 8 x UART ( 4 x High-speed serial port + 4 x serial ports), 1x Line-out, 1x GPIO, 2x isolated CANBus ƒ Multiple expansion: Full-size miniPCIe slot and M.2 B-Key for M.2 3042 4G/ LTE module with on-bo

9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

M.2 B-key & F/S miniPCIe Dual Intel® GbE

Features ƒ Low-profile design(11mm) MIO expansion board ƒ Rich I/O: 2 x Intel GbE, 4 x USB2.0, 8 x UART ( 4 x High-speed serial port + 4 x serial ports), 1x Line-out, 1x GPIO, 2x isolated CANBus ƒ Multiple expansion: Full-size miniPCIe slot and M.2 B-Key for M.2 3042 4G/ LTE module with on-bo

Intel® Atom® x6000 Series Processor (Code Name: Elkhart Lake) Pico-ITX SBC

Features ƒ Intel Atom x6000E Series ƒ Onboard LPDDR4x up to 8GB and EMMC up to 128GB ƒ Support 12~24V wide voltage range and -40~85°C operating temperature ƒ 2x GbE LAN, 2x USB3.2, 2x RS-232/422/485, I2C ƒ M.2 E-Key and B-Key for SATA storage, option to support RS-232 module ƒ Support iManag

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-series Pico-ITX SBC

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W ƒ On-board LPDDR4x-4267 up to 32G with IBECC for Industrial Sku ƒ Dual independent display: eDP/MIPI-DSI, DP up to 8K ƒ 2 GbE, 2 USB 3.2, COM Port, SMBus/I2C ƒ Expansion: M.2 E-Key, M.2 B-Key/M-Key NVMe x2 ƒ Supports i

12th Gen. Intel® Core™ Processors S-series (LGA1700) on 4 EPIC SBC

Features ƒ 12th Gen. Intel® Core™ Processor up to 16 Cores, TDP 35W ƒ High scalability with socket type CPU (LGA1700) & Support Std. CPU cooler ƒ DDR5 4800 up to 32GB + 3 simultaneous display: Dual HDMI + eDP ƒ Dual High Speed 2.5G Ethernet with TSN, 2x COM, CANbus, TPM ƒ 3 Expansions: Dual M

Intel® Atom® x6000E series and Intel Celeron N and J series 3.5 SBC

Features ƒ Atom® x6000E series and Intel® Celeron® J and N series with Quad/Dual Cores, TDP 6W/ 10W/ 12W ƒ Single Channel DDR4-3200 up to 32GB ƒ 3 independent displays via LVDS, DP1.4, and HDMI2.0 up to 4K@60Hz ƒ Dual GbE, 6 USB, 6 UART, TPM2.0 ƒ CE/FCC Class B, Coastline I/O ESD 8KV/15KV Cr

11th Gen. Intel® Core™ i7/i5/i3/Celeron U-Series 3.5 SBC w/ MIOe

Features ƒ 11th Gen. Intel® Core™ Processor with Quad/Dual Cores, TDP 15W/ 28W ƒ Dual Channel DDR4-3200 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB Type-C, eDP (optional) ƒ 2 GbE, 4 USB3.2, CAN Bus, DC-in 12-24V ƒ Expansion: M.2 E-Key/B-Key/M-Key (supports NVMe), MIOe ƒ Supports i

12th Gen. Intel® CoreTM i7/ i5/ i3 P-series 3.5 SBC

Features ƒ 12th Gen. Intel® Core™ Processor up to 12 Cores, TDP 28/15W ƒ Dual Channel DDR5-4800 up to 64GB ƒ 4 simultaneous displays: LVDS/HDMI/DP/USB-C Alt. DP ƒ 2 GbE, 6 USB, USB4/TBT4, 4 UART, 2 CANBus, 3 I2C ƒ 3 Expansions: M.2 E-Key, B-Key, M-Key (support NVMe) ƒ Supports iManager & Sof

9th/8th Gen. Intel Xeon /Core™ Processor, 3.5 SBC w/ MIOe

Features ƒ 9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25W ƒ Dual channel DDR4-2400, up to 64GB*, ECC for Xeon SKU ƒ Triple simultaneous displays with 48-bit LVDS+HDMI+DP ƒ USB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSD ƒ Dual GbE, SATAIII, RS-232/422/485, CA

8-ch, 24-bit, 128 kS/s Dynamic Signal Acquisition PCI Express Card

Features ƒƒ 8 simultaneously sampled analog inputs, up to 128 kS/s ƒƒ 24-bit resolution ADCs with -102 dB total harmonic distortion plus noise (THD+N) ƒƒ Wide input range of ±1 ~ 10 V ƒƒ Built-in anti-aliasing filter ƒƒ Low power consumption ƒƒ Software-selectable AC/DC coupling ƒƒ Full au

1MS/s, 16bit, 32-ch Analog Input PCIE Card

Features ƒƒ 32-ch single-ended or 16-ch differential or a combination of analog input ƒƒ 16-bit A/D converter, with up to 1MHz sampling rate ƒƒ Auto calibration ƒƒ Current measurement (0-20mA or 4-20mA) ƒƒ Support digital and analog triggers ƒƒ Multi-card synchronization

Intel Atom x6413E QC SoC with HDMI and DP/Dual LAN/Dual COM DIN-Rail Fan-less Box PC

Features ƒ Intel Atom x6413E Quad Core SoC turbo burst up to 3.00 GHz ƒ DIN-Rail system with essential I/O ports on front-side bezel ƒ 2 x Intel GbE and 2 x RS-232/422/485 ƒ Dual independent displays with one 4K HDMI and one 4K DP ƒ 1 x M.2 2280 B key with nano SIM holder and 1 x M.2 2230 E k

Intel® 11th gen Core™ i processor with Triple LAN/ Quadruple COM Din-Rail Fanless Box PC

Features ƒ Intel 11th gen. Core i5/i3 ƒ DIN-Rail system with essential I/O ports on front-side bezel ƒ 3 x Intel GbE, 4x RS-232/422/485, 8-bit DIO, optional CANBus ƒ 3 Expansions: M.2 E-Key 2230, M.2 B-Key 2280, 1 x Full-size mSATA share with mPCIe slot ƒ Dual independent displays with one 4

M.2 B-key & F/S miniPCIe Dual Intel® GbE

Features ƒ Low-profile design(11mm) MIO expansion board ƒ Rich I/O: 2 x Intel GbE, 4 x USB2.0, 8 x UART ( 4 x High-speed serial port + 4 x serial ports), 1x Line-out, 1x GPIO, 2x isolated CANBus ƒ Multiple expansion: Full-size miniPCIe slot and M.2 B-Key for M.2 3042 4G/ LTE module with on-bo

15.6 Configurable Panel PC Chassis for Selectable Mini-ITX Motherboards

Features ƒ 15.6 true-flat panel PC with multi-touch projected capacitive ƒ Supports certified mini-ITX motherboards (up to 65W TDP processor) ƒ PCI or PCIe expansion slots ƒ Front-facing power status LED indicators ƒ IP66-rated front panel

18.5 Configurable Panel PC Chassis for Selectable Mini-ITX Motherboards

Features ƒ 18.5 true-flat panel PC with multi-touch projected capacitive ƒ Supports certified mini-ITX motherboards (up to 65W TDP processor) ƒ PCI or PCIe expansion slots ƒ Front-facing power status LED indicators ƒ IP66-rated front panel ƒ Support dual HDD drawer

21.5 Configurable Panel PC Chassis for Selectable Mini-ITX Motherboards

Features ƒ 21.5 true-flat panel PC with multi-touch projected capacitive ƒ Supports certified mini-ITX motherboards (up to 65W TDP processor) ƒ PCI or PCIe expansion slots ƒ Front-facing power status LED indicators ƒ IP66-rated front panel ƒ Support dual HDD drawer

Compact Fanless System with 10th Gen Intel® Xeon®/Core™ i CPU Socket (LGA 1200)

Features ƒ Intel® 10th Gen Xeon®/Core™ i CPU socket-type (LGA1200) with Intel® W480E/H420E chipset ƒ Wide operating temperature (-10 ~ 60 °C) ƒ VGA and HDMI output ƒ 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1) ƒ 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional) ƒ 1 x 2.5 H

Compact Fanless System with 12th Gen Intel® Core™ i CPU Socket (LGA 1700)

Features ƒ Intel® 12th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipset ƒ Wide operating temperature (-20 ~ 60 °C) ƒ VGA and HDMI output ƒ 2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1) ƒ 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional) ƒ 1 x 2.5 HDD/SS

Dual GPU Expansion Module for Video AI Edge Computing with MIC-7 Series

Features ƒ Offering powerful GPU solution with dual NVIDIA 250W, 2.75-slot width/331mm length GPU cards for new AI application ƒ Triple 24VDC power inputs, provide independent power for GPU cards and MIC-7 system ƒ Intelligent power status indicating LED for system and GPU card independently

GPU Expansion Module for Video AI Edge Computing with MIC-7 Series

Features ƒ Offering powerful GPU solution with NVIDIA 350W, 2.75-slot width, 334.6mm length GPU cards for new AI application ƒ Dual 24VDC power inputs with reliable power and OCP solution for up to 700W maximum peak power currency ƒ Intelligent power status indicating LED for system and GPU c

Compact Industrial Computer System with 6th/7th Gen Intel® Core™ i CPU Socket (LGA 1151)

Features ƒ Intel® 6th/7th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q170/ H110 chipset ƒ 3 x independent displays (third display output (DP) via optional cable) ƒ 2 x GigaLan and 6 x USB3.0 (Q170)/ 4 x USB3.0 (H110) ƒ 2 x RS-232/422/485 and 2 x RS232 serial ports ƒ 2 x 2.5 HDD/SSD, a

Compact Industrial Computer System with 10th Gen Intel® Core™ i CPU Socket (LGA 1200)

Features ƒ Intel® 10th Gen Core™ i CPU socket-type (LGA1200) with Intel® Q470E/ H420E chipset ƒ 3 x independent displays (third display output (DP) via optional cable) ƒ 2 x GigaLan and 6 x USB3.2 ƒ 2 x RS-232/422/485 and 2 x RS232 serial ports ƒ 1 x NVMe M.2 (Q470E Only), 2 x 2.5 HDD/SSD, a

3U CompactPCI® Serial Dual Mini PCIe Carrier Board

Features ƒ 3U Height CompactPCI serial interface peripheral board ƒ Dual Mini PCIe module carrier ƒ PICMG CPCI-S.0 CompactPCI® serial spec.

Compact Embedded Edge Controller with 10th Gen Intel® Processor, up to 3 x PCIe/PCI slots, 1 x M.2 B-Key, 1 x mPCIe, and 2 x 2.5 SSD

Features ƒ 10th gen Intel® socket-type processor with DDR4 memory ƒ Scalable processor and RAM memory options ƒ Compact, rugged, fanless design for harsh embedded environments ƒ Flexible expansion with up to 3 x PCIe/PCI slots, 1 x M.2 (B-key), 1 x mPCIe, and 2 x 2.5” SSD ƒ Optional iDoor ex

AMD AM4 Ryzen™ 5000 Series MicroATX with 1 DP/HDMI/VGA, 6 COM, 4 GbE LANs, 8 USB 3.2,4 USB 3.0, 3 USB2.0

Features ƒ Supports AMD AM4 Ryzen™ 5000 series processor with X570 chipset ƒ Supports triple displays. (DP, VGA, HDMI display) ƒ Supports PCIe Gen4, max up to 8 x USB 3.2 Gen2, 4 x USB 3.0 Gen2, 3 x USB 2.0, 4 x SATAIII, 2 x 2.5GbE, 2 x 1GbE, M.2 (M Key) ƒ Supports DeviceOn and Embedded Softw

Intel® Xeon® W10th Gen Core™(Comet Lake-S) i9/i7/i5/i3 LGA1200,MicroATX with 2 DP/VGA/eDP/6 COM,2 10GbE LANs, 2 GbE LANs, 4 USB 3.2Gen2, 6 USB 3.2 Gen 1

Features ƒ Supports Intel® Xeon® W10th Gen Core™ (Comet Lake-S) i9/i7/i5/i3 processor with W480E/ Q470E/ H420E chipset ƒ Supports triple displays. (2DP++, eDP, VGA display) ƒ Supports Intel AMT 12.0 and Intel vPro competent ƒ Supports PCIe Gen3, max up to 4x USB 3.2 Gen2, 6x USB 3.2 Gen1, 6x

Intel® 12th Gen Core™ processors(Alder Lake-S) i9/i7/i5/i3 LGA1700,MicroATX with 2 DP/HDMI/eDP,1 GbE LAN, 3 2.5GbE LANs, 8 USB 3.2,1 USB 3.2 Type-C, 6 COM

Features ƒ Supports Intel® 12th Gen Core™ processors (Alder Lake-S) with Q670E/ R680E/ H610E chipset ƒ Supports up to 32GB DDR5 4400MT/S with four UDIMMs ƒ Four displays. (x2 DP++, HDMI, eDP) ƒ Intel AMT and Intel vPro Technology ƒ PCIe x16 slot Gen5, PCIe x4 slot Gen4, PCIe x4 slot Gen3 ƒ

THIN barebone with 8th/9th Gen. Intel® Desktop Core i Processor

Features ƒ THIN Compact design with 44.2mm in height ƒ Thin barebone with multi-IO ports is suitable for variety of application environments with DC-in design ƒ Easy/ quick installation for additional peripherals ƒ Support Wall/VESA/Din Rail Kit ƒ Lock type DC power jack

Intel® Xeon® /Core™ i3/i5/i7 LGA1151 Powerful Edge Inference System

Features ƒ Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 up to 65W CPU ƒ Dual independent display: VGA + HDMI ƒ Dual Channel DDR4 SO-DIMM memory up to 32 GB ƒ 850W power supply built-in ƒ PCIe x16 Graphics card support up to 260W ƒ Two swappable 2.5 hard drive bay

Intel® Xeon® /Core™ i3/i5/i7 LGA1151 Powerful Edge Inference System

Features ƒ Intel® Xeon® / 6th & 7th Gen. Core™ i3/i5/i7 up to 65W CPU ƒ Dual independent display: VGA + HDMI ƒ Dual Channel DDR4 SO-DIMM memory up to 32 GB ƒ 850W power supply built-in ƒ PCIe x16 Graphics card support up to 260W ƒ Two swappable 2.5 hard drive bay

Development Kit for SMARC 2.0/2.1 Computer-on-Module ROM-5720

Features ƒƒ NXP i.MX 8M processor with dual or quad Arm Cortex A53 cores ƒƒ 1 x Arm Cortex-M4 core ƒƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒƒ 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ƒƒ 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera

THIN barebone with 8th/9th Gen. Intel® Desktop Core i Processor

Features ƒ THIN Compact design with 44.2mm in height ƒ Thin barebone with multi-IO ports is suitable for variety of application environments with DC-in design ƒ Easy/ quick installation for additional peripherals ƒ Support Wall/VESA/Din Rail Kit ƒ Lock type DC power jack

Development Kit for SMARC 2.0/2.1 Computer-on-Module ROM-5720

Features ƒƒ NXP i.MX 8M processor with dual or quad Arm Cortex A53 cores ƒƒ 1 x Arm Cortex-M4 core ƒƒ Onboard 2GB LPDDR4 memory and eMMC 16GB ƒƒ 1 x HDMI2.0 up to 4096 x 2160, 1 x 4-Lane MIPI DSI ƒƒ 2 x USB3.0, 4 x USB2.0, 4 x UART, 4 x I2C, 12 x GPIO, 1 x PCIe2.0, 1 x 4-lane MIPI CSI camera