型号 功能描述 生产厂家&企业 LOGO 操作
RC28F160C3

3VOLTADVANCEDBOOTBLOCK8-,16-,32-MBITFLASHMEMORYFAMILY

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

封装/外壳:64-TBGA 包装:管件 描述:IC FLASH 16MBIT PAR 64EASYBGA 集成电路(IC) 存储器

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

Micron

封装/外壳:64-TBGA 包装:管件 描述:IC FLASH 16MBIT PAR 64EASYBGA 集成电路(IC) 存储器

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

Micron

3VoltIntelAdvancedBootBlockFlashMemory

DeviceDescription ThissectionprovidesanoverviewoftheIntel®Advanced+BootBlockFlashMemory(C3)devicefeatures,packaging,signalnaming,anddevicearchitecture. ProductOverview TheC3deviceprovideshigh-performanceasynchronousreadsinpackage-compatibledensitieswitha16bit

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

AdvancedBootBlockFlashMemory(C3)

The0.25µm3VoltAdvanced+BootBlock,manufacturedonIntel’slatest0.25µtechnology,representsafeature-richsolutionatoveralllowersystemcost.Smart3flashmemorydevicesincorporatelowvoltagecapability(2.7Vread,programanderase)withhigh-speed,low-poweroperation.Flexible

IntelIntel Corporation(Integrated Electronics Corporation)

英特尔英特尔(集成电子公司)

Intel

FLASHMEMORY

GENERALDESCRIPTION TheMT28F160C3isanonvolatile,electricallyblockerasable(flash),programmable,read-onlymemorycontaining16,777,216bitsorganizedas1,048,576words(16bits). TheMT28F160C3ismanufacturedon0.22µmprocesstechnologyina48-ballFBGApackage.ThedevicehasanI/O

MicronMicron Technology Inc.

镁光美国镁光科技有限公司

Micron

16M-BIT[1Mx16]CMOSSINGLEVOLTAGE3VONLYFLASHMEMORY

文件:417.03 Kbytes Page:44 Pages

MCNIXMacronix International

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MCNIX

16M-BIT[1Mx16]CMOSSINGLEVOLTAGE3VONLYFLASHMEMORY

文件:417.03 Kbytes Page:44 Pages

MCNIXMacronix International

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MCNIX

RC28F160C3产品属性

  • 类型

    描述

  • 型号

    RC28F160C3

  • 制造商

    INTEL

  • 制造商全称

    Intel Corporation

  • 功能描述

    3 VOLT ADVANCED+ BOOT BLOCK 8-, 16-, 32-MBIT FLASH MEMORY FAMILY

更新时间:2024-5-21 15:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
INTEL/英特尔
22+
BGA
21000
原厂原包装。假一罚十。可开13%增值税发票。
INTEL
2021+
BGA64
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
Intel/Intel Corporation(Integ
21+
BGA
4
优势代理渠道,原装正品,可全系列订货开增值税票
INTEL
829
BGA
104
全新原装 实单必成
INTEL/英特尔
22+
BGA
18000
只做全新原装,支持BOM配单,假一罚十
INTEL/英特尔
22+
BGA64
42500
郑重承诺只做原装进口现货
INTEL
22+23+
BGA
20089
绝对原装正品全新进口深圳现货
INTEL/英特尔
23+
BGA
96880
只做原装,欢迎来电资询
SONY
23+
CCD镜片
12000
全新原装假一赔十
Micron
22+
64EasyBGA
9000
原厂渠道,现货配单

RC28F160C3芯片相关品牌

  • AAC
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  • BITECH
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  • Nuvoton
  • OSRAM
  • RECOM
  • SIEMENS
  • WILLOW

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