KLMBG2JETD-B041 SAMSUNG 数量:11200 批号:18+ 封装:FBGA
KLMBG2JETD-B041规格参数如下:
KLMBG2JETD-B041 Version:eMMC 5.1
KLMBG2JETD-B041 Voltage:1.8, 3.3 V / 3.3 V
KLMBG2JETD-B041 Package Size:11.5 x 13 x 0.8 mm
KLMBG2JETD-B041 Product Status:Mass Production
KLMBG2JETD-B041 Density:32GB
KLMBG2JETD-B041 Interface:HS400
KLMBG2JETD-B04125 ~ 85 °C