SURFACEMOUNTVARACTORDIODESWideBandwidthSOT-23HyperabruptTM

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封装/外壳：TO-236-3，SC-59，SOT-23-3 包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 描述：SI TVAR NON HERMETIC PLASTIC SMT 分立半导体产品 二极管 - 可变电容（变容器，可变电抗器）

封装/外壳：TO-236-3，SC-59，SOT-23-3 包装：托盘 描述：SI TVAR NON HERMETIC PLASTIC SMT 分立半导体产品 二极管 - 可变电容（变容器，可变电抗器）

T-1SubminiatureLamps

T-1¾WireLead T-1¾MiniatureFlanged T-1¾MiniatureGrooved T-1¾MidgetScrew T-1¾Bi-Pin

CustomerSpecification

Construction 1)Conductor a)MaterialTinnedCopper,perASTMB-33andCID-A-A-59551 b)StrandingSolid c)Diameter0.005 2)BraidData a)NominalID1/16(.062) b)AWGofEnds36 c)NumberofCarriers24 d)NominalPercentCoverage78 e)TotalNumberofEnds48 f)Approx.Equiv.AWG19

DSPMicrocomputerswithROM

GENERALDESCRIPTION TheADSP-216xFamilyprocessorsaresingle-chipmicrocomputers␣optimized␣for␣digital␣signal␣processing␣(DSP)andotherhighspeednumericprocessingapplications.TheADSP-216xprocessorsareallbuiltuponacommoncorewithADSP-2100.EachprocessorcombinesthecoreD

ADSP-2100FamilyDSPMicrocomputers

GENERALDESCRIPTION TheADSP-2100Familyprocessorsaresingle-chipmicrocomputersoptimizedfordigitalsignalprocessing(DSP)andotherhighspeednumericprocessingapplications.TheADSP-21xxprocessorsareallbuiltuponacommoncore.EachprocessorcombinesthecoreDSParchitecture—compu

ADSP-2100FamilyDSPMicrocomputers

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