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| 型号 | 功能描述 | 生产厂家&企业 | LOGO | 操作 |
|---|---|---|---|---|
XCC1314R106T0RGZ | CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis | TI1Texas Instruments 德州仪器美国德州仪器公司 |  |   |
XCC1314R106T0RGZ | CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TITexas Instruments 德州仪器美国德州仪器公司 |  | |
CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TITexas Instruments 德州仪器美国德州仪器公司 | | | |
CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis | TI1Texas Instruments 德州仪器美国德州仪器公司 | | | |
CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis | TI1Texas Instruments 德州仪器美国德州仪器公司 | | | |
CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis | TI1Texas Instruments 德州仪器美国德州仪器公司 | | | |
CC1314R10SimpleLink™High-PerformanceSub-1GHzWirelessMCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl | TITexas Instruments 德州仪器美国德州仪器公司 | | |
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
TELEMECANIQUE |
22+ |
NA |
500000 |
万三科技,秉承原装,购芯无忧 |
|||
TI |
24+ |
con |
35960 |
查现货到京北通宇商城 |
|||
TI |
23+ |
SOIC |
5000 |
全新原装正品现货 |
XCC1314R106T0RGZ芯片相关品牌
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XCC1314R106T0RGZ数据表相关新闻
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