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XCC价格

参考价格：￥1717.0846

型号：XCC-00 品牌：Excelsys 备注：这里有XCC多少钱，2025年最近7天走势，今日出价，今日竞价，XCC批发/采购报价，XCC行情走势销售排行榜，XCC报价。

型号	功能描述	生产厂家&企业
XCC	AC/DC Power Supply 文件：328.57 Kbytes Page：2 Pages	etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商
XCC	Connector for CFexpress card (Type B)/XQD card 文件：184.06 Kbytes Page：2 Pages	JSTJST Mfg. Co., Ltd. JST集团日本圧着端子製造株式会社
XCC1314R106T0RGZ	CC1314R10 SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TITexas Instruments 德州仪器美国德州仪器公司
XCC1314R106T0RGZ	CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1314R106T0RSK	CC1314R10 SimpleLink™ High-Performance Sub-1 GHz Wireless MCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TITexas Instruments 德州仪器美国德州仪器公司
XCC1314R106T0RSK	CC1314R10 SimpleLink™ High-Performance Sub-1GHz Wireless MCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1354P106T0RGZ	CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1354P106T0RGZ	CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1354P106T0RSK	CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1354P106T0RSK	CC1354P10 SimpleLink™ High-Performance Multi-band Wireless MCU With Integrated Power Amplifier 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1354R106T0RGZ	CC1354R10 SimpleLink™ High-Performance Multi-Band Wireless MCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1354R106T0RGZ	CC1354R10 SimpleLink™ High-Performance Multiband Wireless MCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1354R106T0RSK	CC1354R10 SimpleLink™ High-Performance Multi-Band Wireless MCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMisavailabl	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1354R106T0RSK	CC1354R10 SimpleLink™ High-Performance Multiband Wireless MCU 1Features Wirelessmicrocontroller •Powerful48MHzArm®Cortex®-M33processor withTrustZone® •FPUandDSPextension •1024kBflashprogrammemory •8kBofcacheSRAM •256kBofultra-lowleakageSRAMwithparityfor high-reliabilityoperation –32kBofadditionalSRAMifparityisdis	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC2745P1E0WRHARQ1	CC274xR-Q1, CC274xP-Q1 AutomotiveSimpleLink™ Bluetooth® 6.0 Low Energy Wireless MCU 1Features WirelessMCUProcessingElements •Arm®Cortex®-M33processor(96MHz)withFPU (floatingpointunit),TrustZone®-Msupportand CDE(customdatapathextension)formachine learningacceleration •AlgorithmProcessingUnit(APU)(96MHz) –Mathematicalacceleratorforefficientvect	TITexas Instruments 德州仪器美国德州仪器公司
XCC2745P1E0WRHARQ1	CC274xR-Q1, CC274xP-Q1 AutomotiveSimpleLink™ Bluetooth® 5.4 Low Energy Wireless MCU 1Features WirelessMCUProcessingElements •Arm®Cortex®-M33processor(96MHz)withFPU (floatingpointunit),TrustZone®-Msupportand CDE(customdatapathextension)formachine learningacceleration •AlgorithmProcessingUnit(APU)(96MHz) –Mathematicalacceleratorforefficientvect	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC3300ENJARSBR	CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver 1Features •HighlyoptimizedWi-Fi®6andBluetooth® LowEnergy5.2systemforlow-costindustrial embeddedapplications •DesignedtointegratewithanyMPUorMCUhost capableofrunningaTCP/IPstack •Wi-Fi6 –MAC,baseband,andRFtransceiverwith supportforIEEE802.11b/g/n/ax	TITexas Instruments 德州仪器美国德州仪器公司
XCC3301ENJARSBR	CC330x SimpleLink™ Wi-Fi® 6 and Bluetooth® Low Energy Transceiver 1Features •HighlyoptimizedWi-Fi®6andBluetooth® LowEnergy5.2systemforlow-costindustrial embeddedapplications •DesignedtointegratewithanyMPUorMCUhost capableofrunningaTCP/IPstack •Wi-Fi6 –MAC,baseband,andRFtransceiverwith supportforIEEE802.11b/g/n/ax	TITexas Instruments 德州仪器美国德州仪器公司
XCC3301MODENIAMOZR	CC330xMOD SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy Companion Module 1Features KeyFeatures •Wi-Fi6(802.11ax) •Bluetooth®LowEnergy5.4inCC33x1MOD •CompanionmoduletoanyprocessororMCUhost capableofrunningaTCP/IPstack •Integrated2.4GHzPAforcompletewireless systemwithupto+18dBmoutputpower •Operatingtemperature:–40°Cto+85°C	TITexas Instruments 德州仪器美国德州仪器公司
XCC3350ENJARSBR	CC335x SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion IC 1Features KeyFeatures •Wi-Fi6(802.11ax) •Bluetooth®LowEnergy5.4inCC33x1devices •CompanionICtoanyprocessororMCUhost capableofrunningaTCP/IPstack •Integrated2.4/5GHzPAforcompletewireless solutionwithupto+20.5dBmoutputpower. •Operatingtemperature:–40°C	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC3351ENJARSBR	CC335x SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Companion IC 1Features KeyFeatures •Wi-Fi6(802.11ax) •Bluetooth®LowEnergy5.4inCC33x1devices •CompanionICtoanyprocessororMCUhost capableofrunningaTCP/IPstack •Integrated2.4/5GHzPAforcompletewireless solutionwithupto+20.5dBmoutputpower. •Operatingtemperature:–40°C	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC3500ENJARSHR	CC350xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andcache(32KBor64KB)forimproved code	TITexas Instruments 德州仪器美国德州仪器公司
XCC3500ENJARSHR	CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TI2Texas Instruments 德州仪器美国德州仪器公司
XCC3500ENJARSHR.B	CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TI2Texas Instruments 德州仪器美国德州仪器公司
XCC3501ENJARSHR	CC350xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andcache(32KBor64KB)forimproved code	TITexas Instruments 德州仪器美国德州仪器公司
XCC3501ENJARSHR	CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TI2Texas Instruments 德州仪器美国德州仪器公司
XCC3501ENJARSHR.B	CC35xE 2.4GHz SimpleLink™ Wi-Fi 6 and Bluetooth®Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TI2Texas Instruments 德州仪器美国德州仪器公司
XCC3550ENJARSHR	CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TITexas Instruments 德州仪器美国德州仪器公司
XCC3550ENJARSHR	CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TI2Texas Instruments 德州仪器美国德州仪器公司
XCC3550ENJARSHR.B	CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TI2Texas Instruments 德州仪器美国德州仪器公司
XCC3551ENJARSHR	CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TITexas Instruments 德州仪器美国德州仪器公司
XCC3551ENJARSHR	CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TI2Texas Instruments 德州仪器美国德州仪器公司
XCC3551ENJARSHR.B	CC355xE SimpleLink™ 2.4GHz and 5GHz Dual-Band Wi-Fi 6 and Bluetooth® Low Energy Wireless MCU 1Features Microcontroller •Powerful160MHzArm®Cortex®-M33processor withFPU,TrustZone®,andAIacceleration •High-speedquad-SPIandoctal-SPIforXiPflash withon-the-flydecryption •Flexibleconfigurationoflow-latencyTCM(upto 32KB)andCache(32KBor64KB)forimproved code	TI2Texas Instruments 德州仪器美国德州仪器公司
XCC-01	Ultra-high efficiency 1U size 文件：460.06 Kbytes Page：4 Pages	etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商
XCC-01	包装：散装描述：CONFIG PWR CHASSIS 1000W 6 SLOT 电源 - 外部/内部（板外） AC DC 可配置电源机架	ADVANCEDENERGYAdvanced Energy Industries, Inc. 先进能源工业先进能源工业公司
XCC-02	包装：散装描述：CONFIGURABLE POWER SUPPLY 电源 - 外部/内部（板外） AC DC 可配置电源机架	ADVANCEDENERGYAdvanced Energy Industries, Inc. 先进能源工业先进能源工业公司
XCC123456P03A	next generation power source 文件：1.94152 Mbytes Page：13 Pages	etc2List of Unclassifed Manufacturers etc未分类制造商etc2未分类制造商
XCC1312R1F3RGZR	SimpleLink High-Performance Sub-1 GHz Wireless MCU 文件：550.88 Kbytes Page：48 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1352P1F3RGZR	SimpleLink High-Performance Dual-Band Wireless MCU With Integrated Power Amplifier 文件：502.43 Kbytes Page：60 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC1352P74T0RGZ	CC1352P7 SimpleLink??High-Performance Multi-Band Wireless MCU With Integrated Power Amplifier 文件：3.92276 Mbytes Page：82 Pages	TITexas Instruments 德州仪器美国德州仪器公司
XCC1352R1F3RGZR	SimpleLink High-Performance Dual-Band Wireless MCU 文件：1.11047 Mbytes Page：54 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC2640R2FTWRGZTQ1	SimpleLink Bluetooth low energy Wireless MCU for Automotive 文件：1.36076 Mbytes Page：40 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC2642R1FRGZR	SimpleLink Bluetooth 5 low energy Wireless MCU 文件：1.01677 Mbytes Page：45 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC2651R31T0RGZ	CC2651R3 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件：2.66363 Mbytes Page：60 Pages	TITexas Instruments 德州仪器美国德州仪器公司
XCC2652R1FRGZR	SimpleLink Multiprotocol 2.4-GHz Wireless MCU 文件：1.02669 Mbytes Page：47 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC2652R74T0RGZ	CC2652R7 SimpleLink??Multiprotocol 2.4 GHz Wireless MCU 文件：2.90059 Mbytes Page：58 Pages	TITexas Instruments 德州仪器美国德州仪器公司
XCC2652RBRGZR	SimpleLink crystal-less BAW multiprotocol 2.4-GHz wireless MCU 文件：2.70983 Mbytes Page：54 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC2652RBRGZR	SimpleLink crystal-less BAW multiprotocol 2.4-GHz wireless MCU 文件：1.19817 Mbytes Page：47 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC2652RSIPMOTR	CC2652RSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package 文件：2.00407 Mbytes Page：60 Pages	TITexas Instruments 德州仪器美国德州仪器公司
XCC2652RSIPMOTR	CC2652RSIP SimpleLink??Multiprotocol 2.4-GHz Wireless System-in-Package 文件：2.32458 Mbytes Page：67 Pages	TITexas Instruments 德州仪器美国德州仪器公司
XCC2662R1FTWRGZRQ1	CC2662R-Q1 SimpleLink??Wireless BMS MCU 文件：2.34055 Mbytes Page：47 Pages	TITexas Instruments 德州仪器美国德州仪器公司
XCC3000MOD	Module ??Wi-Fi 802.11b/g Network Processor 文件：1.63552 Mbytes Page：19 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC3000MOD	TI SimpleLink CC3000 Module . Wi-Fi 802.11b/g Network Processor 文件：643.28 Kbytes Page：16 Pages	TITexas Instruments 德州仪器美国德州仪器公司
XCC3000MOD	SimpleLink Wi-Fi CC3000 Module from Texas Instruments 文件：41.41 Kbytes Page：3 Pages	TITexas Instruments 德州仪器美国德州仪器公司
xCC3120MODRNMMOBR	SimpleLink Wi-Fi CERTIFIED Network Processor Internet-of-Things Module Solution for MCU Applications 文件：2.0633 Mbytes Page：52 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC3135MODRNMMOBR	SimpleLink Wi-Fi CERTIFIED Dual-Band Network Processor Module Solution for MCU Applications 文件：1.71318 Mbytes Page：60 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC3220MODSF12MOBR	SimpleLink Wi-Fi CERTIFIED Wireless Module Solution 文件：2.11812 Mbytes Page：82 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC3220MODSM2MOBR	SimpleLink Wi-Fi CERTIFIED Wireless Module Solution 文件：2.11812 Mbytes Page：82 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC3235MODASF12MON	CC3235MODAx SimpleLink??Wi-Fi CERTIFIED??Dual-band Wireless MCU Module 文件：2.13152 Mbytes Page：100 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司
XCC3235MODASM2MONR	CC3235MODAx SimpleLink??Wi-Fi CERTIFIED??Dual-band Wireless MCU Module 文件：2.13152 Mbytes Page：100 Pages	TI1Texas Instruments 德州仪器美国德州仪器公司

XCC产品属性

类型
描述
型号
XCC
制造商
Excelsys Technologies
制造商
Excelsys
功能描述
Modular PSU chassis XCC, 6 slot, 1000W

XCC供应商更多...

更新时间：2025-7-22 20:25:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
中天科工半导体（深圳）有限公司	XCC3100ZH1MRTDT	TI	20+	SOIC	19570	原装优势主营型号-可开原型号增税票	询价
深圳市得捷芯城科技有限公司	XCCACE-TQ144I	XILINX(赛灵思)	24+	标准封装	7498	原厂直销,大量现货库存,交期快。价格优,支持账期	询价
深圳市金芯世纪电子有限公司	XCCACE-TQG144I	XILINX/赛灵思	22+	aa	100000	代理渠道/只做原装/可含税	询价
深圳市科芯源微电子有限公司	XCCACE-TQ144	XILINX/赛灵思	25+	QFP144	54658	百分百原装现货实单必成	询价
深圳市益百分电子有限公司	XCCACEM32-1BG388	xilinx	22+	BGA	6800		询价
华富测量(深圳)传感技术有限公司	XCCACEM32BG388	XILINX	2138+	BGA	8960	专营BGA,QFP原装现货,假一赔十	询价
深圳市科恒伟业电子有限公司	XCC508121	MOTO	1715+	SOP	251156	只做原装正品现货假一赔十!	询价
深圳市振宏微科技有限公司	XCCACE-TQG144I	XILINX	23+	BGA	8659	原装公司现货!原装正品价格优势.	询价
深圳市科达星科技有限公司	XCCACF-TQG144I	XILINX	24+	TQFP	26200	原装现货,诚信经营!	询价
深圳市鸿昌盛电子科技有限公司	XCCACE-TQG144I	XILINX	20+	QFP144	1425		询价

XCC芯片相关品牌

XCC规格书下载地址

XCC参数引脚图相关

XCC数据表相关新闻

XC9572XL-7VQG64I
XC9572XL-7VQG64I
2020-11-19
XCA201A06BCR
可持续短路保护空载输入电流低至5mA? 工作温度范围：-40℃to+105℃? 效率高达83%_? 隔离电压1500VDC? 国际标准引脚方式? SIP封装? 符合UL62368，EN62368认证(认证中) 输出电压精度+10%~-7.5%_ 线性调节率1.2%_ 负载调节率10%_ 纹波&噪声*_30mVp-p
2020-8-27
XC9572XL-10VQG64C
192CPLD-复杂可编程逻辑器件,CoolRunner-IICPLD-复杂可编程逻辑器件,VQFP-44XC9572XLCPLD-复杂可编程逻辑器件,VQFP-44XA9572XLCPLD-复杂可编程逻辑器件,116I/OCPLD-复杂可编程逻辑器件,192I/OCPLD-复杂可编程逻辑器件
2020-8-14
XCF02SVO20C
热门搜索： PLCC-44FPGA-配置存储器
2020-7-20
XCCACE-TQG144I
产品属性属性值搜索相似制造商：赛灵思产品分类：赛灵思牌：赛灵思
2020-7-20
XCF02SVOG20C
217-XCF02SVOG20C
2020-7-8

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