封装/外壳：44-TQFP 包装：管件 描述：IC PROM SER I-TEMP 3.3V 44-VQFP 集成电路（IC） 用于 FPGA 的配置 PROM

封装/外壳：44-TQFP 包装：管件 描述：IC PROM REPROGR 2MB 44-VQFP 集成电路（IC） 用于 FPGA 的配置 PROM

Transient Voltage Suppressors for ESD Protection

Features Protects One Bidirectional I/O Line Low Clamping Voltage Surface mount package. Ultra small SMD package. Stand−off Voltage: 18.0 V Low leakage current 76 Watts Peak Pulse Power per Line (tp=8/20μs) IEC61000-4-5 (LIGHTING) 2.0A (8/20μs) Provides ESD protection to IEC61000-4-2(ESD)

Transient Voltage Suppressors for ESD Protection

Features Moisture Sensitivity Level (MSL-1) AEC-Q101 qualified Ultra small SMD package Protects One Bidirectional I/O Line Low Clamping Voltage Working Voltage :18.0V Low leakage current IEC61000-4-5(LIGHTING) 2.0A(8/20μs) IEC61000-4-2(ESD):±15kV (air discharge) ±8kV (contact discharge);