Features

• Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.

• Low profile surface mounted application in order to optimize board space.

• Low power loss, high efficiency.

• High current capability, very low forward voltage drop.

• High surge capability.

• Guardring for overvoltage protection.

• Very tiny plastic SMD package.

• Ultra high-speed switching.

• Silicon epitaxial planar chip, metal silicon junction.

• Moisture Sensitivity Level 1