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LPA100T中文资料
LPA100T数据手册规格书PDF详情
Key features
• 300 μW power consumption
• BOV settling time of <10 ms
• Certified version available for use in hazardous areas (LPA100T-D2)
• Internal temperature sensor
• Manufactured in ISO 9001 facility
更新时间：2025-11-2 23:00:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
Amphenol |
24+ |
8215 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
||||
Amphenol FCI |
2447 |
Module |
115000 |
1个/袋一级代理专营品牌!原装正品,优势现货,长期排 |
|||
RFBay |
20+ |
100 |
每一片来自原厂! |
||||
rf-bay |
24+ |
模块 |
400 |
||||
RFbay |
700 |
||||||
SST |
2023+ |
QFP |
50000 |
原装现货 |
|||
BOURNS |
25+ |
电感器 |
3483 |
就找我吧!--邀您体验愉快问购元件! |
|||
BOURNS/伯恩斯 |
15+Rohs |
DIP |
493900 |
一级质量长期可供应量大价格从优 |
|||
BOURNS/伯恩斯 |
12+ |
DIP |
5 |
||||
Bourns |
25+ |
电联咨询 |
7800 |
公司现货,提供拆样技术支持 |
LPA100T 资料下载更多...
LPA100T 芯片相关型号
- 108008S4F02CS6J
- 108008S4F02CS6L
- 108008S4F02CS6M
- 10F5504HHS04LSP1SG0J
- 10F5504HHS04LSP1SG0L
- 10F5504HHS04LSP1SG0M
- 10F5504HHS04LSP1SG1J
- 10F5504HHS04LSP1SG1L
- 10F5504HHS04LSP1SG1M
- 201130FD25BXVD
- 638-026-630-041
- 638-026-630-042
- 638-026-630-043
- 638-026-630-046
- 638-026-630-061
- 638-026-630-062
- 638-026-630-063
- 638-026-630-066
- 638-026-630-067
- 638-026-630-068
- 638-026-630-069
- JANI20-8-125-X11
- LPA100T-D2
- LPFUN-161M1W
- RS-2517-0625
- SAN.M13.GLA.7R
- SAN.M13.GLA.7RZ
- SAN.M13.GLA.7V
- W2CA-511-M2
WILCOXON相关芯片制造商
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