WF12价格

参考价格:¥0.1746

型号:WF1206S3R3JTL 品牌:Kamaya 备注:这里有WF12多少钱,2025年最近7天走势,今日出价,今日竞价,WF12批发/采购报价,WF12行情走势销售排行榜,WF12报价。
型号 功能描述 生产厂家 企业 LOGO 操作
WF12

包装:散装 描述:FOLDING TOOL,12\ 工具 专用工具

ATG

WF121 Wi-Fi MODULE

KEY FEATURES: ▪ 2.4GHz band IEEE 802.11 b/g/n radio ▪ Excellent radio performance: ▪ TX power: +16 dBm ▪ RX sensitivity: -97 dBm ▪ Host interfaces: ▪ 10Mbps UART ▪ SPI ▪ USB device ▪ Peripheral interfaces: ▪ GPIO, ADC and timers ▪ I2C, SPI and UART ▪ Ethernet ▪ Embedded TCP/IP and 802

SILABS

芯科科技

WF121 Wi-Fi MODULE

KEY FEATURES: ▪ 2.4GHz band IEEE 802.11 b/g/n radio ▪ Excellent radio performance: ▪ TX power: +16 dBm ▪ RX sensitivity: -97 dBm ▪ Host interfaces: ▪ 10Mbps UART ▪ SPI ▪ USB device ▪ Peripheral interfaces: ▪ GPIO, ADC and timers ▪ I2C, SPI and UART ▪ Ethernet ▪ Embedded TCP/IP and 802

SILABS

芯科科技

WF121 Wi-Fi MODULE

KEY FEATURES: ▪ 2.4GHz band IEEE 802.11 b/g/n radio ▪ Excellent radio performance: ▪ TX power: +16 dBm ▪ RX sensitivity: -97 dBm ▪ Host interfaces: ▪ 10Mbps UART ▪ SPI ▪ USB device ▪ Peripheral interfaces: ▪ GPIO, ADC and timers ▪ I2C, SPI and UART ▪ Ethernet ▪ Embedded TCP/IP and 802

SILABS

芯科科技

WF121 Wi-Fi MODULE

KEY FEATURES: ▪ 2.4GHz band IEEE 802.11 b/g/n radio ▪ Excellent radio performance: ▪ TX power: +16 dBm ▪ RX sensitivity: -97 dBm ▪ Host interfaces: ▪ 10Mbps UART ▪ SPI ▪ USB device ▪ Peripheral interfaces: ▪ GPIO, ADC and timers ▪ I2C, SPI and UART ▪ Ethernet ▪ Embedded TCP/IP and 802

SILABS

芯科科技

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

5V FLASH MODULE

[WHITS MICROSELECTRONICS] FEATURES ■ Access Times of 50, 60, 70, 90, 120 and 150ns ■ 40 pin Ceramic DIP (Package 303) ■ Organized as 128Kx16 and 256Kx16 ■ Sector Architecture • 8 equal size sectors of 16KBytes each per chip • Any combination of sectors can be concurrently erased. Al

ETCList of Unclassifed Manufacturers

未分类制造商

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

128KX32 5V FLASH MODULE, SMD 5962-94716

FEATURES ■ Access Times of 50**, 60, 70, 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400) • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch) square, 3.56mm (0.140 inch) high (Package 510) • 68 lead, Hermetic CQFP (G2L), 22.4mm (0.

WEDC

WF12产品属性

  • 类型

    描述

  • 型号

    WF12

  • 制造商

    Weidmuller

  • 功能描述

    TERMINAL BLOCK HIGH CURRENT 12MM

更新时间:2025-11-22 22:30:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
WEDC
24+
PGA
8000
只做自己库存 全新原装进口正品假一赔百 可开13%增
WEDC
QFP
1
一级代理,专注军工、汽车、医疗、工业、新能源、电力
WALSIN
24+
90000
原装正品假一赔十
WSI
23+
QFP
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
SILICON LABS(芯科)
24+
模块
8328
原厂可订货,技术支持,直接渠道。可签保供合同
ATOM/爱特姆
25+
SMD
518000
明嘉莱只做原装正品现货
WHIT
23+
65480
WALSIN/华新科
2450+
NA
9850
只做原厂原装正品现货或订货假一赔十!
WEDC
QQ咨询
PGA
65
全新原装 研究所指定供货商
WF12S05/1000Z
25+
1
1

WF12数据表相关新闻