8Mx32 SDRAM

DESCRIPTION The WED3DL328V is an 8Mx32 Synchronous DRAM configured as 4x2Mx32. The SDRAM BGA is constructed with two 8Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 119 lead, 14mm by 22mm, BGA. FEATURES ■ 53 Space Savings vs. Monolithic Solution ■ Reduced System I

8Mx32 SDRAM

8Mx32 SDRAM

DESCRIPTION The WED3DL328V is an 8Mx32 Synchronous DRAM configured as 4x2Mx32. The SDRAM BGA is constructed with two 8Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 119 lead, 14mm by 22mm, BGA. FEATURES ■ 53 Space Savings vs. Monolithic Solution ■ Reduced System I

8Mx32 SDRAM

DESCRIPTION The WED3DL328V is an 8Mx32 Synchronous DRAM configured as 4x2Mx32. The SDRAM BGA is constructed with two 8Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 119 lead, 14mm by 22mm, BGA. FEATURES ■ 53 Space Savings vs. Monolithic Solution ■ Reduced System I

8Mx32 SDRAM

DESCRIPTION The WED3DL328V is an 8Mx32 Synchronous DRAM configured as 4x2Mx32. The SDRAM BGA is constructed with two 8Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 119 lead, 14mm by 22mm, BGA. FEATURES ■ 53 Space Savings vs. Monolithic Solution ■ Reduced System I

8Mx32 SDRAM

DESCRIPTION The WED3DL328V is an 8Mx32 Synchronous DRAM configured as 4x2Mx32. The SDRAM BGA is constructed with two 8Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 119 lead, 14mm by 22mm, BGA. FEATURES ■ 53 Space Savings vs. Monolithic Solution ■ Reduced System I

8Mx32 SDRAM

DESCRIPTION The WED3DL328V is an 8Mx32 Synchronous DRAM configured as 4x2Mx32. The SDRAM BGA is constructed with two 8Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 119 lead, 14mm by 22mm, BGA. FEATURES ■ 53 Space Savings vs. Monolithic Solution ■ Reduced System I

8Mx32 SDRAM

DESCRIPTION The WED3DL328V is an 8Mx32 Synchronous DRAM configured as 4x2Mx32. The SDRAM BGA is constructed with two 8Mx16 SDRAM die mounted on a multi-layer laminate substrate and packaged in a 119 lead, 14mm by 22mm, BGA. FEATURES ■ 53 Space Savings vs. Monolithic Solution ■ Reduced System I