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WE320	DC-DC Power Supplies 20 Watts WE Series • High Power Density • Fully Regulated Outputs • Efficiency to 86 • Low Voltage Outputs • Remote On/Off • 2:1 Input Range • 2.5, 3.3 & 5 V Versions	XPPOWER	XPPOWER
WE32K32N-120G2UC	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120G2UCA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120G2UI	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120G2UIA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120G2UM	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120G2UMA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120G2UQ	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120G2UQA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120H1C	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120H1CA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120H1I	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120H1IA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120H1M	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120H1MA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120H1Q	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-120H1QA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150G2UC	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150G2UCA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150G2UI	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150G2UIA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150G2UM	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150G2UMA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150G2UQ	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150G2UQA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150H1C	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150H1CA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150H1I	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150H1IA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150H1M	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150H1MA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150H1Q	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-150H1QA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90G2UC	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90G2UCA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90G2UI	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90G2UIA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90G2UM	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90G2UMA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90G2UQ	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90G2UQA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90H1C	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90H1CA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90H1I	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90H1IA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90H1M	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90H1MA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90H1Q	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32N-90H1QA	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE32K32-XXX	32Kx32 EEPROM MODULE, SMD 5962-94614 FEATURES ■ Access Times of 80**, 90, 120, 150ns ■ MIL-STD-883 Compliant Devices Available ■ Packaging: • 68 lead, Hermetic CQFP (G2U), 122.4mm (0.880) square, 3.56mm (0.140) height (Package 510). • 66-pin, PGA Type, 1.075 square, Hermetic Ceramic HIP (Package 400) ■ Data Retention at	WEDC	WEDC
WE320	DC-DC Power Supplies 文件：84.14 Kbytes Page：2 Pages	XPPOWER	XPPOWER
WE320_06	DC-DC Power Supplies 文件：84.14 Kbytes Page：2 Pages	XPPOWER	XPPOWER
WE32K32N-120G2UC	Access time:120 ns; 32K x 32 EEPROM module, SMD 5962-94614	WEDC	WEDC
WE32K32-XXX	32Kx32 EEPROM MODULE, SMD 5962-94614	Microchip 微芯科技	Microchip

WE32产品属性

类型
描述
型号
WE32
制造商
XP Power
功能描述
DC-DC CONV, ISO POL, 1 O/P, 20W, 5A, 2.5V, DC/DC Converter
Type
Isolated POL,

WE32供应商更多...

更新时间：2025-12-30 11:09:00

IC供应商	芯片型号	品牌	批号	封装	库存	备注	价格
贸泽芯城（深圳）电子科技有限公司	WE3272A	WINBOND/华邦	23+	DIP8	11200	原厂授权一级代理、全球订货优势渠道、可提供一站式BO	询价
深圳市星辰微电科技有限公司	WE45-0600WG	Marki microwave	24+	N/A	4500	Marki优势渠道	询价
深圳市莱克讯科技有限公司	WE-32K32-150HC	AD		DIP	2230	只做进口原装!假一赔百!自己库存价优!	询价
深圳市瑞祥辉半导体有限公司	WE-32K32-150HC		2318+	PGA	4862	只做进口原装!假一赔百!自己库存价优!	询价
深圳市宏捷佳电子科技有限公司	WE327AR	AT&T	2023+	PLCC68	50000	原装现货	询价
深圳市一线半导体有限公司	WE32101	AT&T	24+	PGA	1		询价
深圳市昌和盛利电子有限公司	WE327AR	AT&T	NEW	PLCC68	9526	代理全系列销售,全新原装正品,价格优势,长期供应,量大可订	询价
深圳市骏创达科技有限公司	WE4.0-12	JST/日压	2508+	/	470984	一级代理，原装现货	询价
深圳市欧立现代科技有限公司	WE327AR	AT&T	24+	PLCC68	6868	原装现货,可开13%税票	询价
深圳市美盛芯微电子有限公司	WE327AR	AT&T	2025+	PLCC68	1000		询价

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只做原装，假一罚十，可开16%增值税票。主营：魏德米勒，TE.NXP.ON.Renesas.Microchip.英飞凌.ALLEGRO
2019-4-2
WDK4NV魏德米勒端子，深圳现货
只做原装，假一罚十，可开16%增值税票。主营：魏德米勒，TE.NXP.ON.Renesas.Microchip.英飞凌.ALLEGRO
2019-4-2
WC121只做进口原装现货
瀚佳科技(深圳）有限公司:专业销售集成电路IC.单片机.内存闪存.二三级管模块等电子元器件。
2018-12-30

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