FEATURES

• Ultrafast Trench IGBT technology

• HEXFRED® and silicon carbide diode technology

• PressFit pins technology

• Exposed Al2O3 substrate with low thermal resistance

• Low internal inductances

• PressFit pins locking technology. Patent # US.263.820 B2

• UL approved file E78996

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

DESCRIPTION

VS-ENQ030L120S is an integrated solution for a neutral

point clamp topology in a single package. The EMIPAK-1B

package is easy to use thanks to the PressFit pins and the

exposed substrate provides improved thermal performance.

The optimized layout also helps to minimize stray

parameters, allowing for better EMI performance.