FEATURES

• Ultra compact LLP1006-2L package

• Low package profile < 0.4 mm

• 1-line ESD protection

• High surge current acc. IEC 61000-4-5

IPPM > 3 A

• Low leakage current IR < 0.1 μA

• Low load capacitance CD = 0.9 pF

• ESD immunity acc. IEC 61000-4-2

± 15 kV contact discharge

± 15 kV air discharge

• Soldering can be checked by standard vision inspection;

no X-ray necessary

• Pin plating NiPdAu (e4) no whisker growth

• e4 - precious metal (e.g. Ag, Au, NiPd, NiPdAu) (no Sn)

• PATENT(S): www.vishay.com/patents

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912