FEATURES

• Ultra compact LLP1006-2M package

• Low package height < 0.4 mm

• 1-line ESD protection

• Working range ± 3.3 V

• Low leakage current < 0.01 μA

• Ultra low load capacitance CD = 0.36 pF typ.

• ESD immunity acc. IEC 61000-4-2

± 18 kV contact discharge

± 18 kV air discharge

• e3 - Sn

Tin plated exposed side wall of lead frame

- Soldering can be checked by standard vision inspection

- AOI = Automated Optical Inspection

- No X-ray necessary

• Lead material: Cu

• PATENT(S): www.vishay.com/patents

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912