型号 功能描述 生产厂家 企业 LOGO 操作

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

ADD-A-pak GEN V Power Modules

文件:109.88 Kbytes Page:7 Pages

IRF

ADD-A-pak GEN V Power Modules

文件:109.88 Kbytes Page:7 Pages

IRF

ADD-A-pak GEN V Power Modules

文件:109.88 Kbytes Page:7 Pages

IRF

ADD-A-pak GEN V Power Modules

文件:109.88 Kbytes Page:7 Pages

IRF

更新时间:2026-1-2 9:38:01
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
2018
模块
300
十七年VIP会员,诚信经营,一手货源,原装正品可零售!
IR
24+
module
6000
全新原装正品现货 假一赔佰
IR
22+
原廠原封
650
全新原装现货!自家库存!
IR
100
原装现货,价格优惠
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
23+
3000
原装正品假一罚百!可开增票!
IR
NEW
模块
3562
代理全系列销售,全新原装正品,价格优势,长期供应,量大可订
IR
23+
MODULE
7000
VISHAY/IR
24+
原厂封装
110
原装现货假一罚十
IR
25+23+
44519
绝对原装正品全新进口深圳现货

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