HEXFRED® Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically insulated by DBC ceramic • 3500 VRMS isolating voltage • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • UL approved file E78996 • Case style INT-A-PAK • Designed and qualified for industr

FLEXIBLE, MODULAR LAN ROUTER

+ Powerful CPU and enhanced memory + Extended operational temperature range from -40 °C to +75 °C + 10-60 VDC operation with transient and reverse polarity voltage protection + MicroSD card holder, In/Out, USB Host + Low power consumption mode for solar and battery power applications + Optio

HEXFRED® Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically insulated by DBC ceramic • 3500 VRMS isolating voltage • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • UL approved file E78996 • Case style INT-A-PAK • Designed and qualified for industr

HEXFRED® Ultrafast Diodes, 300 A (INT-A-PAK Power Modules)

FEATURES • Electrically isolated: DCB base plate • Standard JEDEC® package • Simplified mechanical designs, rapid assembly • High surge capability • Large creepage distances • Case style INT-A-PAK • Designed and qualified for industrial level • Material categorization: for definitions of c