HEXFRED® Ultrafast Diodes, 30 A (Single Phase Bridge MTP Power Modules)

FEATURES • Low profile package • Low trr and Qrr • Soft reverse recovery • Direct mounting to heatsink • Round pin with PCB solderable terminals • UL approved file E78996 • Low junction to case thermal resistance • 3500 VRMS insulation voltage • Material categorization: for definitions of

HEXFRED® Ultrafast Diodes, 30 A (Single Phase Bridge MTP Power Modules)

FEATURES • Low profile package • Low trr and Qrr • Soft reverse recovery • Direct mounting to heatsink • Round pin with PCB solderable terminals • UL approved file E78996 • Low junction to case thermal resistance • 3500 VRMS insulation voltage • Material categorization: for definitions of

封装/外壳：7-MTPB 包装：散装 描述：BRIDGE RECT 3P 1.2KV 35A 7-MTPB 分立半导体产品 二极管 - 桥式整流器

HEXFRED® Ultrafast Diodes, 30 A (Single Phase Bridge MTP Power Modules)

HEXFRED짰 Ultrafast Diodes, 30 A

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HEXFRED® Ultrafast Diodes, 30 A (Single Phase Bridge MTP Power Modules)

FEATURES • Low profile package • Low trr and Qrr • Soft reverse recovery • Direct mounting to heatsink • Round pin with PCB solderable terminals • UL approved file E78996 • Low junction to case thermal resistance • 3500 VRMS insulation voltage • Material categorization: for definitions of

HEXFRED® Ultrafast Diodes, 30 A (Single Phase Bridge MTP Power Modules)

FEATURES • Low profile package • Low trr and Qrr • Soft reverse recovery • Direct mounting to heatsink • Round pin with PCB solderable terminals • UL approved file E78996 • Low junction to case thermal resistance • 3500 VRMS insulation voltage • Material categorization: for definitions of