Ultra High Precision Z-Foil Power Resistor in TO-220 Configuration with TCR of ± 0.05 ppm/°C, PCR of 4 ppm/W and Load Life Stability of ± 0.005 % (50 ppm)

IMPROVED PRODUCT FEATURES  Temperature coefficient of resistance (TCR): ± 0.05 ppm/°C typical (0 °C to + 60 °C) ± 0.2 ppm/°C typical (- 55 °C to + 125 °C, + 25 °C ref.) (see table 1)  Tolerance: to ± 0.01 %  Power coefficient “R due to self heating” 4 ppm/W typical  Rated power: 8

Ultra High Precision Z-Foil Power Resistor in TO-220 Configuration with TCR of ± 0.05 ppm/°C,

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Ultra High Precision Z-Foil Power Resistor in TO-220 Configuration with TCR of ± 0.05 ppm/°C, PCR of 4 ppm/W and Load Life Stability of ± 0.005 % (50 ppm)

IMPROVED PRODUCT FEATURES  Temperature coefficient of resistance (TCR): ± 0.05 ppm/°C typical (0 °C to + 60 °C) ± 0.2 ppm/°C typical (- 55 °C to + 125 °C, + 25 °C ref.) (see table 1)  Tolerance: to ± 0.01 %  Power coefficient “R due to self heating” 4 ppm/W typical  Rated power: 8

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CD-Interface and Audio Processor(CIAP) This technical summary provides a brief description of the MCD221 CD–Interface and Audio Processor. A complete data sheet for the MCD221 is available and can be ordered from your local Motorola sales office. The order number is MCD221/D. The MCD221 has two

CD-Interface and Audio Processor(CIAP)

CD-Interface and Audio Processor(CIAP) This technical summary provides a brief description of the MCD221 CD–Interface and Audio Processor. A complete data sheet for the MCD221 is available and can be ordered from your local Motorola sales office. The order number is MCD221/D. The MCD221 has two

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Silicon NPN epitaxial planer transistor

Silicon NPN epitaxial planar transistor For digital circuits ■ Features • Costs can be reduced through downsizing of the equipment and reduction of the number of parts. • Mini type package allowing easy automatic insertion through tape packing and magazine packing

Silicon NPN epitaxial planer transistor

Silicon NPN epitaxial planar transistor For digital circuits ■ Features • Costs can be reduced through downsizing of the equipment and reduction of the number of parts. • Mini type package allowing easy automatic insertion through tape packing and magazine packing