UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

FEATURES ✔ ESD Protection > 25 kilovolts ✔ Low ESD Overshoot Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ Low Capacitance: 6pF ✔ Low Leakage Current ✔ RoHS Compliant APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Comp

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

FEATURES ✔ ESD Protection > 25 kilovolts ✔ Available in Six Voltage Types Ranging From 3.3V to 24V ✔ Low ESD Overshoot Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ LOW CAPACITANCE: 6pF ✔ LOW LEAKAGE CURRENT APPLICATIONS ✔ Cellular Phones ✔ Personal

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

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Ultra Low Capacitance Unbumped Flip Chip TVS Array

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

FEATURES ✔ ESD Protection > 25 kilovolts ✔ Low ESD Overshoot Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ Low Capacitance: 6pF ✔ Low Leakage Current ✔ RoHS Compliant APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Comp

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

FEATURES ✔ ESD Protection > 25 kilovolts ✔ Low ESD Overshoot Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ Low Capacitance: 6pF ✔ Low Leakage Current ✔ RoHS Compliant APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Comp

UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY

FEATURES ✔ ESD Protection > 25 kilovolts ✔ Low ESD Overshoot Voltage ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ Low Capacitance: 6pF ✔ Low Leakage Current ✔ RoHS Compliant APPLICATIONS ✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Notebook Comp

200W LOW CAPACITANCE flip chip tvs array

DESCRIPTION The LC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series

FLIP CHIP ARRAY

DESCRIPTION The P0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series m

200W LOW CAPACITANCE FLIP CHIP TVS ARRAY

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FLIP CHIP ARRAY

文件：106.17 Kbytes Page：5 Pages

FLIP CHIP ARRAY

文件：106.18 Kbytes Page：5 Pages