LIN fail-safe system basis chip

LIN fail-safe system basis chip

文件：299.95 Kbytes Page：64 Pages

LIN fail-safe system basis chip

LIN fail-safe system basis chip

LIN fail-safe system basis chip

封装/外壳：32-TSSOP（0.240"，6.10mm 宽）裸露焊盘 包装：卷带（TR） 描述：IC INTFACE SPECIALIZED 32HTSSOP 集成电路（IC） 专用

LIN fail-safe system basis chip

LIN fail-safe system basis chip

文件：299.95 Kbytes Page：64 Pages

LIN fail-safe system basis chip

封装/外壳：24-TSSOP（0.173"，4.40mm 宽）裸露焊盘 包装：卷带（TR） 描述：IC INTFACE SPECIALIZED 24HTSSOP 集成电路（IC） 专用

Customer Specification

Construction Diameters (In) 1) Component 1 9 X 1 COND a) Conductor 16 (19/.0117) AWG Tinned Copper 0.059 b) Insulation 0.032 Wall, Nom. PVC 0.123 (1) Color Code Alpha Wire Color Code F Cond Color Cond Color Cond Color 1 BLACK 4 GREEN 7 WHITE/BLACK 2 WHITE 5 ORANGE 8 RED/BLACK 3 RED 6 BLUE

Customer Specification

Construction Diameters (In) 1) Component 1 9 X 1 COND a) Conductor 16 (19/.0117) AWG Tinned Copper 0.059 b) Insulation 0.032 Wall, Nom. PVC 0.123 (1) Color Code Alpha Wire Color Code F Cond Color Cond Color Cond Color 1 BLACK 4 GREEN 7 WHITE/BLACK 2 WHITE 5 ORANGE 8 RED/BLACK 3 RED 6 BLUE

Heyco® Liquid Tight Strain Relief Bushings

The Ultimate in Snap-In Strain Relief Protection Snap-in, Low Profile Design allows for Pre-assembled Cables • These low profile co-molded nylon and elastomer parts function as a Liquid Tight Strain Relief with a cable. • cULus approved under UL 514B. • Low profile design: height above pan

Inst, 2 Pr #16 Str BC, PVC-NYL Ins E1, OS, Blk PVC Jkt, 600V TC-ER 150V NPLF 90C Dry/Wet

Product Description UL Instrumentation, 2 Pair 16AWG (7x24) Bare Copper, PVC-NYL Insulation E1 Color Code, Overall Beldfoil® Shield, Black PVC Outer Jacket, 600V TC-ER 150V NPLF 90C Dry/Wet SUN RES DIR BUR

120° hinge

文件：259.73 Kbytes Page：1 Pages