型号 功能描述 生产厂家&企业 LOGO 操作
UJA1069TW

LINfail-safesystembasischip

Generaldescription TheUJA1069fail-safeSystemBasisChip(SBC)replacesbasicdiscretecomponentswhicharecommonineveryElectronicControlUnit(ECU)withaLocalInterconnectNetwork(LIN)interface.Thefail-safeSBCsupportsallnetworkingapplicationswhichcontrolvariouspowerandse

nxpNXP Semiconductors

恩智浦恩智浦半导体公司

nxp
UJA1069TW

LINfail-safesystembasischip

文件:304.44 Kbytes Page:64 Pages

nxpNXP Semiconductors

恩智浦恩智浦半导体公司

nxp
UJA1069TW

LINfail-safesystembasischip

文件:299.95 Kbytes Page:64 Pages

PhilipsROYAL PHILIPS

飞利浦荷兰皇家飞利浦

Philips

LINfail-safesystembasischip

Generaldescription TheUJA1069fail-safeSystemBasisChip(SBC)replacesbasicdiscretecomponentswhicharecommonineveryElectronicControlUnit(ECU)withaLocalInterconnectNetwork(LIN)interface.Thefail-safeSBCsupportsallnetworkingapplicationswhichcontrolvariouspowerandse

nxpNXP Semiconductors

恩智浦恩智浦半导体公司

nxp

封装/外壳:32-TSSOP(0.240",6.10mm 宽)裸露焊盘 包装:卷带(TR) 描述:IC INTFACE SPECIALIZED 32HTSSOP 集成电路(IC) 专用

nxpNXP Semiconductors

恩智浦恩智浦半导体公司

nxp

LINfail-safesystembasischip

文件:304.44 Kbytes Page:64 Pages

nxpNXP Semiconductors

恩智浦恩智浦半导体公司

nxp

LINfail-safesystembasischip

文件:299.95 Kbytes Page:64 Pages

PhilipsROYAL PHILIPS

飞利浦荷兰皇家飞利浦

Philips

封装/外壳:24-TSSOP(0.173",4.40mm 宽)裸露焊盘 包装:卷带(TR) 描述:IC INTFACE SPECIALIZED 24HTSSOP 集成电路(IC) 专用

nxpNXP Semiconductors

恩智浦恩智浦半导体公司

nxp

CustomerSpecification

Construction Diameters(In) 1)Component19X1COND a)Conductor16(19/.0117)AWGTinnedCopper0.059 b)Insulation0.032Wall,Nom.PVC0.123 (1)ColorCodeAlphaWireColorCodeF CondColorCondColorCondColor 1BLACK4GREEN7WHITE/BLACK 2WHITE5ORANGE8RED/BLACK 3RED6BLUE

ALPHAWIREAlpha Wire

阿尔法电线

ALPHAWIRE

CustomerSpecification

Construction Diameters(In) 1)Component19X1COND a)Conductor16(19/.0117)AWGTinnedCopper0.059 b)Insulation0.032Wall,Nom.PVC0.123 (1)ColorCodeAlphaWireColorCodeF CondColorCondColorCondColor 1BLACK4GREEN7WHITE/BLACK 2WHITE5ORANGE8RED/BLACK 3RED6BLUE

ALPHAWIREAlpha Wire

阿尔法电线

ALPHAWIRE

Heyco®LiquidTightStrainReliefBushings

TheUltimateinSnap-InStrainReliefProtection Snap-in,LowProfileDesignallowsforPre-assembledCables •Theselowprofileco-moldednylonand elastomerpartsfunctionasaLiquid TightStrainReliefwithacable. •cULusapprovedunderUL514B. •Lowprofiledesign:heightabovepan

Heyco

Heyco

Heyco

Inst,2Pr#16StrBC,PVC-NYLInsE1,OS,BlkPVCJkt,600VTC-ER150VNPLF90CDry/Wet

ProductDescription ULInstrumentation,2Pair16AWG(7x24)BareCopper,PVC-NYLInsulationE1ColorCode,OverallBeldfoil®Shield,BlackPVCOuterJacket,600VTC-ER 150VNPLF90CDry/WetSUNRESDIRBUR

BELDEN

Belden Inc.

BELDEN

10TO1000MHzTO-8CASCADABLEAMPLIFIERS

文件:181.82 Kbytes Page:2 Pages

TELEDYNE

TELEDYNE

TELEDYNE

UJA1069TW产品属性

  • 类型

    描述

  • 型号

    UJA1069TW

  • 制造商

    PHILIPS

  • 制造商全称

    NXP Semiconductors

  • 功能描述

    LIN fail-safe system basis chip

更新时间:2024-5-26 22:30:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
NXP/恩智浦
2020+
NA
80000
只做自己库存,全新原装进口正品假一赔百,可开13%增
NXP
22+23+
TSSOP
20270
绝对原装正品全新进口深圳现货
NXP-恩智浦
24+25+/26+27+
TSSOP-24
9328
一一有问必回一特殊渠道一有长期订货一备货HK仓库
NXP
22+
HTSSOP24
5000
全新原装现货!价格优惠!可长期
NXP
1701+
?
8600
只做原装进口,假一罚十
NXP/恩智浦
2021+
TSSOP24
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
NXP/恩智浦
22+
TSSOP32
18000
原装现货原盒原包.假一罚十
恩智浦/飞思卡尔
22+
NA
500000
万三科技,秉承原装,购芯无忧
NXPUSAInc.
2019+
24-HTSSOP
65500
原装正品货到付款,价格优势!
NXP
2020+
4500
百分百原装正品 真实公司现货库存 本公司只做原装 可

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