High-speed CAN fail-safe system basis chip

高速CAN故障安全系统基础芯片

封装/外壳：32-TSSOP（0.240"，6.10mm 宽）裸露焊盘 包装：卷带（TR） 描述：IC INTFACE SPECIALIZED 32HTSSOP 集成电路（IC） 专用

封装/外壳：32-TSSOP（0.240"，6.10mm 宽）裸露焊盘 包装：卷带（TR） 描述：IC INTFACE SPECIALIZED 32HTSSOP 集成电路（IC） 专用

Heyco® Liquid Tight Strain Relief Bushings

The Ultimate in Snap-In Strain Relief Protection Snap-in, Low Profile Design allows for Pre-assembled Cables • These low profile co-molded nylon and elastomer parts function as a Liquid Tight Strain Relief with a cable. • cULus approved under UL 514B. • Low profile design: height above pan

Inst, 12 Pr #18 Str BC, PVC-NYL Ins E1, OS, Blk PVC Jkt, 600V TC-ER 150V NPLF 90C Dry 75C Wet

Product Description UL Instrumentation, 12 Pair 18AWG (7x26) Bare Copper, PVC-NYL Insulation E1 Color Code, Overall Beldfoil® Shield, Black PVC Outer Jacket, 600V TC-ER 150V NPLF 90C Dry 75C Wet SUN RES DIR BUR

IEC Appliance Inlet C18 with Fuseholder 1- or 2-pole

文件：371.09 Kbytes Page：3 Pages

IEC Appliance Inlet C18 with Fuseholder 1- or 2-pole

文件：371.09 Kbytes Page：3 Pages

10 TO 1000 MHz TO-8 CASCADABLE AMPLIFIERS

文件：161.54 Kbytes Page：2 Pages